JP2002026419A - 磁電変換装置 - Google Patents

磁電変換装置

Info

Publication number
JP2002026419A
JP2002026419A JP2000206403A JP2000206403A JP2002026419A JP 2002026419 A JP2002026419 A JP 2002026419A JP 2000206403 A JP2000206403 A JP 2000206403A JP 2000206403 A JP2000206403 A JP 2000206403A JP 2002026419 A JP2002026419 A JP 2002026419A
Authority
JP
Japan
Prior art keywords
support plate
magnetic
hall element
semiconductor
magnetic layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000206403A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002026419A5 (enExample
Inventor
Hiroichi Goto
博一 後藤
Koji Otsuka
康二 大塚
Takashi Kato
隆志 加藤
Hiromichi Kumakura
弘道 熊倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP2000206403A priority Critical patent/JP2002026419A/ja
Priority to US09/893,937 priority patent/US6545457B2/en
Priority to EP01116341A priority patent/EP1180804A3/en
Publication of JP2002026419A publication Critical patent/JP2002026419A/ja
Publication of JP2002026419A5 publication Critical patent/JP2002026419A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Hall/Mr Elements (AREA)
  • Measuring Magnetic Variables (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
  • Measurement Of Current Or Voltage (AREA)
JP2000206403A 2000-07-07 2000-07-07 磁電変換装置 Pending JP2002026419A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000206403A JP2002026419A (ja) 2000-07-07 2000-07-07 磁電変換装置
US09/893,937 US6545457B2 (en) 2000-07-07 2001-06-29 Current detector utilizing hall effect
EP01116341A EP1180804A3 (en) 2000-07-07 2001-07-05 Hall-effect magnetoelectric converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000206403A JP2002026419A (ja) 2000-07-07 2000-07-07 磁電変換装置

Publications (2)

Publication Number Publication Date
JP2002026419A true JP2002026419A (ja) 2002-01-25
JP2002026419A5 JP2002026419A5 (enExample) 2006-06-15

Family

ID=18703337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000206403A Pending JP2002026419A (ja) 2000-07-07 2000-07-07 磁電変換装置

Country Status (3)

Country Link
US (1) US6545457B2 (enExample)
EP (1) EP1180804A3 (enExample)
JP (1) JP2002026419A (enExample)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2003107018A1 (ja) * 2002-06-18 2005-10-13 旭化成エレクトロニクス株式会社 電流測定方法および電流測定装置
US7476816B2 (en) 2003-08-26 2009-01-13 Allegro Microsystems, Inc. Current sensor
US7598601B2 (en) 2003-08-26 2009-10-06 Allegro Microsystems, Inc. Current sensor
US8080994B2 (en) 2006-05-12 2011-12-20 Allegro Microsystems, Inc. Integrated current sensor
US8093670B2 (en) 2008-07-24 2012-01-10 Allegro Microsystems, Inc. Methods and apparatus for integrated circuit having on chip capacitor with eddy current reductions
US8629539B2 (en) 2012-01-16 2014-01-14 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having non-conductive die paddle
US9190606B2 (en) 2013-03-15 2015-11-17 Allegro Micosystems, LLC Packaging for an electronic device
US9411025B2 (en) 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet
US9494660B2 (en) 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US9666788B2 (en) 2012-03-20 2017-05-30 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US9685412B2 (en) 2013-09-04 2017-06-20 Kabushiki Kaisha Toshiba Semiconductor apparatus and manufacturing method for same
US9812588B2 (en) 2012-03-20 2017-11-07 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US10234513B2 (en) 2012-03-20 2019-03-19 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US10345343B2 (en) 2013-03-15 2019-07-09 Allegro Microsystems, Llc Current sensor isolation
US10991644B2 (en) 2019-08-22 2021-04-27 Allegro Microsystems, Llc Integrated circuit package having a low profile
CN114144684A (zh) * 2019-08-08 2022-03-04 森斯泰克有限责任公司 用于交变电流的频率补偿测量的基于磁场的电流传感器
US11768230B1 (en) 2022-03-30 2023-09-26 Allegro Microsystems, Llc Current sensor integrated circuit with a dual gauge lead frame
US11800813B2 (en) 2020-05-29 2023-10-24 Allegro Microsystems, Llc High isolation current sensor

