KR100371024B1 - 콤팩트 마이크로웨이브 다운스트림 플라즈마 시스템 - Google Patents

콤팩트 마이크로웨이브 다운스트림 플라즈마 시스템 Download PDF

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Publication number
KR100371024B1
KR100371024B1 KR10-2000-7000350A KR20007000350A KR100371024B1 KR 100371024 B1 KR100371024 B1 KR 100371024B1 KR 20007000350 A KR20007000350 A KR 20007000350A KR 100371024 B1 KR100371024 B1 KR 100371024B1
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South Korea
Prior art keywords
cabinet
microwave
plasma
applicator
source
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KR10-2000-7000350A
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English (en)
Korean (ko)
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KR20010021787A (ko
Inventor
엠.샴스 타브레즈
드와이트 씨. 츄
패트릭 제이. 스태포드
리차드 씨. 리들
알렉산더 에스. 폴악
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램 리서치 코포레이션
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/32229—Waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32266—Means for controlling power transmitted to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H05B6/701—Feed lines using microwave applicators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H05B6/705—Feed lines using microwave tuning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H05B6/707—Feed lines using waveguides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/80—Apparatus for specific applications
    • H05B6/806—Apparatus for specific applications for laboratory use

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
KR10-2000-7000350A 1997-07-14 1998-07-14 콤팩트 마이크로웨이브 다운스트림 플라즈마 시스템 Expired - Lifetime KR100371024B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US8/892,610 1997-07-14
US08/892,610 US6080270A (en) 1997-07-14 1997-07-14 Compact microwave downstream plasma system
US08/892,610 1997-07-14

Publications (2)

Publication Number Publication Date
KR20010021787A KR20010021787A (ko) 2001-03-15
KR100371024B1 true KR100371024B1 (ko) 2003-02-06

Family

ID=25400229

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2000-7000350A Expired - Lifetime KR100371024B1 (ko) 1997-07-14 1998-07-14 콤팩트 마이크로웨이브 다운스트림 플라즈마 시스템

Country Status (6)

Country Link
US (1) US6080270A (enExample)
EP (1) EP0995343A2 (enExample)
JP (1) JP2001510938A (enExample)
KR (1) KR100371024B1 (enExample)
TW (1) TW432445B (enExample)
WO (1) WO1999004606A2 (enExample)

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US7794673B2 (en) * 1999-11-23 2010-09-14 Severn Trent Water Purification, Inc. Sterilizer
US6938358B2 (en) * 2002-02-15 2005-09-06 International Business Machines Corporation Method and apparatus for electromagnetic drying of printed media
JP4159845B2 (ja) * 2002-10-07 2008-10-01 東京エレクトロン株式会社 プラズマ処理装置
US7445690B2 (en) * 2002-10-07 2008-11-04 Tokyo Electron Limited Plasma processing apparatus
CA2501211A1 (en) * 2002-10-09 2004-04-22 Toyo Seikan Kaisha, Ltd. Method of forming a metal oxide film and microwave power source device used in the above method
US7164095B2 (en) * 2004-07-07 2007-01-16 Noritsu Koki Co., Ltd. Microwave plasma nozzle with enhanced plume stability and heating efficiency
US7806077B2 (en) 2004-07-30 2010-10-05 Amarante Technologies, Inc. Plasma nozzle array for providing uniform scalable microwave plasma generation
US20060021980A1 (en) * 2004-07-30 2006-02-02 Lee Sang H System and method for controlling a power distribution within a microwave cavity
US7189939B2 (en) * 2004-09-01 2007-03-13 Noritsu Koki Co., Ltd. Portable microwave plasma discharge unit
US7271363B2 (en) * 2004-09-01 2007-09-18 Noritsu Koki Co., Ltd. Portable microwave plasma systems including a supply line for gas and microwaves
US20060052883A1 (en) * 2004-09-08 2006-03-09 Lee Sang H System and method for optimizing data acquisition of plasma using a feedback control module
US7479457B2 (en) * 2005-09-08 2009-01-20 Lam Research Corporation Gas mixture for removing photoresist and post etch residue from low-k dielectric material and method of use thereof
US8653482B2 (en) * 2006-02-21 2014-02-18 Goji Limited RF controlled freezing
WO2008102334A1 (en) * 2007-02-21 2008-08-28 Rf Dynamics Ltd. Rf controlled freezing
DE102008024108A1 (de) * 2008-05-17 2009-11-19 Krones Ag Vorrichtung und Verfahren zum gesteuerten Erwärmen von Kunststoffbehältnissen
WO2010147439A2 (ko) * 2009-06-19 2010-12-23 엘지전자 주식회사 마이크로웨이브를 이용한 조리기기
US8269190B2 (en) 2010-09-10 2012-09-18 Severn Trent Water Purification, Inc. Method and system for achieving optimal UV water disinfection
EP2469975B1 (en) * 2010-12-21 2016-05-11 Whirlpool Corporation Control of microwave source efficiency in a microwave heating apparatus
FR2974701B1 (fr) * 2011-04-27 2014-03-21 Sairem Soc Pour L Applic Ind De La Rech En Electronique Et Micro Ondes Installation de production d'un plasma micro-onde
WO2013112464A2 (en) * 2012-01-23 2013-08-01 Connors Robert W Compact microwave oven
EP2677839A1 (en) * 2012-06-18 2013-12-25 Whirlpool Corporation Microwave heating apparatus with multi-feeding points
JP6072462B2 (ja) * 2012-08-07 2017-02-01 株式会社日立ハイテクノロジーズ プラズマ処理装置およびマイクロ波出力装置
WO2014188422A2 (en) 2013-05-21 2014-11-27 Goji Ltd. Calibration of an rf processing system
US10412794B2 (en) * 2016-03-11 2019-09-10 Illinois Tool Works Inc. Microwave heating device and method for operating a microwave heating device
EP3563638B1 (en) * 2016-12-29 2021-09-01 Whirlpool Corporation Electromagnetic cooking device with automatic melt operation and method of controlling cooking in the electromagnetic cooking device
KR20190131055A (ko) * 2017-03-15 2019-11-25 915 랩스, 엘엘씨 다중 통과 마이크로파 가열 시스템
US10790118B2 (en) * 2017-03-16 2020-09-29 Mks Instruments, Inc. Microwave applicator with solid-state generator power source
KR102161718B1 (ko) * 2019-04-02 2020-10-06 주식회사 뉴파워 프라즈마 플라즈마 반응 장치
US10886104B2 (en) 2019-06-10 2021-01-05 Advanced Energy Industries, Inc. Adaptive plasma ignition
WO2021166563A1 (ja) * 2020-02-21 2021-08-26 パナソニックＩｐマネジメント株式会社 マイクロ波処理装置
JP7675090B2 (ja) * 2020-03-19 2025-05-12 ラム リサーチ コーポレーション 基板処理システムにおいてプラズマを生成するために電力を供給する直接駆動システム用のｒｆ基準測定回路
US11688584B2 (en) 2020-04-29 2023-06-27 Advanced Energy Industries, Inc. Programmable ignition profiles for enhanced plasma ignition

