TW432445B - Compact microwave downstream plasma system - Google Patents
Compact microwave downstream plasma system Download PDFInfo
- Publication number
- TW432445B TW432445B TW087111347A TW87111347A TW432445B TW 432445 B TW432445 B TW 432445B TW 087111347 A TW087111347 A TW 087111347A TW 87111347 A TW87111347 A TW 87111347A TW 432445 B TW432445 B TW 432445B
- Authority
- TW
- Taiwan
- Prior art keywords
- microwave
- patent application
- plasma source
- microwave plasma
- item
- Prior art date
Links
- 238000000034 method Methods 0.000 claims abstract description 18
- 230000008569 process Effects 0.000 claims abstract description 8
- 230000002079 cooperative effect Effects 0.000 claims description 7
- 238000011143 downstream manufacturing Methods 0.000 claims description 4
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- YZCKVEUIGOORGS-NJFSPNSNSA-N Tritium Chemical compound [3H] YZCKVEUIGOORGS-NJFSPNSNSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000001276 controlling effect Effects 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000003754 machining Methods 0.000 claims 1
- 229910052722 tritium Inorganic materials 0.000 claims 1
- 239000000376 reactant Substances 0.000 abstract description 10
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 6
- 238000013461 design Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000012545 processing Methods 0.000 description 12
- 230000007246 mechanism Effects 0.000 description 10
- 239000007789 gas Substances 0.000 description 9
- 238000012423 maintenance Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052778 Plutonium Inorganic materials 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- OYEHPCDNVJXUIW-UHFFFAOYSA-N plutonium atom Chemical compound [Pu] OYEHPCDNVJXUIW-UHFFFAOYSA-N 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 235000015170 shellfish Nutrition 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 210000004712 air sac Anatomy 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32211—Means for coupling power to the plasma
- H01J37/32229—Waveguides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32266—Means for controlling power transmitted to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32357—Generation remote from the workpiece, e.g. down-stream
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/70—Feed lines
- H05B6/701—Feed lines using microwave applicators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/70—Feed lines
- H05B6/705—Feed lines using microwave tuning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/70—Feed lines
- H05B6/707—Feed lines using waveguides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/80—Apparatus for specific applications
- H05B6/806—Apparatus for specific applications for laboratory use
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Clinical Laboratory Science (AREA)
- General Health & Medical Sciences (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/892,610 US6080270A (en) | 1997-07-14 | 1997-07-14 | Compact microwave downstream plasma system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW432445B true TW432445B (en) | 2001-05-01 |
Family
ID=25400229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW087111347A TW432445B (en) | 1997-07-14 | 1998-08-26 | Compact microwave downstream plasma system |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6080270A (enExample) |
