JP3925041B2 - 研磨パッド用組成物及びこれを用いた研磨パッド - Google Patents

研磨パッド用組成物及びこれを用いた研磨パッド Download PDF

Info

Publication number
JP3925041B2
JP3925041B2 JP2000161520A JP2000161520A JP3925041B2 JP 3925041 B2 JP3925041 B2 JP 3925041B2 JP 2000161520 A JP2000161520 A JP 2000161520A JP 2000161520 A JP2000161520 A JP 2000161520A JP 3925041 B2 JP3925041 B2 JP 3925041B2
Authority
JP
Japan
Prior art keywords
water
polishing pad
polishing
soluble particles
matrix material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000161520A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001334455A (ja
JP2001334455A5 (https=
Inventor
俊博 小川
亨 長谷川
信夫 川橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2000161520A priority Critical patent/JP3925041B2/ja
Application filed by JSR Corp filed Critical JSR Corp
Priority to DE60132399T priority patent/DE60132399T2/de
Priority to TW093131164A priority patent/TWI290576B/zh
Priority to TW090113083A priority patent/TWI290575B/zh
Priority to EP01113173A priority patent/EP1164559B1/en
Priority to KR1020010029902A priority patent/KR100792102B1/ko
Priority to US09/867,541 priority patent/US6790883B2/en
Publication of JP2001334455A publication Critical patent/JP2001334455A/ja
Priority to US10/868,353 priority patent/US7077879B2/en
Publication of JP2001334455A5 publication Critical patent/JP2001334455A5/ja
Application granted granted Critical
Publication of JP3925041B2 publication Critical patent/JP3925041B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/26—Crosslinking, e.g. vulcanising, of macromolecules of latex
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2309/00—Characterised by the use of homopolymers or copolymers of conjugated diene hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L3/00—Compositions of starch, amylose or amylopectin or of their derivatives or degradation products
    • C08L3/02—Starch; Degradation products thereof, e.g. dextrin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2000161520A 2000-05-31 2000-05-31 研磨パッド用組成物及びこれを用いた研磨パッド Expired - Lifetime JP3925041B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2000161520A JP3925041B2 (ja) 2000-05-31 2000-05-31 研磨パッド用組成物及びこれを用いた研磨パッド
TW093131164A TWI290576B (en) 2000-05-31 2001-05-30 Composition for polishing pad and polishing pad using the same
TW090113083A TWI290575B (en) 2000-05-31 2001-05-30 Composition for polishing pad and polishing pad using the same
EP01113173A EP1164559B1 (en) 2000-05-31 2001-05-30 Composition for polishing pad and polishing pad using the same
DE60132399T DE60132399T2 (de) 2000-05-31 2001-05-30 Zusammensetzung für Polierkissen und Polierkissen das diese Zusammensetzung verwendet
KR1020010029902A KR100792102B1 (ko) 2000-05-31 2001-05-30 연마 패드용 조성물 및 이를 이용한 연마 패드
US09/867,541 US6790883B2 (en) 2000-05-31 2001-05-31 Composition for polishing pad and polishing pad using the same
US10/868,353 US7077879B2 (en) 2000-05-31 2004-06-16 Composition for polishing pad and polishing pad using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000161520A JP3925041B2 (ja) 2000-05-31 2000-05-31 研磨パッド用組成物及びこれを用いた研磨パッド

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006296711A Division JP4379462B2 (ja) 2006-10-31 2006-10-31 研磨パッド用組成物及びこれを用いた研磨パッド

Publications (3)

Publication Number Publication Date
JP2001334455A JP2001334455A (ja) 2001-12-04
JP2001334455A5 JP2001334455A5 (https=) 2004-12-16
JP3925041B2 true JP3925041B2 (ja) 2007-06-06

Family

ID=18665534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000161520A Expired - Lifetime JP3925041B2 (ja) 2000-05-31 2000-05-31 研磨パッド用組成物及びこれを用いた研磨パッド

Country Status (6)

Country Link
US (2) US6790883B2 (https=)
EP (1) EP1164559B1 (https=)
JP (1) JP3925041B2 (https=)
KR (1) KR100792102B1 (https=)
DE (1) DE60132399T2 (https=)
TW (2) TWI290576B (https=)

