JP2001512627A - 電気的構造群を製作する装置 - Google Patents
電気的構造群を製作する装置Info
- Publication number
- JP2001512627A JP2001512627A JP53615898A JP53615898A JP2001512627A JP 2001512627 A JP2001512627 A JP 2001512627A JP 53615898 A JP53615898 A JP 53615898A JP 53615898 A JP53615898 A JP 53615898A JP 2001512627 A JP2001512627 A JP 2001512627A
- Authority
- JP
- Japan
- Prior art keywords
- guide
- longitudinal
- track
- chassis
- guides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 238000012545 processing Methods 0.000 claims abstract description 17
- 239000004020 conductor Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims 3
- 230000001427 coherent effect Effects 0.000 claims 1
- 238000003754 machining Methods 0.000 description 7
- 238000013459 approach Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S29/00—Metal working
- Y10S29/044—Vacuum
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53048—Multiple station assembly or disassembly apparatus
- Y10T29/53052—Multiple station assembly or disassembly apparatus including position sensor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. 電気的構造群(1,2)を製作する装置、特に導体板(1)に電気的構造部 品(2)を装着する装置であって、互いにほぼ並行な2つの直線状の縦案内(7 )を、それに沿って走行可能な少なくとも2つの、例えばビーム状の台車(8, 8’)のために備えているシャシ(3)を有しており、これらの台車はそれぞれ 1つの横ビーム(9)を備えており、この横ビームは、縦案内(7)に対して横 方向の横案内を、それに沿って走行可能な、導体板のための加工ヘッド(10) のために有しており、台車(8,8’)は一方の端部範囲を縦案内に沿って案内 されており、両方の横ビーム(9)はそれぞれの縦案内(7)から互いに逆の方 向に突出しており、シャシは、少なくとも1つの加工場所(12,12’)を、 構造群(1,2)の少なくとも1つのために有している形式のものにおいて、両 方の縦案内(7)が互いに直接的に隣接して配置されており、両方の横ビーム( 9)がそれらの縦案内(7)から、それぞれ隣接の縦案内(7)とは逆の方向に 突出しており、少なくとも2つの加工場所(12,12’)が縦案内(7)の両 側に設けられていることを特徴とする、電気的構造群を製作する装置。 2. 両方の縦案内(7)がシャシ(3)の1つの共通 の縦ビーム(4)に構成されていることを特徴とする、請求項1記載の装置。 3. 台車(8,8’)を駆動するために駆動ユニットが設けられており、これら の駆動ユニットは所属の縦案内(7)に配属されていることを特徴とする、請求 項1又は2記載の装置。 4. 構造群搬送装置(13)が、縦案内(7)に対して直角の搬送方向を有して いて、両方の加工場所(12)の世話をやくことを特徴とする、請求項1から3 までのいずれか1項記載の装置。 5. 電気的構造群(1,2)を製作する装置、特に導体板(1)に電気的構造部 品(2)を装着する装置であって、少なくとも1つの直線状の縦案内(7)を、 それに沿って走行可能な少なくとも1つの、例えばビーム状の台車(8,8’) のために備えているシャシ(3)を有している形式のものにおいて、縦案内(7 )に沿って、少なくとも2つの互いに無関係に走行可能な台車(8,8’)が案 内されていることを特徴とする、電気的構造群を製作する装置。 6. 電気的構造群(1,2)を製作する装置、特に導体板(1)に電気的構造部 品(2)を装着する装置で あって、少なくとも1つの直線状の縦案内(7)を、それに沿って走行可能な少 なくとも1つの、例えばビーム状の台車(8,8’)のために備えているシャシ (3)を有している形式のものにおいて、縦案内(7)が、少なくとも1つの支 持軌道(6)と少なくとも1つの案内軌道(5)とを、台車の相応する支持エレ メント及び案内エレメントのために備えており、台車(8,8’)の支持エレメ ント及び案内エレメントは台車(8,8’)の一方の端部に配置されていること を特徴とする、電気的構造群を製作する装置。 7. 台車(8,8’)の他方の端部は片持ち式に突出しているように構成されて いることを特徴とする、請求項6記載の装置。 8. 縦案内(7)の支持軌道(6)及び案内軌道(5)が横断面で見て垂直に上 下に位置するように配置されていて、相応して垂直に延びる案内平面を形成して いることを特徴とする、請求項6又は7記載の装置。 9. 台車(8,8’)の駆動ユニットがリニアモータとして構成されていて、縦 案内(7)に配属されていることを特徴とする、請求項6から8までのいずれか 1項記載の装置。 10.リニアモータ(15,16)が支持軌道(6)と案内軌道(5)との間に配 置されていることを特徴とする、請求項9記載の装置。 11.リニアモータの可動部分(15)と定置の部分(例えば16)との間の分離 ギャップが支持軌道(6)及び案内軌道(5)の範囲内に位置しており、この分 離ギャップ及び縦案内を形成している面は、一貫した共通の分離継ぎ目を形成し ていることを特徴とする、請求項10記載の装置。 12.一貫した定置の部分(例えば16)が、台車(8,8’)の互いに無関係に 操作可能な複数のリニアモータのための共通の定置のエレメントとして設けられ ており、定置の部分(例えば16)がシャシ(3)の縦ビーム(4)と固く結合 されていることを特徴とする、請求項9から11までのいずれか1項記載の装置 。
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19707265 | 1997-02-24 | ||
DE19707265.8 | 1997-02-24 | ||