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US6794862B2 (en) * 2001-05-08 2004-09-21 Ramot At Tel-Aviv University Ltd. Magnetic thin film sensor based on the extraordinary hall effect
JP3616605B2 (ja) * 2002-04-03 2005-02-02 沖電気工業株式会社 半導体装置
US6781359B2 (en) 2002-09-20 2004-08-24 Allegro Microsystems, Inc. Integrated current sensor
JP2004207477A (ja) * 2002-12-25 2004-07-22 Sanken Electric Co Ltd ホール素子を有する半導体装置
US20040251506A1 (en) * 2003-06-10 2004-12-16 Johnson Mark B. Hall effect devices, memory devices, and hall effect device readout voltage increasing methods
US7709754B2 (en) 2003-08-26 2010-05-04 Allegro Microsystems, Inc. Current sensor
US7476953B2 (en) * 2005-02-04 2009-01-13 Allegro Microsystems, Inc. Integrated sensor having a magnetic flux concentrator
US7988363B2 (en) * 2005-02-22 2011-08-02 Ntn Corporation Bearing with rotation detection device
US7541804B2 (en) * 2005-07-29 2009-06-02 Everspin Technologies, Inc. Magnetic tunnel junction sensor
US7768083B2 (en) 2006-01-20 2010-08-03 Allegro Microsystems, Inc. Arrangements for an integrated sensor
JP4628987B2 (ja) * 2006-04-10 2011-02-09 矢崎総業株式会社 温度検出機能付き電流センサ
EP2006700B1 (en) * 2006-04-13 2015-12-30 Asahi Kasei EMD Corporation Magnetic sensor and method for fabricating the same
US7816772B2 (en) * 2007-03-29 2010-10-19 Allegro Microsystems, Inc. Methods and apparatus for multi-stage molding of integrated circuit package
US9823090B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a target object
US7816905B2 (en) * 2008-06-02 2010-10-19 Allegro Microsystems, Inc. Arrangements for a current sensing circuit and integrated current sensor
US8486755B2 (en) 2008-12-05 2013-07-16 Allegro Microsystems, Llc Magnetic field sensors and methods for fabricating the magnetic field sensors
US20100188078A1 (en) * 2009-01-28 2010-07-29 Andrea Foletto Magnetic sensor with concentrator for increased sensing range
DE102009028956A1 (de) * 2009-08-28 2011-03-03 Robert Bosch Gmbh Magnetfeldsensor
US10215550B2 (en) 2012-05-01 2019-02-26 Allegro Microsystems, Llc Methods and apparatus for magnetic sensors having highly uniform magnetic fields
US9817078B2 (en) 2012-05-10 2017-11-14 Allegro Microsystems Llc Methods and apparatus for magnetic sensor having integrated coil
US10725100B2 (en) 2013-03-15 2020-07-28 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an externally accessible coil
US9810519B2 (en) 2013-07-19 2017-11-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as tooth detectors
US10495699B2 (en) 2013-07-19 2019-12-03 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an integrated coil or magnet to detect a non-ferromagnetic target
US10145908B2 (en) 2013-07-19 2018-12-04 Allegro Microsystems, Llc Method and apparatus for magnetic sensor producing a changing magnetic field
US9823092B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor providing a movement detector
US9720054B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
US10712403B2 (en) 2014-10-31 2020-07-14 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
US9719806B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a ferromagnetic target object