Families Citing this family (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
JP3826702B2 (ja) * 2000-10-24 2006-09-27 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
CN100496896C (zh) * 2000-12-01 2009-06-10 东洋橡膠工业株式会社 研磨垫
KR100429691B1 (ko) * 2001-06-13 2004-05-03 동성에이앤티 주식회사 미세기공 함유 연마패드 및 그 제조방법
US7097549B2 (en) * 2001-12-20 2006-08-29 Ppg Industries Ohio, Inc. Polishing pad
US20040171339A1 (en) * 2002-10-28 2004-09-02 Cabot Microelectronics Corporation Microporous polishing pads
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US20040014413A1 (en) * 2002-06-03 2004-01-22 Jsr Corporation Polishing pad and multi-layer polishing pad
US6641630B1 (en) 2002-06-06 2003-11-04 Cabot Microelectronics Corp. CMP compositions containing iodine and an iodine vapor-trapping agent
TWI228768B (en) * 2002-08-08 2005-03-01 Jsr Corp Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer
EP1394202A3 (en) * 2002-08-26 2004-03-31 JSR Corporation Composition for polishing pad and polishing pad therewith
KR100495404B1 (ko) * 2002-09-17 2005-06-14 한국포리올 주식회사 임베디드 액상 미소요소를 함유하는 연마 패드 및 그 제조방법
US20040058623A1 (en) * 2002-09-20 2004-03-25 Lam Research Corporation Polishing media for chemical mechanical planarization (CMP)
US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
JP4039214B2 (ja) 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
US20040224622A1 (en) 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
JP4292025B2 (ja) 2003-05-23 2009-07-08 Ｊｓｒ株式会社 研磨パッド
US7442116B2 (en) 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
DE602005006326T2 (de) * 2004-02-05 2009-07-09 Jsr Corp. Chemisch-mechanisches Polierkissen und Polierverfahren
US7988534B1 (en) * 2004-05-19 2011-08-02 Sutton Stephen P Optical polishing pitch formulations
JP2005340271A (ja) * 2004-05-24 2005-12-08 Jsr Corp 化学機械研磨用パッド
US7153191B2 (en) * 2004-08-20 2006-12-26 Micron Technology, Inc. Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
US20060099891A1 (en) * 2004-11-09 2006-05-11 Peter Renteln Method of chemical mechanical polishing, and a pad provided therefore
US20060046064A1 (en) * 2004-08-25 2006-03-02 Dwaine Halberg Method of improving removal rate of pads
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
DE602005007125D1 (de) 2004-09-17 2008-07-10 Jsr Corp Chemisch-mechanisches Polierkissen und chemisch-mechanisches Polierverfahren
JP4475404B2 (ja) 2004-10-14 2010-06-09 Ｊｓｒ株式会社 研磨パッド
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089095A1 (en) 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US8038752B2 (en) * 2004-10-27 2011-10-18 Cabot Microelectronics Corporation Metal ion-containing CMP composition and method for using the same
TW200709892A (en) * 2005-08-18 2007-03-16 Rohm & Haas Elect Mat Transparent polishing pad
TWI378844B (en) * 2005-08-18 2012-12-11 Rohm & Haas Elect Mat Polishing pad and method of manufacture
JP4868840B2 (ja) * 2005-11-30 2012-02-01 Ｊｓｒ株式会社 半導体装置の製造方法
KR100804275B1 (ko) * 2006-07-24 2008-02-18 에스케이씨 주식회사 고분자 쉘로 둘러싸인 액상 유기물 코어를 포함하는 ｃｍｐ연마패드 및 그 제조방법
CN100398579C (zh) * 2006-11-15 2008-07-02 济南大学 一种制备无色甲阶酚醛树脂的方法
JP4798103B2 (ja) * 2007-09-03 2011-10-19 Ｊｓｒ株式会社 研磨パッド
JP2008168431A (ja) * 2008-02-26 2008-07-24 Jsr Corp 研磨パッド
WO2009134775A1 (en) * 2008-04-29 2009-11-05 Semiquest, Inc. Polishing pad composition and method of manufacture and use
JP5314329B2 (ja) * 2008-06-12 2013-10-16 富士フイルム株式会社 研磨液
TWI417169B (zh) * 2009-06-11 2013-12-01 Wei En Chen Cutting tools with the top of the complex cutting
KR101108880B1 (ko) * 2009-10-16 2012-01-30 대상 주식회사 전분계 연마 그릿
US20130217231A1 (en) * 2010-10-05 2013-08-22 Basf Se Chemical mechanical polishing (cmp) composition
WO2012138705A2 (en) * 2011-04-05 2012-10-11 Universal Photonics, Inc. A self-conditioning polishing pad and a method of making the same
US9050697B2 (en) 2012-03-20 2015-06-09 Jh Rhodes Company, Inc. Self-conditioning polishing pad and a method of making the same
US9144880B2 (en) 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
US9233451B2 (en) 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
US9238295B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9238296B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
US20150306731A1 (en) 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US9484212B1 (en) 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10456886B2 (en) 2016-01-19 2019-10-29 Applied Materials, Inc. Porous chemical mechanical polishing pads
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
KR102638363B1 (ko) 2018-12-03 2024-02-19 주식회사 쿠라레 연마층용 폴리우레탄, 연마층 및 연마 패드
CN111320863A (zh) * 2018-12-14 2020-06-23 夏泰鑫半导体(青岛)有限公司 制备研磨垫之组合物
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
KR102509973B1 (ko) * 2021-05-07 2023-03-14 에스케이엔펄스 주식회사 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2701191A (en) * 1949-02-02 1955-02-01 American Optical Corp Polishing pads
JPS61111343A (ja) * 1984-11-06 1986-05-29 Bridgestone Corp 改良されたゴム組成物
JPH03266706A (ja) * 1990-03-15 1991-11-27 Yokohama Rubber Co Ltd:The 空気入りタイヤ
WO1992018567A1 (fr) * 1991-04-19 1992-10-29 Kabushiki Kaisha Asahi Composition a base de caoutchouc ayant la capacite de se decomposer dans la terre et article utilisant cette composition pour agreger la terre en pot
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US6245861B1 (en) * 1997-09-10 2001-06-12 Hercules Incorporated Use of peroxides to crosslink rubber compositions containing high vinyl styrene-butadiene rubber
JP3668046B2 (ja) * 1998-05-11 2005-07-06 株式会社東芝 研磨布及びこの研磨布を用いた半導体装置の製造方法
JP3918359B2 (ja) * 1998-05-15 2007-05-23 Ｊｓｒ株式会社 研磨パッド用重合体組成物および研磨パッド
US6080221A (en) * 1999-09-17 2000-06-27 Agri-Nutrients Technology Group, Inc. Vacuum coated particulate fertilizers
JP3826702B2 (ja) * 2000-10-24 2006-09-27 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
KR100858392B1 (ko) * 2001-04-25 2008-09-11 제이에스알 가부시끼가이샤 반도체 웨이퍼용 연마 패드와, 이를 구비한 반도체웨이퍼용 연마 적층체와, 반도체 웨이퍼의 연마 방법