DE19707267.4 | 1997-02-24 | ||
DE19707267A DE19707267A1 (de) | 1997-02-24 | 1997-02-24 | Vorrichtung zum Herstellen von elektrischen Baugruppen |
DE19707266.6 | 1997-02-24 | ||
US08/805,239 US6568069B1 (en) | 1997-02-24 | 1997-02-24 | Apparatus for manufacture of electrical assemblies |
DE19707266 | 1997-02-24 | ||
PCT/DE1998/000514 WO1998037744A1 (de) | 1997-02-24 | 1998-02-20 | Vorrichtung zum herstellen von elektrischen baugruppen |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006343016A Division JP2007074007A (ja) | 1997-02-24 | 2006-12-20 | 導体板に電気的構造部品を装着する装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2001512627A true JP2001512627A (ja) | 2001-08-21 |
JP2001512627A5 JP2001512627A5 (ja) | 2008-05-15 |
JP4138016B2 JP4138016B2 (ja) | 2008-08-20 |
Family
ID=27670766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53615898A Expired - Lifetime JP4138016B2 (ja) | 1997-02-24 | 1998-02-20 | プリント基板に電気的構造部品を装着する装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6568069B1 (ja) |
EP (1) | EP0962125B1 (ja) |
JP (1) | JP4138016B2 (ja) |
CN (1) | CN1235462C (ja) |
WO (1) | WO1998037744A1 (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19857331C1 (de) * | 1998-12-11 | 2001-01-25 | Siemens Ag | Kühleinrichtung für Bestückungsautomaten |
DE19919916C2 (de) * | 1999-04-30 | 2001-07-05 | Siemens Ag | Verfahren zur zeitoptimierten Bestückung von Leiterplatten |
DE19919924A1 (de) | 1999-04-30 | 2000-11-16 | Siemens Ag | Verfahren zum Betrieb eines Bestückautomaten, Bestückautomat, auswechselbare Komponente für einen Bestückautomaten und System aus einem Bestückautomaten und einer auswechselbaren Komponente |
US6718629B1 (en) * | 1999-04-30 | 2004-04-13 | Siemens Aktiengesellschaft | Method and apparatus for mounting components onto a substrate of an electrical assembly |
DE19919917A1 (de) | 1999-04-30 | 2000-11-16 | Siemens Ag | Verfahren und Vorrichtung zum Bestücken von Substraten mit Bauelementen |
DE19925217A1 (de) * | 1999-06-01 | 2000-12-21 | Siemens Ag | Verfahren zum Bestücken von Substraten mit Bauelementen |
EP1076357A1 (de) * | 1999-08-11 | 2001-02-14 | SiMoTec GmbH | Montagevorrichtung zur Herstellung microsystemtechnischer Produkte |
DE60026728T2 (de) * | 1999-11-05 | 2006-08-24 | Matsushita Electric Industrial Co., Ltd., Kadoma | Bauteilbestückungseinrichtung und verfahren |
DE10025443A1 (de) * | 2000-05-23 | 2001-12-06 | Siemens Ag | Vorrichtung zum Bestücken von Substraten mit elektrischen Bauteilen |
EP1284096B1 (de) * | 2000-05-23 | 2004-10-06 | Siemens Aktiengesellschaft | Vorrichtung zum bestücken von substraten mit elektrischen bauteilen |
JP4762480B2 (ja) * | 2000-08-22 | 2011-08-31 | パナソニック株式会社 | 部品実装装置及び方法 |
DE10057787A1 (de) * | 2000-11-22 | 2002-06-06 | Siemens Ag | Einrichtung zum Wechseln von Saugpipetten |
JP2004265886A (ja) * | 2003-01-15 | 2004-09-24 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
DE10309879B4 (de) * | 2003-03-06 | 2006-08-31 | Siemens Ag | Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen |
DE102005004618B3 (de) * | 2005-02-01 | 2006-04-20 | Siemens Ag | Positioniereinrichtung mit einer linear verschiebbaren Positioniereinheit |
