JP2001510938A - 小型マイクロ波ダウンストリーム・プラズマ・システム - Google Patents

小型マイクロ波ダウンストリーム・プラズマ・システム

Info

Publication number
JP2001510938A
JP2001510938A JP2000503691A JP2000503691A JP2001510938A JP 2001510938 A JP2001510938 A JP 2001510938A JP 2000503691 A JP2000503691 A JP 2000503691A JP 2000503691 A JP2000503691 A JP 2000503691A JP 2001510938 A JP2001510938 A JP 2001510938A
Authority
JP
Japan
Prior art keywords
waveguide
generator
applicator
microwave energy
microwave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000503691A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001510938A5 (enExample
Inventor
タブリッツ・エム・シャムス
チュー・ドゥウェイト・シー
スタッフォード・パトリック・ジェー
リドゥル・リチャード・シー
ポールヤク・アレキサンダー・エス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2001510938A publication Critical patent/JP2001510938A/ja
Publication of JP2001510938A5 publication Critical patent/JP2001510938A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/32229—Waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32266—Means for controlling power transmitted to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H05B6/701—Feed lines using microwave applicators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H05B6/705—Feed lines using microwave tuning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H05B6/707—Feed lines using waveguides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/80—Apparatus for specific applications
    • H05B6/806—Apparatus for specific applications for laboratory use

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
JP2000503691A 1997-07-14 1998-07-14 小型マイクロ波ダウンストリーム・プラズマ・システム Pending JP2001510938A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/892,610 US6080270A (en) 1997-07-14 1997-07-14 Compact microwave downstream plasma system
US08/892,610 1997-07-14
PCT/US1998/014472 WO1999004606A2 (en) 1997-07-14 1998-07-14 Compact microwave downstream plasma system

Publications (2)

Publication Number Publication Date
JP2001510938A true JP2001510938A (ja) 2001-08-07
JP2001510938A5 JP2001510938A5 (enExample) 2006-02-09

Family

ID=25400229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000503691A Pending JP2001510938A (ja) 1997-07-14 1998-07-14 小型マイクロ波ダウンストリーム・プラズマ・システム

Country Status (6)

