JP2002044527A5 - - Google Patents
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- JP2002044527A5 JP2002044527A5 JP2001186131A JP2001186131A JP2002044527A5 JP 2002044527 A5 JP2002044527 A5 JP 2002044527A5 JP 2001186131 A JP2001186131 A JP 2001186131A JP 2001186131 A JP2001186131 A JP 2001186131A JP 2002044527 A5 JP2002044527 A5 JP 2002044527A5
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- Japan
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US603113 | 1996-02-20 | ||
| US09/603,113 US6809769B1 (en) | 2000-06-22 | 2000-06-22 | Designs of digital pixel sensors |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002044527A JP2002044527A (ja) | 2002-02-08 |
| JP2002044527A5 true JP2002044527A5 (enExample) | 2008-07-24 |
| JP4686060B2 JP4686060B2 (ja) | 2011-05-18 |
Family
ID=24414148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001186131A Expired - Lifetime JP4686060B2 (ja) | 2000-06-22 | 2001-06-20 | ディジタル画素センサの改善された設計 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6809769B1 (enExample) |
| EP (1) | EP1168450A3 (enExample) |
| JP (1) | JP4686060B2 (enExample) |
| KR (1) | KR100801181B1 (enExample) |
| CN (1) | CN1336754A (enExample) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6963370B2 (en) * | 2001-09-24 | 2005-11-08 | The Board Of Trustees Of The Leland Stanford Junior University | Method for improving SNR in low illumination conditions in a CMOS video sensor system using a self-resetting digital pixel |
| JP4236152B2 (ja) * | 2002-07-29 | 2009-03-11 | 富士フイルム株式会社 | 固体撮像素子 |
| TW580828B (en) * | 2002-09-16 | 2004-03-21 | Pixart Imaging Inc | Signal readout circuit having on-sensor-chip two-dimensional interpolation |
| JP4414646B2 (ja) * | 2002-11-18 | 2010-02-10 | 浜松ホトニクス株式会社 | 光検出装置 |
| US7304673B2 (en) * | 2003-10-22 | 2007-12-04 | Eastman Kodak Company | Image sensor array with substitutional circuit distribution |
| US7460165B2 (en) * | 2004-01-09 | 2008-12-02 | Aptina Imaging Corporation | Photo-array layout for monitoring image statistics |
| CN1910902A (zh) * | 2004-01-12 | 2007-02-07 | 皇家飞利浦电子股份有限公司 | 半导体基图像传感器 |
| JP4403396B2 (ja) * | 2004-07-13 | 2010-01-27 | ソニー株式会社 | 撮像装置及び撮像素子の集積回路 |
| US7894174B2 (en) * | 2004-08-23 | 2011-02-22 | Monolithic Power Systems, Inc. | Method and apparatus for fault detection scheme for cold cathode fluorescent lamp (CCFL) integrated circuits |
| JP4744828B2 (ja) * | 2004-08-26 | 2011-08-10 | 浜松ホトニクス株式会社 | 光検出装置 |
| JP4277216B2 (ja) * | 2005-01-13 | 2009-06-10 | ソニー株式会社 | 撮像装置及び撮像結果の処理方法 |
| US8049293B2 (en) | 2005-03-07 | 2011-11-01 | Sony Corporation | Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device |
| JP4232755B2 (ja) * | 2005-04-05 | 2009-03-04 | 株式会社デンソー | イメージセンサ及びイメージセンサの制御方法 |
| TWI429066B (zh) * | 2005-06-02 | 2014-03-01 | 新力股份有限公司 | Semiconductor image sensor module and manufacturing method thereof |
| JP2007228460A (ja) * | 2006-02-27 | 2007-09-06 | Mitsumasa Koyanagi | 集積センサを搭載した積層型半導体装置 |
| WO2008153831A2 (en) * | 2007-06-06 | 2008-12-18 | Luna Innovations Incorporated | Method and apparatus for acoustically enhanced removal of bubbles from a fluid |
| CN101453818B (zh) | 2007-11-29 | 2014-03-19 | 杭州茂力半导体技术有限公司 | 放电灯的电路保护和调节装置 |