US9741924B2 (en) * 2015-02-26 2017-08-22 Sii Semiconductor Corporation Magnetic sensor having a recessed die pad
JP6663259B2 (ja) * 2016-03-15 2020-03-11 エイブリック株式会社 半導体装置とその製造方法
US10260905B2 (en) 2016-06-08 2019-04-16 Allegro Microsystems, Llc Arrangements for magnetic field sensors to cancel offset variations
US10041810B2 (en) 2016-06-08 2018-08-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as movement detectors
US10012518B2 (en) 2016-06-08 2018-07-03 Allegro Microsystems, Llc Magnetic field sensor for sensing a proximity of an object
US10837943B2 (en) 2017-05-26 2020-11-17 Allegro Microsystems, Llc Magnetic field sensor with error calculation
US10310028B2 (en) 2017-05-26 2019-06-04 Allegro Microsystems, Llc Coil actuated pressure sensor
US11428755B2 (en) 2017-05-26 2022-08-30 Allegro Microsystems, Llc Coil actuated sensor with sensitivity detection
US10324141B2 (en) 2017-05-26 2019-06-18 Allegro Microsystems, Llc Packages for coil actuated position sensors
US10641842B2 (en) 2017-05-26 2020-05-05 Allegro Microsystems, Llc Targets for coil actuated position sensors
US10996289B2 (en) 2017-05-26 2021-05-04 Allegro Microsystems, Llc Coil actuated position sensor with reflected magnetic field
US10866117B2 (en) 2018-03-01 2020-12-15 Allegro Microsystems, Llc Magnetic field influence during rotation movement of magnetic target
US11255700B2 (en) 2018-08-06 2022-02-22 Allegro Microsystems, Llc Magnetic field sensor
US10921391B2 (en) 2018-08-06 2021-02-16 Allegro Microsystems, Llc Magnetic field sensor with spacer
US10935612B2 (en) 2018-08-20 2021-03-02 Allegro Microsystems, Llc Current sensor having multiple sensitivity ranges
US10823586B2 (en) 2018-12-26 2020-11-03 Allegro Microsystems, Llc Magnetic field sensor having unequally spaced magnetic field sensing elements
US11061084B2 (en) 2019-03-07 2021-07-13 Allegro Microsystems, Llc Coil actuated pressure sensor and deflectable substrate
US11035910B2 (en) * 2019-03-29 2021-06-15 Ablic Inc. Magnetic substance detection sensor
US10955306B2 (en) 2019-04-22 2021-03-23 Allegro Microsystems, Llc Coil actuated pressure sensor and deformable substrate
US11237020B2 (en) 2019-11-14 2022-02-01 Allegro Microsystems, Llc Magnetic field sensor having two rows of magnetic field sensing elements for measuring an angle of rotation of a magnet
US11280637B2 (en) 2019-11-14 2022-03-22 Allegro Microsystems, Llc High performance magnetic angle sensor
US11262422B2 (en) 2020-05-08 2022-03-01 Allegro Microsystems, Llc Stray-field-immune coil-activated position sensor
US11320466B1 (en) 2020-10-29 2022-05-03 Allegro Microsystems, Llc Differential current sensor
US11493361B2 (en) 2021-02-26 2022-11-08 Allegro Microsystems, Llc Stray field immune coil-activated sensor
US11402409B1 (en) 2021-03-22 2022-08-02 Allegro Microsystems, Llc Differential current sensor package
US11567108B2 (en) 2021-03-31 2023-01-31 Allegro Microsystems, Llc Multi-gain channels for multi-range sensor
US11578997B1 (en) 2021-08-24 2023-02-14 Allegro Microsystems, Llc Angle sensor using eddy currents
US11994541B2 (en) 2022-04-15 2024-05-28 Allegro Microsystems, Llc Current sensor assemblies for low currents