Country Link
US (1) US6080270A (enExample)
EP (1) EP0995343A2 (enExample)
JP (1) JP2001510938A (enExample)
KR (1) KR100371024B1 (enExample)
TW (1) TW432445B (enExample)
WO (1) WO1999004606A2 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7794673B2 (en) * 1999-11-23 2010-09-14 Severn Trent Water Purification, Inc. Sterilizer
US6938358B2 (en) * 2002-02-15 2005-09-06 International Business Machines Corporation Method and apparatus for electromagnetic drying of printed media
JP4159845B2 (ja) * 2002-10-07 2008-10-01 東京エレクトロン株式会社 プラズマ処理装置
US7445690B2 (en) * 2002-10-07 2008-11-04 Tokyo Electron Limited Plasma processing apparatus
CA2501211A1 (en) * 2002-10-09 2004-04-22 Toyo Seikan Kaisha, Ltd. Method of forming a metal oxide film and microwave power source device used in the above method
US7164095B2 (en) * 2004-07-07 2007-01-16 Noritsu Koki Co., Ltd. Microwave plasma nozzle with enhanced plume stability and heating efficiency
US7806077B2 (en) 2004-07-30 2010-10-05 Amarante Technologies, Inc. Plasma nozzle array for providing uniform scalable microwave plasma generation
US20060021980A1 (en) * 2004-07-30 2006-02-02 Lee Sang H System and method for controlling a power distribution within a microwave cavity
US7189939B2 (en) * 2004-09-01 2007-03-13 Noritsu Koki Co., Ltd. Portable microwave plasma discharge unit
US7271363B2 (en) * 2004-09-01 2007-09-18 Noritsu Koki Co., Ltd. Portable microwave plasma systems including a supply line for gas and microwaves
US20060052883A1 (en) * 2004-09-08 2006-03-09 Lee Sang H System and method for optimizing data acquisition of plasma using a feedback control module
US7479457B2 (en) * 2005-09-08 2009-01-20 Lam Research Corporation Gas mixture for removing photoresist and post etch residue from low-k dielectric material and method of use thereof
US8653482B2 (en) * 2006-02-21 2014-02-18 Goji Limited RF controlled freezing
WO2008102334A1 (en) * 2007-02-21 2008-08-28 Rf Dynamics Ltd. Rf controlled freezing
DE102008024108A1 (de) * 2008-05-17 2009-11-19 Krones Ag Vorrichtung und Verfahren zum gesteuerten Erwärmen von Kunststoffbehältnissen
WO2010147439A2 (ko) * 2009-06-19 2010-12-23 엘지전자 주식회사 마이크로웨이브를 이용한 조리기기
US8269190B2 (en) 2010-09-10 2012-09-18 Severn Trent Water Purification, Inc. Method and system for achieving optimal UV water disinfection
EP2469975B1 (en) * 2010-12-21 2016-05-11 Whirlpool Corporation Control of microwave source efficiency in a microwave heating apparatus
FR2974701B1 (fr) * 2011-04-27 2014-03-21 Sairem Soc Pour L Applic Ind De La Rech En Electronique Et Micro Ondes Installation de production d'un plasma micro-onde
WO2013112464A2 (en) * 2012-01-23 2013-08-01 Connors Robert W Compact microwave oven
EP2677839A1 (en) * 2012-06-18 2013-12-25 Whirlpool Corporation Microwave heating apparatus with multi-feeding points
JP6072462B2 (ja) * 2012-08-07 2017-02-01 株式会社日立ハイテクノロジーズ プラズマ処理装置およびマイクロ波出力装置
WO2014188422A2 (en) 2013-05-21 2014-11-27 Goji Ltd. Calibration of an rf processing system
US10412794B2 (en) * 2016-03-11 2019-09-10 Illinois Tool Works Inc. Microwave heating device and method for operating a microwave heating device
EP3563638B1 (en) * 2016-12-29 2021-09-01 Whirlpool Corporation Electromagnetic cooking device with automatic melt operation and method of controlling cooking in the electromagnetic cooking device
KR20190131055A (ko) * 2017-03-15 2019-11-25 915 랩스, 엘엘씨 다중 통과 마이크로파 가열 시스템
US10790118B2 (en) * 2017-03-16 2020-09-29 Mks Instruments, Inc. Microwave applicator with solid-state generator power source
KR102161718B1 (ko) * 2019-04-02 2020-10-06 주식회사 뉴파워 프라즈마 플라즈마 반응 장치
US10886104B2 (en) 2019-06-10 2021-01-05 Advanced Energy Industries, Inc. Adaptive plasma ignition
WO2021166563A1 (ja) * 2020-02-21 2021-08-26 パナソニックＩｐマネジメント株式会社 マイクロ波処理装置
JP7675090B2 (ja) * 2020-03-19 2025-05-12 ラム リサーチ コーポレーション 基板処理システムにおいてプラズマを生成するために電力を供給する直接駆動システム用のｒｆ基準測定回路
US11688584B2 (en) 2020-04-29 2023-06-27 Advanced Energy Industries, Inc. Programmable ignition profiles for enhanced plasma ignition