DE102005035420B4 (de) * | 2005-07-28 | 2007-05-03 | Siemens Ag | Modular aufgebaute Vorrichtung zum Bestücken von Substraten |
KR101164593B1 (ko) * | 2006-10-13 | 2012-07-11 | 주식회사 휘닉스 디지탈테크 | 인쇄회로기판 고정장치 및 인쇄회로기판의 인쇄방법 |
EP1971197A3 (de) * | 2007-03-14 | 2011-01-12 | Siemens Electronics Assembly Systems GmbH & Co. KG | Unterstützung von zwei mit einem Doppel-Transportsystem bereitgestellten zu bestückenden Substraten mit unterschiedlicher Breite |
DE102012009439B4 (de) | 2012-05-11 | 2015-09-24 | Mimot Gmbh | Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen |
JP6635282B2 (ja) | 2014-08-29 | 2020-01-22 | パナソニックIpマネジメント株式会社 | 直動装置および電子部品実装装置 |
WO2019229991A1 (ja) * | 2018-06-01 | 2019-12-05 | 株式会社Fuji | 部品装着機 |
DE202022103455U1 (de) * | 2022-06-21 | 2023-09-26 | Schunk Electronic Solutions Gmbh | Trennmaschine zum Heraustrennen von einzelnen Leiterplatten aus einem Leiterplattennutzen |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4631812A (en) | 1984-05-10 | 1986-12-30 | Quad Systems Corporation | Programmable substrate transport for electronic assembly |
DE3502257A1 (de) * | 1985-01-24 | 1986-07-24 | Robert 7992 Tettnang Buck | Bestueckungsautomat |
GB2173426A (en) | 1985-04-09 | 1986-10-15 | Dynapert Precima Ltd | Component placement machine |
DE3623506A1 (de) | 1986-07-09 | 1988-01-28 | Mannesmann Ag | Fuehrung fuer einen industrieroboter |
JPH088433B2 (ja) | 1987-01-20 | 1996-01-29 | ヤマハ発動機株式会社 | チツプ部品装着装置 |
ATE75900T1 (de) | 1987-11-10 | 1992-05-15 | Siemens Ag | Vorrichtung und verfahren zum bestuecken von leiterplatten mit bauelementen. |
US4951383A (en) * | 1988-11-14 | 1990-08-28 | Sanyo Electric Co., Ltd. | Electronic parts automatic mounting apparatus |
JP3159266B2 (ja) | 1991-02-14 | 2001-04-23 | 三洋電機株式会社 | 作業装置 |
US5452509A (en) * | 1992-01-21 | 1995-09-26 | Yamaha Hatsudoki Kabushiki Kaisha | Surface mounter |
US5323528A (en) * | 1993-06-14 | 1994-06-28 | Amistar Corporation | Surface mount placement system |
US5509193A (en) * | 1994-05-06 | 1996-04-23 | Micron Technology, Inc. | Apparatus for loading and unloading burn-in boards |
JPH0878882A (ja) * | 1994-09-02 | 1996-03-22 | Fuji Mach Mfg Co Ltd | 対回路基板トランスファ作業装置 |
JPH09130084A (ja) * | 1995-11-06 | 1997-05-16 | Matsushita Electric Ind Co Ltd | 部品実装装置および部品実装設備 |
-
1997
- 1997-02-24 US US08/805,239 patent/US6568069B1/en not_active Expired - Lifetime
-
1998
- 1998-02-20 JP JP53615898A patent/JP4138016B2/ja not_active Expired - Lifetime
- 1998-02-20 CN CNB988028166A patent/CN1235462C/zh not_active Expired - Lifetime
- 1998-02-20 EP EP98914794A patent/EP0962125B1/de not_active Expired - Lifetime
- 1998-02-20 WO PCT/DE1998/000514 patent/WO1998037744A1/de active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US6568069B1 (en) | 2003-05-27 |
CN1249123A (zh) | 2000-03-29 |
CN1235462C (zh) | 2006-01-04 |
JP4138016B2 (ja) | 2008-08-20 |
EP0962125A1 (de) | 1999-12-08 |
WO1998037744A1 (de) | 1998-08-27 |
EP0962125B1 (de) | 2004-04-28 |
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