| US7781716B2 (en) * | 2008-03-17 | 2010-08-24 | Eastman Kodak Company | Stacked image sensor with shared diffusion regions in respective dropped pixel positions of a pixel array |
| JP5521721B2 (ja) * | 2009-08-28 | 2014-06-18 | ソニー株式会社 | 撮像素子およびカメラシステム |
| JP5685898B2 (ja) * | 2010-01-08 | 2015-03-18 | ソニー株式会社 | 半導体装置、固体撮像装置、およびカメラシステム |
| JP2011204797A (ja) | 2010-03-24 | 2011-10-13 | Sony Corp | 固体撮像装置とその製造方法、及び電子機器 |
| JP5810493B2 (ja) | 2010-09-03 | 2015-11-11 | ソニー株式会社 | 半導体集積回路、電子機器、固体撮像装置、撮像装置 |
| JP5633323B2 (ja) * | 2010-11-11 | 2014-12-03 | ソニー株式会社 | 固体撮像装置及び電子機器 |
| FR2970598B1 (fr) * | 2011-01-17 | 2013-08-16 | Commissariat Energie Atomique | Dispositif imageur a grande gamme dynamique |
| US8637800B2 (en) * | 2011-04-19 | 2014-01-28 | Altasens, Inc. | Image sensor with hybrid heterostructure |
| US8749686B2 (en) | 2011-04-29 | 2014-06-10 | Truesense Imaging, Inc. | CCD image sensors and methods |
| US8890047B2 (en) | 2011-09-21 | 2014-11-18 | Aptina Imaging Corporation | Stacked-chip imaging systems |
| US9013615B2 (en) | 2011-09-21 | 2015-04-21 | Semiconductor Components Industries, Llc | Image sensor with flexible interconnect capabilities |
| WO2013110022A1 (en) * | 2012-01-20 | 2013-07-25 | Rjs Technology, Inc. | System and method for a high dynamic range array of sensitive image sensor blocks |
| US9185307B2 (en) * | 2012-02-21 | 2015-11-10 | Semiconductor Components Industries, Llc | Detecting transient signals using stacked-chip imaging systems |
| WO2013164915A1 (ja) * | 2012-05-02 | 2013-11-07 | 株式会社ニコン | 撮像装置 |
| US9343497B2 (en) * | 2012-09-20 | 2016-05-17 | Semiconductor Components Industries, Llc | Imagers with stacked integrated circuit dies |
| JP6413235B2 (ja) * | 2013-12-06 | 2018-10-31 | 株式会社ニコン | 撮像素子および撮像装置 |
| WO2015133350A1 (ja) * | 2014-03-01 | 2015-09-11 | 江藤 剛治 | 撮像素子、撮影装置、及び計測装置 |
| CN104502946B (zh) * | 2014-12-16 | 2017-06-13 | 华中师范大学 | 基于cmos芯片的射线探测装置及探测方法 |
| JP6065046B2 (ja) * | 2015-04-20 | 2017-01-25 | ソニー株式会社 | 半導体集積回路、電子機器、固体撮像装置、撮像装置 |
| RU2603333C1 (ru) * | 2015-05-14 | 2016-11-27 | Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский технологический университет "МИСиС" | Гибридный пиксельный фотоприемник - детектор излучений, конструкция и способ изготовления |
| EP3444843B8 (en) * | 2017-08-14 | 2021-03-24 | ams International AG | Assembly for detecting electromagnetic radiation and method of producing an assembly for detecting electromagnetic radiation |
| US10692179B2 (en) * | 2017-11-17 | 2020-06-23 | Semiconductor Components Industries, Llc | Methods and apparatus for signal distribution in an image sensor |
| JP7242194B2 (ja) * | 2018-04-27 | 2023-03-20 | キヤノン電子株式会社 | 原稿搬送装置 |
| US11025848B2 (en) * | 2018-08-31 | 2021-06-01 | Canon Kabushiki Kaisha | Photoelectric conversion device, imaging system, moving body, and stackable semiconductor device |
| KR102587895B1 (ko) * | 2018-09-13 | 2023-10-12 | 삼성전자주식회사 | 픽셀 어레이와 메모리 셀 어레이가 병합된 이미지 센서 및 이를 포함하는 전자 장치 |
| JP7055727B2 (ja) * | 2018-09-20 | 2022-04-18 | 株式会社ニコン | 撮像素子およびカメラ |
| KR102759366B1 (ko) | 2019-06-14 | 2025-01-24 | 삼성전자주식회사 | Cis, 및 그 cis에서 픽셀별 ae 방법 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63193678A (ja) * | 1987-02-05 | 1988-08-10 | Fujitsu Ltd | 二次元固体撮像装置 |
| CA2095366C (en) * | 1992-05-21 | 1999-09-14 | Timothy C. Collins | Hybridized semiconductor pixel detector arrays for use in digital radiography |