| EP (1) | EP0995343A2 (enExample) |
| JP (1) | JP2001510938A (enExample) |
| KR (1) | KR100371024B1 (enExample) |
| TW (1) | TW432445B (enExample) |
| WO (1) | WO1999004606A2 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7794673B2 (en) * | 1999-11-23 | 2010-09-14 | Severn Trent Water Purification, Inc. | Sterilizer |
| US6938358B2 (en) * | 2002-02-15 | 2005-09-06 | International Business Machines Corporation | Method and apparatus for electromagnetic drying of printed media |
| JP4159845B2 (ja) * | 2002-10-07 | 2008-10-01 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| US7445690B2 (en) * | 2002-10-07 | 2008-11-04 | Tokyo Electron Limited | Plasma processing apparatus |
| CA2501211A1 (en) * | 2002-10-09 | 2004-04-22 | Toyo Seikan Kaisha, Ltd. | Method of forming a metal oxide film and microwave power source device used in the above method |
| US7164095B2 (en) * | 2004-07-07 | 2007-01-16 | Noritsu Koki Co., Ltd. | Microwave plasma nozzle with enhanced plume stability and heating efficiency |
| US7806077B2 (en) | 2004-07-30 | 2010-10-05 | Amarante Technologies, Inc. | Plasma nozzle array for providing uniform scalable microwave plasma generation |
| US20060021980A1 (en) * | 2004-07-30 | 2006-02-02 | Lee Sang H | System and method for controlling a power distribution within a microwave cavity |
| US7189939B2 (en) * | 2004-09-01 | 2007-03-13 | Noritsu Koki Co., Ltd. | Portable microwave plasma discharge unit |
| US7271363B2 (en) * | 2004-09-01 | 2007-09-18 | Noritsu Koki Co., Ltd. | Portable microwave plasma systems including a supply line for gas and microwaves |
| US20060052883A1 (en) * | 2004-09-08 | 2006-03-09 | Lee Sang H | System and method for optimizing data acquisition of plasma using a feedback control module |
| US7479457B2 (en) * | 2005-09-08 | 2009-01-20 | Lam Research Corporation | Gas mixture for removing photoresist and post etch residue from low-k dielectric material and method of use thereof |
| US8653482B2 (en) * | 2006-02-21 | 2014-02-18 | Goji Limited | RF controlled freezing |
| WO2008102334A1 (en) * | 2007-02-21 | 2008-08-28 | Rf Dynamics Ltd. | Rf controlled freezing |
| DE102008024108A1 (de) * | 2008-05-17 | 2009-11-19 | Krones Ag | Vorrichtung und Verfahren zum gesteuerten Erwärmen von Kunststoffbehältnissen |
| WO2010147439A2 (ko) * | 2009-06-19 | 2010-12-23 | 엘지전자 주식회사 | 마이크로웨이브를 이용한 조리기기 |
| US8269190B2 (en) | 2010-09-10 | 2012-09-18 | Severn Trent Water Purification, Inc. | Method and system for achieving optimal UV water disinfection |
| EP2469975B1 (en) * | 2010-12-21 | 2016-05-11 | Whirlpool Corporation | Control of microwave source efficiency in a microwave heating apparatus |
| FR2974701B1 (fr) * | 2011-04-27 | 2014-03-21 | Sairem Soc Pour L Applic Ind De La Rech En Electronique Et Micro Ondes | Installation de production d'un plasma micro-onde |
| WO2013112464A2 (en) * | 2012-01-23 | 2013-08-01 | Connors Robert W | Compact microwave oven |
| EP2677839A1 (en) * | 2012-06-18 | 2013-12-25 | Whirlpool Corporation | Microwave heating apparatus with multi-feeding points |
| JP6072462B2 (ja) * | 2012-08-07 | 2017-02-01 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置およびマイクロ波出力装置 |
| WO2014188422A2 (en) | 2013-05-21 | 2014-11-27 | Goji Ltd. | Calibration of an rf processing system |
| US10412794B2 (en) * | 2016-03-11 | 2019-09-10 | Illinois Tool Works Inc. | Microwave heating device and method for operating a microwave heating device |