Also Published As

Publication number Publication date
TW200528529A (en) 2005-09-01
US6790883B2 (en) 2004-09-14
US7077879B2 (en) 2006-07-18
KR20010109154A (ko) 2001-12-08
TWI290576B (en) 2007-12-01
DE60132399T2 (de) 2009-01-15
TWI290575B (en) 2007-12-01
JP2001334455A (ja) 2001-12-04
KR100792102B1 (ko) 2008-01-04
EP1164559A1 (en) 2001-12-19
EP1164559B1 (en) 2008-01-16
US20020010232A1 (en) 2002-01-24
DE60132399D1 (de) 2008-03-06
US20040244299A1 (en) 2004-12-09

Similar Documents

Publication Publication Date Title
JP3925041B2 (ja) 研磨パッド用組成物及びこれを用いた研磨パッド
JP3826702B2 (ja) 研磨パッド用組成物及びこれを用いた研磨パッド
EP1418021B1 (en) Polishing pad
JP2001334455A5 (https=)
JP3880028B2 (ja) 研磨パッド用重合体組成物及びそれを用いた研磨パッド
KR20060046093A (ko) 화학 기계 연마 패드 및 화학 기계 연마 방법
JP2003100682A (ja) 半導体ウエハ用研磨パッド
JP2000034416A (ja) 重合体組成物および研磨パッド
KR20060048061A (ko) 화학 기계 연마용 패드
JP2002324769A (ja) 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
JP4438213B2 (ja) 研磨パッド用組成物及びそれを用いた研磨パッド
JP4292025B2 (ja) 研磨パッド
JP4379462B2 (ja) 研磨パッド用組成物及びこれを用いた研磨パッド
JP3849582B2 (ja) 研磨パッド及び複層型研磨パッド
JP4645825B2 (ja) 化学機械研磨パッド及び化学機械研磨方法
JP2004034175A (ja) 研磨パッド及び複層型研磨パッド
JP4798103B2 (ja) 研磨パッド
JP2004034176A (ja) 研磨パッド
JP2008168431A (ja) 研磨パッド

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040114

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060131

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060315

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20060906

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061031

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20061115

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070206

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070219

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 3925041

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100309

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100309

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110309

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110309

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120309

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120309

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120309

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130309

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130309

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140309

Year of fee payment: 7

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term