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4617440A (en) * 1985-11-07 1986-10-14 Gics Paul W Microwave heating device
JPS62281331A (ja) * 1986-05-29 1987-12-07 Fujitsu Ltd エツチング方法
KR960014434B1 (ko) * 1987-12-09 1996-10-15 후세 노보루 플라즈마 처리장치
JP2538691B2 (ja) * 1989-04-27 1996-09-25 富士通株式会社 プラズマ処理装置およびプラズマ処理方法
KR920018856A (ko) * 1991-03-12 1992-10-22 미다 가쓰시게 마이크로파 플라즈마 처리방법 및 장치
DE4132558C1 (enExample) * 1991-09-30 1992-12-03 Secon Halbleiterproduktionsgeraete Ges.M.B.H., Wien, At
ZA925421B (en) * 1991-11-13 1994-01-14 Flexi Vision Enterprises Cc Support
US5230740A (en) * 1991-12-17 1993-07-27 Crystallume Apparatus for controlling plasma size and position in plasma-activated chemical vapor deposition processes comprising rotating dielectric
EP0578047B1 (en) * 1992-06-23 1998-05-13 Nippon Telegraph And Telephone Corporation Plasma processing apparatus
KR940023322A (ko) * 1993-03-17 1994-10-22 가나이 쯔도무 마이크로파 플라즈마 처리장치
JPH06349776A (ja) * 1993-06-14 1994-12-22 Hitachi Ltd 半導体製造装置
JPH07105893A (ja) * 1993-10-01 1995-04-21 Hitachi Ltd イオンビーム処理装置および加工法
JP3159000B2 (ja) * 1995-10-17 2001-04-23 松下電器産業株式会社 マグネトロン駆動用電源装置
KR970023767A (ko) * 1995-10-24 1997-05-30 김광호 웨이퍼 손상을 방지하기 위한 장치가 설치된 다운스트림 플라즈마 애셔
US5803975A (en) * 1996-03-01 1998-09-08 Canon Kabushiki Kaisha Microwave plasma processing apparatus and method therefor

Also Published As

Publication number Publication date
EP0995343A2 (en) 2000-04-26
WO1999004606A9 (en) 1999-05-27
TW432445B (en) 2001-05-01
WO1999004606A2 (en) 1999-01-28
WO1999004606A3 (en) 1999-04-22
US6080270A (en) 2000-06-27
KR100371024B1 (ko) 2003-02-06
KR20010021787A (ko) 2001-03-15

Similar Documents

Publication Publication Date Title
JP2001510938A (ja) 小型マイクロ波ダウンストリーム・プラズマ・システム
US6326584B1 (en) Methods and apparatus for RF power delivery
JP4714347B2 (ja) デュアルプラズマ源下流式反応炉
US6392210B1 (en) Methods and apparatus for RF power process operations with automatic input power control
KR101127714B1 (ko) 플라즈마 처리 장치 및 플라즈마 애싱 방법
US6207941B1 (en) Method and apparatus for rapid drying of coated materials with close capture of vapors
CN101026920B (zh) 等离子体发生装置和工件处理装置
JP2008066159A (ja) プラズマ発生装置およびそれを用いるワーク処理装置
CN101315875A (zh) 等离子体生成装置和使用该装置的工件处理装置
US20020007912A1 (en) Coolant for plasma generator
JP4620537B2 (ja) プラズマ処理装置およびプラズマ処理装置の制御方法
JP3287041B2 (ja) プラズマ処理装置の制御方法
JP2008059838A (ja) プラズマ発生装置およびそれを用いるワーク処理装置
JP2007265838A (ja) プラズマ発生装置およびそれを用いるワーク処理装置
JP4999441B2 (ja) プラズマ処理装置
JP4724572B2 (ja) ワーク処理装置
JP2008071500A (ja) プラズマ発生装置およびそれを用いるワーク処理装置
KR100804787B1 (ko) 능동 바이어스 제어 회로를 갖는 플라즈마 처리 장치 및 그제어 방법
JP2000252621A (ja) リフロー装置
KR200284624Y1 (ko) 반도체 웨이퍼 식각장치
JP2007227069A (ja) プラズマ発生方法および装置ならびにそれを用いるワーク処理装置
JPH03236231A (ja) 半導体集積回路製造装置
JP4619967B2 (ja) ワーク処理装置
JPH10261496A (ja) マイクロ波プラズマ処理方法および装置
JP2008077926A (ja) プラズマ発生装置およびそれを用いるワーク処理装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050630

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050630

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080401

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20080930