JP2001518553A5 - - Google Patents
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- Publication number
- JP2001518553A5 JP2001518553A5 JP2000514171A JP2000514171A JP2001518553A5 JP 2001518553 A5 JP2001518553 A5 JP 2001518553A5 JP 2000514171 A JP2000514171 A JP 2000514171A JP 2000514171 A JP2000514171 A JP 2000514171A JP 2001518553 A5 JP2001518553 A5 JP 2001518553A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- photoresist
- solution
- film
- developer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/939,451 US5928836A (en) | 1997-09-29 | 1997-09-29 | Fractionated novolak resin copolymer and photoresist composition therefrom |
| US08/939,451 | 1997-09-29 | ||
| PCT/EP1998/005878 WO1999017166A1 (en) | 1997-09-29 | 1998-09-16 | Fractionated novolak resin copolymer and photoresist composition therefrom |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001518553A JP2001518553A (ja) | 2001-10-16 |
| JP2001518553A5 true JP2001518553A5 (enExample) | 2006-01-05 |
Family
ID=25473210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000514171A Pending JP2001518553A (ja) | 1997-09-29 | 1998-09-16 | 分別されたノボラック樹脂コポリマー及びこれから得られるフォトレジスト組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5928836A (enExample) |
| EP (1) | EP1023637B1 (enExample) |
| JP (1) | JP2001518553A (enExample) |
| KR (1) | KR20010030763A (enExample) |
| CN (1) | CN1142463C (enExample) |
| DE (1) | DE69817003T2 (enExample) |
| TW (1) | TW486606B (enExample) |
| WO (1) | WO1999017166A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002102867A1 (en) * | 2001-06-20 | 2002-12-27 | The Additional Director (Ipr), Defence Research & Development Organisation | 'high ortho' novolak copolymers and composition thereof |
| CN1802603A (zh) * | 2003-07-17 | 2006-07-12 | 霍尼韦尔国际公司 | 用于高级微电子应用的平面化薄膜及其生产装置和方法 |
| US7303994B2 (en) * | 2004-06-14 | 2007-12-04 | International Business Machines Corporation | Process for interfacial adhesion in laminate structures through patterned roughing of a surface |
| PL1842864T3 (pl) * | 2005-01-25 | 2013-12-31 | Hodogaya Chemical Co Ltd | Żywica rezorcynowo-formaldehydowa modyfikowana ketonem |
| KR101308431B1 (ko) * | 2006-04-26 | 2013-09-30 | 엘지디스플레이 주식회사 | 인쇄용 레지스트 및 이를 이용한 패턴형성방법 |
| US7642333B2 (en) * | 2007-05-21 | 2010-01-05 | Georgia-Pacific Chemicals Llc | Anhydride and resorcinol latent catalyst system for improving cure characteristics of phenolic resins |
| JP5825884B2 (ja) * | 2011-07-01 | 2015-12-02 | 旭化成イーマテリアルズ株式会社 | フェノール樹脂組成物、及び硬化レリーフパターンの製造方法 |
| JP6228460B2 (ja) * | 2011-12-09 | 2017-11-08 | 旭化成株式会社 | 感光性樹脂組成物 |
| KR102235159B1 (ko) * | 2014-04-15 | 2021-04-05 | 롬엔드하스전자재료코리아유한회사 | 감광성 수지 조성물, 및 이를 이용한 절연막 및 전자소자 |
| TW201806996A (zh) * | 2016-04-06 | 2018-03-01 | 迪愛生股份有限公司 | 酚醛清漆型樹脂及抗蝕劑材料 |
| TW201806995A (zh) * | 2016-04-06 | 2018-03-01 | 迪愛生股份有限公司 | 酚醛清漆型樹脂之製造方法 |
| JP6828279B2 (ja) * | 2016-06-13 | 2021-02-10 | Dic株式会社 | ノボラック型樹脂及びレジスト膜 |
| JP7095405B2 (ja) * | 2018-05-25 | 2022-07-05 | 住友ベークライト株式会社 | 感光性樹脂組成物用のノボラック型フェノール樹脂 |
| KR20230022064A (ko) * | 2021-08-06 | 2023-02-14 | 코오롱인더스트리 주식회사 | 알킬 페놀 수지의 제조 방법, 알킬 페놀 수지 및 이를 포함하는 고무 조성물 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3070435D1 (en) * | 1979-12-27 | 1985-05-09 | Mitsui Petrochemical Ind | High-molecular-weight novolak substituted phenolic resins and their preparation |
| JPS60260611A (ja) * | 1984-06-08 | 1985-12-23 | Mitsubishi Petrochem Co Ltd | 高分子量クレゾ−ルノボラツク樹脂の製造方法 |
| EP0251187A3 (en) * | 1986-06-27 | 1988-03-30 | Nippon Zeon Co., Ltd. | Method for purifying novolak resins useful as material for coating on a semiconductor substrate |
| US5238776A (en) * | 1986-12-23 | 1993-08-24 | Shipley Company Inc. | Photoresist composition containing block copolymer resin and positive-working o-quinone diazide or negative-working azide sensitizer compound |
| US5266440A (en) * | 1986-12-23 | 1993-11-30 | Shipley Company Inc. | Photoresist composition with aromatic novolak binder having a weight-average molecular weight in excess of 1500 Daltons |
| US5130410A (en) * | 1986-12-23 | 1992-07-14 | Shipley Company Inc. | Alternating and block copolymer resins |
| JP2711590B2 (ja) * | 1990-09-13 | 1998-02-10 | 富士写真フイルム株式会社 | ポジ型フオトレジスト組成物 |
| US5346799A (en) * | 1991-12-23 | 1994-09-13 | Ocg Microelectronic Materials, Inc. | Novolak resins and their use in radiation-sensitive compositions wherein the novolak resins are made by condensing 2,6-dimethylphenol, 2,3-dimethylphenol, a para-substituted phenol and an aldehyde |
| US5476750A (en) * | 1992-12-29 | 1995-12-19 | Hoechst Celanese Corporation | Metal ion reduction in the raw materials and using a Lewis base to control molecular weight of novolak resin to be used in positive photoresists |
| US5750632A (en) * | 1994-12-30 | 1998-05-12 | Clariant Finance (Bvi) Limited | Isolation of novolak resin by low temperature sub surface forced steam distillation |
| US5665517A (en) * | 1996-01-11 | 1997-09-09 | Hoechst Celanese Corporation | Acidic ion exchange resin as a catalyst to synthesize a novolak resin and photoresist composition therefrom |
-
1997
- 1997-09-29 US US08/939,451 patent/US5928836A/en not_active Expired - Fee Related
-
1998
- 1998-09-16 JP JP2000514171A patent/JP2001518553A/ja active Pending
- 1998-09-16 CN CNB988107414A patent/CN1142463C/zh not_active Expired - Fee Related
- 1998-09-16 EP EP98948978A patent/EP1023637B1/en not_active Expired - Lifetime
- 1998-09-16 WO PCT/EP1998/005878 patent/WO1999017166A1/en not_active Ceased
- 1998-09-16 DE DE69817003T patent/DE69817003T2/de not_active Expired - Fee Related
- 1998-09-16 KR KR1020007003321A patent/KR20010030763A/ko not_active Ceased
- 1998-09-23 TW TW087115826A patent/TW486606B/zh not_active IP Right Cessation
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