JP2002076607A - 微粒子の転写・配置方法、微粒子配置フィルム、導電接続フィルム、及び、導電接続構造体 - Google Patents
微粒子の転写・配置方法、微粒子配置フィルム、導電接続フィルム、及び、導電接続構造体Info
- Publication number
- JP2002076607A JP2002076607A JP2000255935A JP2000255935A JP2002076607A JP 2002076607 A JP2002076607 A JP 2002076607A JP 2000255935 A JP2000255935 A JP 2000255935A JP 2000255935 A JP2000255935 A JP 2000255935A JP 2002076607 A JP2002076607 A JP 2002076607A
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- Prior art keywords
- fine particles
- film
- transferring
- less
- arranging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000255935A JP2002076607A (ja) | 2000-08-25 | 2000-08-25 | 微粒子の転写・配置方法、微粒子配置フィルム、導電接続フィルム、及び、導電接続構造体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000255935A JP2002076607A (ja) | 2000-08-25 | 2000-08-25 | 微粒子の転写・配置方法、微粒子配置フィルム、導電接続フィルム、及び、導電接続構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002076607A true JP2002076607A (ja) | 2002-03-15 |
| JP2002076607A5 JP2002076607A5 (enrdf_load_stackoverflow) | 2007-06-07 |
Family
ID=18744631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000255935A Pending JP2002076607A (ja) | 2000-08-25 | 2000-08-25 | 微粒子の転写・配置方法、微粒子配置フィルム、導電接続フィルム、及び、導電接続構造体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002076607A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007048687A (ja) * | 2005-08-12 | 2007-02-22 | Asahi Kasei Electronics Co Ltd | 導電性粒子転写シート及び接続構造体 |
| WO2007123003A1 (ja) * | 2006-04-12 | 2007-11-01 | Hitachi Chemical Company, Ltd. | 回路接続用接着フィルム、回路部材の接続構造及び回路部材の接続方法 |
| JP2015072364A (ja) * | 2013-10-03 | 2015-04-16 | 株式会社日本触媒 | 球状ギャップ剤 |
| JP2018163347A (ja) * | 2018-04-09 | 2018-10-18 | 株式会社日本触媒 | 球状ギャップ剤 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08255812A (ja) * | 1995-03-16 | 1996-10-01 | Futaba Corp | 電子部品の実装方法及び電子部品の実装装置 |
| JP2000133050A (ja) * | 1998-10-27 | 2000-05-12 | Sekisui Chem Co Ltd | 異方性導電膜及び導電接続構造体 |
-
2000
- 2000-08-25 JP JP2000255935A patent/JP2002076607A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08255812A (ja) * | 1995-03-16 | 1996-10-01 | Futaba Corp | 電子部品の実装方法及び電子部品の実装装置 |
| JP2000133050A (ja) * | 1998-10-27 | 2000-05-12 | Sekisui Chem Co Ltd | 異方性導電膜及び導電接続構造体 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007048687A (ja) * | 2005-08-12 | 2007-02-22 | Asahi Kasei Electronics Co Ltd | 導電性粒子転写シート及び接続構造体 |
| WO2007123003A1 (ja) * | 2006-04-12 | 2007-11-01 | Hitachi Chemical Company, Ltd. | 回路接続用接着フィルム、回路部材の接続構造及び回路部材の接続方法 |
| JPWO2007123003A1 (ja) * | 2006-04-12 | 2009-09-03 | 日立化成工業株式会社 | 回路接続用接着フィルム、回路部材の接続構造及び回路部材の接続方法 |
| JP4775377B2 (ja) * | 2006-04-12 | 2011-09-21 | 日立化成工業株式会社 | 回路接続用接着フィルム、回路部材の接続構造及び回路部材の接続方法 |
| JP2015072364A (ja) * | 2013-10-03 | 2015-04-16 | 株式会社日本触媒 | 球状ギャップ剤 |
| JP2018163347A (ja) * | 2018-04-09 | 2018-10-18 | 株式会社日本触媒 | 球状ギャップ剤 |
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