| US5336879A (en) | 1993-05-28 | 1994-08-09 | David Sarnoff Research Center, Inc. | Pixel array having image forming pixel elements integral with peripheral circuit elements |
| US5751049A (en) * | 1993-08-16 | 1998-05-12 | Texas Instruments Incorporated | Two-color infrared detector |
| JPH07192663A (ja) * | 1993-12-27 | 1995-07-28 | Hitachi Ltd | 撮像装置 |
| US5461425A (en) * | 1994-02-15 | 1995-10-24 | Stanford University | CMOS image sensor with pixel level A/D conversion |
| JP3579455B2 (ja) * | 1994-05-06 | 2004-10-20 | ペンタックス株式会社 | 画像入力装置 |
| GB2289983B (en) * | 1994-06-01 | 1996-10-16 | Simage Oy | Imaging devices,systems and methods |
| JPH07335694A (ja) * | 1994-06-15 | 1995-12-22 | Shimadzu Corp | 電子デバイス |
| US5529197A (en) | 1994-12-20 | 1996-06-25 | Siemens Aktiengesellschaft | Polysilicon/polycide etch process for sub-micron gate stacks |
| US5734156A (en) | 1994-12-22 | 1998-03-31 | Santa Barbara Research Center | Optical device assembly and its preparation using metallic bump bonding and a stand-off for bonding together two planar optical components |
| US5665959A (en) * | 1995-01-13 | 1997-09-09 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Adminstration | Solid-state image sensor with focal-plane digital photon-counting pixel array |
| WO1996038980A1 (en) * | 1995-05-31 | 1996-12-05 | Sony Corporation | Image pickup device, method of manufacturing the device, image pickup adapter, signal processor, signal processing method, information processor, and information processing method |
| US5610404A (en) * | 1995-09-05 | 1997-03-11 | General Electric Company | Flat panel imaging device with ground plane electrode |
| US5781233A (en) * | 1996-03-14 | 1998-07-14 | Tritech Microelectronics, Ltd. | MOS FET camera chip and methods of manufacture and operation thereof |
| US5721429A (en) | 1996-07-23 | 1998-02-24 | Hughes Electronics | Self-focusing detector pixel structure having improved sensitivity |
| GB2319394B (en) * | 1996-12-27 | 1998-10-28 | Simage Oy | Bump-bonded semiconductor imaging device |
| US6452632B1 (en) * | 1997-01-31 | 2002-09-17 | Kabushiki Kaisha Toshiba | Solid state image sensor and video system using the same |
| US5904495A (en) | 1997-06-11 | 1999-05-18 | Massachusetts Institute Of Technology | Interconnection technique for hybrid integrated devices |
| US5986693A (en) * | 1997-10-06 | 1999-11-16 | Adair; Edwin L. | Reduced area imaging devices incorporated within surgical instruments |
| US6721008B2 (en) * | 1998-01-22 | 2004-04-13 | Eastman Kodak Company | Integrated CMOS active pixel digital camera |
| US6466265B1 (en) * | 1998-06-22 | 2002-10-15 | Eastman Kodak Company | Parallel output architectures for CMOS active pixel sensors |
| JP3854729B2 (ja) * | 1998-09-02 | 2006-12-06 | キヤノン株式会社 | 撮像装置およびそれを用いた撮像システム |
-
2000
- 2000-06-22 US US09/603,113 patent/US6809769B1/en not_active Expired - Lifetime
-
2001
- 2001-05-18 EP EP01304421A patent/EP1168450A3/en not_active Withdrawn
- 2001-06-20 JP JP2001186131A patent/JP4686060B2/ja not_active Expired - Lifetime
- 2001-06-21 CN CN 01129500 patent/CN1336754A/zh active Pending
- 2001-06-22 KR KR1020010035678A patent/KR100801181B1/ko not_active Expired - Lifetime