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JPS6079281A (ja) * 1983-10-06 1985-05-07 Toshiba Corp 磁気センサ
JPS62260374A (ja) * 1986-05-06 1987-11-12 Toshiba Corp 集磁効果型ホ−ル素子とその製造方法
JPH02307067A (ja) * 1989-05-22 1990-12-20 Asahi Kasei Denshi Kk 磁気センサユニット
JPH04106988A (ja) * 1990-08-27 1992-04-08 Asahi Chem Ind Co Ltd ＩｎＡｓホール素子
JPH06216307A (ja) * 1993-01-13 1994-08-05 Mitsubishi Electric Corp 樹脂封止型半導体装置
JP3010974U (ja) * 1994-11-09 1995-05-09 旭化成電子株式会社 磁電変換素子
JPH0732973U (ja) * 1993-11-30 1995-06-16 昭和電工株式会社 ホール素子
JPH11248808A (ja) * 1998-03-05 1999-09-17 Hitachi Cable Ltd 磁気センサ及びその製造方法

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JPS6079281A (ja) * 1983-10-06 1985-05-07 Toshiba Corp 磁気センサ
JPS62260374A (ja) * 1986-05-06 1987-11-12 Toshiba Corp 集磁効果型ホ−ル素子とその製造方法
JPH02307067A (ja) * 1989-05-22 1990-12-20 Asahi Kasei Denshi Kk 磁気センサユニット
JPH04106988A (ja) * 1990-08-27 1992-04-08 Asahi Chem Ind Co Ltd ＩｎＡｓホール素子
JPH06216307A (ja) * 1993-01-13 1994-08-05 Mitsubishi Electric Corp 樹脂封止型半導体装置
JPH0732973U (ja) * 1993-11-30 1995-06-16 昭和電工株式会社 ホール素子
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JPH11248808A (ja) * 1998-03-05 1999-09-17 Hitachi Cable Ltd 磁気センサ及びその製造方法

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4575153B2 (ja) * 2002-06-18 2010-11-04 旭化成エレクトロニクス株式会社 電流測定方法および電流測定装置
JPWO2003107018A1 (ja) * 2002-06-18 2005-10-13 旭化成エレクトロニクス株式会社 電流測定方法および電流測定装置
US7476816B2 (en) 2003-08-26 2009-01-13 Allegro Microsystems, Inc. Current sensor
US7598601B2 (en) 2003-08-26 2009-10-06 Allegro Microsystems, Inc. Current sensor
US8080994B2 (en) 2006-05-12 2011-12-20 Allegro Microsystems, Inc. Integrated current sensor
US8093670B2 (en) 2008-07-24 2012-01-10 Allegro Microsystems, Inc. Methods and apparatus for integrated circuit having on chip capacitor with eddy current reductions
US9620705B2 (en) 2012-01-16 2017-04-11 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having non-conductive die paddle
US8629539B2 (en) 2012-01-16 2014-01-14 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having non-conductive die paddle
US9299915B2 (en) 2012-01-16 2016-03-29 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having non-conductive die paddle
US10333055B2 (en) 2012-01-16 2019-06-25 Allegro Microsystems, Llc Methods for magnetic sensor having non-conductive die paddle
US10916665B2 (en) 2012-03-20 2021-02-09 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with an integrated coil
US11677032B2 (en) 2012-03-20 2023-06-13 Allegro Microsystems, Llc Sensor integrated circuit with integrated coil and element in central region of mold material
US9666788B2 (en) 2012-03-20 2017-05-30 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US11961920B2 (en) 2012-03-20 2024-04-16 Allegro Microsystems, Llc Integrated circuit package with magnet having a channel
US9812588B2 (en) 2012-03-20 2017-11-07 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US11828819B2 (en) 2012-03-20 2023-11-28 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US10230006B2 (en) 2012-03-20 2019-03-12 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with an electromagnetic suppressor
US10234513B2 (en) 2012-03-20 2019-03-19 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US9494660B2 (en) 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US11444209B2 (en) 2012-03-20 2022-09-13 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with an integrated coil enclosed with a semiconductor die by a mold material
US10753963B2 (en) 2013-03-15 2020-08-25 Allegro Microsystems, Llc Current sensor isolation
US9190606B2 (en) 2013-03-15 2015-11-17 Allegro Micosystems, LLC Packaging for an electronic device
US10345343B2 (en) 2013-03-15 2019-07-09 Allegro Microsystems, Llc Current sensor isolation
US9865807B2 (en) 2013-03-15 2018-01-09 Allegro Microsystems, Llc Packaging for an electronic device
US9411025B2 (en) 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet
US9685412B2 (en) 2013-09-04 2017-06-20 Kabushiki Kaisha Toshiba Semiconductor apparatus and manufacturing method for same
CN114144684A (zh) * 2019-08-08 2022-03-04 森斯泰克有限责任公司 用于交变电流的频率补偿测量的基于磁场的电流传感器
JP2022543120A (ja) * 2019-08-08 2022-10-07 ゼンジテック ゲゼルシャフト ミット ベシュレンクテル ハフツング 交流を周波数補償して測定する磁場ベースの電流センサ
US10991644B2 (en) 2019-08-22 2021-04-27 Allegro Microsystems, Llc Integrated circuit package having a low profile
US11800813B2 (en) 2020-05-29 2023-10-24 Allegro Microsystems, Llc High isolation current sensor
US11768230B1 (en) 2022-03-30 2023-09-26 Allegro Microsystems, Llc Current sensor integrated circuit with a dual gauge lead frame

Also Published As

Publication number Publication date
EP1180804A2 (en) 2002-02-20
EP1180804A3 (en) 2003-03-26
US20020011841A1 (en) 2002-01-31
US6545457B2 (en) 2003-04-08

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