| EP3563638B1 (en) * | 2016-12-29 | 2021-09-01 | Whirlpool Corporation | Electromagnetic cooking device with automatic melt operation and method of controlling cooking in the electromagnetic cooking device |
| KR20190131055A (ko) * | 2017-03-15 | 2019-11-25 | 915 랩스, 엘엘씨 | 다중 통과 마이크로파 가열 시스템 |
| US10790118B2 (en) * | 2017-03-16 | 2020-09-29 | Mks Instruments, Inc. | Microwave applicator with solid-state generator power source |
| KR102161718B1 (ko) * | 2019-04-02 | 2020-10-06 | 주식회사 뉴파워 프라즈마 | 플라즈마 반응 장치 |
| US10886104B2 (en) | 2019-06-10 | 2021-01-05 | Advanced Energy Industries, Inc. | Adaptive plasma ignition |
| WO2021166563A1 (ja) * | 2020-02-21 | 2021-08-26 | パナソニックＩｐマネジメント株式会社 | マイクロ波処理装置 |
| JP7675090B2 (ja) * | 2020-03-19 | 2025-05-12 | ラム リサーチ コーポレーション | 基板処理システムにおいてプラズマを生成するために電力を供給する直接駆動システム用のｒｆ基準測定回路 |
| US11688584B2 (en) | 2020-04-29 | 2023-06-27 | Advanced Energy Industries, Inc. | Programmable ignition profiles for enhanced plasma ignition |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4617440A (en) * | 1985-11-07 | 1986-10-14 | Gics Paul W | Microwave heating device |
| JPS62281331A (ja) * | 1986-05-29 | 1987-12-07 | Fujitsu Ltd | エツチング方法 |
| KR960014434B1 (ko) * | 1987-12-09 | 1996-10-15 | 후세 노보루 | 플라즈마 처리장치 |
| JP2538691B2 (ja) * | 1989-04-27 | 1996-09-25 | 富士通株式会社 | プラズマ処理装置およびプラズマ処理方法 |
| KR920018856A (ko) * | 1991-03-12 | 1992-10-22 | 미다 가쓰시게 | 마이크로파 플라즈마 처리방법 및 장치 |
| DE4132558C1 (enExample) * | 1991-09-30 | 1992-12-03 | Secon Halbleiterproduktionsgeraete Ges.M.B.H., Wien, At | |
| ZA925421B (en) * | 1991-11-13 | 1994-01-14 | Flexi Vision Enterprises Cc | Support |
| US5230740A (en) * | 1991-12-17 | 1993-07-27 | Crystallume | Apparatus for controlling plasma size and position in plasma-activated chemical vapor deposition processes comprising rotating dielectric |
| EP0578047B1 (en) * | 1992-06-23 | 1998-05-13 | Nippon Telegraph And Telephone Corporation | Plasma processing apparatus |
| KR940023322A (ko) * | 1993-03-17 | 1994-10-22 | 가나이 쯔도무 | 마이크로파 플라즈마 처리장치 |
| JPH06349776A (ja) * | 1993-06-14 | 1994-12-22 | Hitachi Ltd | 半導体製造装置 |
| JPH07105893A (ja) * | 1993-10-01 | 1995-04-21 | Hitachi Ltd | イオンビーム処理装置および加工法 |
| JP3159000B2 (ja) * | 1995-10-17 | 2001-04-23 | 松下電器産業株式会社 | マグネトロン駆動用電源装置 |
| KR970023767A (ko) * | 1995-10-24 | 1997-05-30 | 김광호 | 웨이퍼 손상을 방지하기 위한 장치가 설치된 다운스트림 플라즈마 애셔 |
| US5803975A (en) * | 1996-03-01 | 1998-09-08 | Canon Kabushiki Kaisha | Microwave plasma processing apparatus and method therefor |
-
1997
- 1997-07-14 US US08/892,610 patent/US6080270A/en not_active Expired - Lifetime
-
1998
- 1998-07-14 WO PCT/US1998/014472 patent/WO1999004606A2/en not_active Ceased
- 1998-07-14 JP JP2000503691A patent/JP2001510938A/ja active Pending
- 1998-07-14 KR KR10-2000-7000350A patent/KR100371024B1/ko not_active Expired - Lifetime
- 1998-07-14 EP EP98936835A patent/EP0995343A2/en not_active Withdrawn
- 1998-08-26 TW TW087111347A patent/TW432445B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0995343A2 (en) | 2000-04-26 |
| WO1999004606A9 (en) | 1999-05-27 |
| WO1999004606A2 (en) | 1999-01-28 |
| WO1999004606A3 (en) | 1999-04-22 |
| US6080270A (en) | 2000-06-27 |
| KR100371024B1 (ko) | 2003-02-06 |
| JP2001510938A (ja) | 2001-08-07 |
| KR20010021787A (ko) | 2001-03-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MK4A | Expiration of patent term of an invention patent |