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03130370A (ja) * 1989-04-27 1991-06-04 Fujitsu Ltd プラズマ処理装置およびプラズマ処理方法
KR920018856A (ko) * 1991-03-12 1992-10-22 미다 가쓰시게 마이크로파 플라즈마 처리방법 및 장치
US5389154A (en) * 1992-06-23 1995-02-14 Nippon Telegraph And Telephone Plasma processing apparatus
JPH07105893A (ja) * 1993-10-01 1995-04-21 Hitachi Ltd イオンビーム処理装置および加工法
KR970023767A (ko) * 1995-10-24 1997-05-30 김광호 웨이퍼 손상을 방지하기 위한 장치가 설치된 다운스트림 플라즈마 애셔
US5647944A (en) * 1993-03-17 1997-07-15 Hitachi, Ltd. Microwave plasma treatment apparatus

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US4617440A (en) * 1985-11-07 1986-10-14 Gics Paul W Microwave heating device
JPS62281331A (ja) * 1986-05-29 1987-12-07 Fujitsu Ltd エツチング方法
KR960014434B1 (ko) * 1987-12-09 1996-10-15 후세 노보루 플라즈마 처리장치
DE4132558C1 (enExample) * 1991-09-30 1992-12-03 Secon Halbleiterproduktionsgeraete Ges.M.B.H., Wien, At
ZA925421B (en) * 1991-11-13 1994-01-14 Flexi Vision Enterprises Cc Support
US5230740A (en) * 1991-12-17 1993-07-27 Crystallume Apparatus for controlling plasma size and position in plasma-activated chemical vapor deposition processes comprising rotating dielectric
JPH06349776A (ja) * 1993-06-14 1994-12-22 Hitachi Ltd 半導体製造装置
JP3159000B2 (ja) * 1995-10-17 2001-04-23 松下電器産業株式会社 マグネトロン駆動用電源装置
US5803975A (en) * 1996-03-01 1998-09-08 Canon Kabushiki Kaisha Microwave plasma processing apparatus and method therefor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03130370A (ja) * 1989-04-27 1991-06-04 Fujitsu Ltd プラズマ処理装置およびプラズマ処理方法
KR920018856A (ko) * 1991-03-12 1992-10-22 미다 가쓰시게 마이크로파 플라즈마 처리방법 및 장치
US5389154A (en) * 1992-06-23 1995-02-14 Nippon Telegraph And Telephone Plasma processing apparatus
US5647944A (en) * 1993-03-17 1997-07-15 Hitachi, Ltd. Microwave plasma treatment apparatus
JPH07105893A (ja) * 1993-10-01 1995-04-21 Hitachi Ltd イオンビーム処理装置および加工法
KR970023767A (ko) * 1995-10-24 1997-05-30 김광호 웨이퍼 손상을 방지하기 위한 장치가 설치된 다운스트림 플라즈마 애셔

Also Published As

Publication number Publication date
EP0995343A2 (en) 2000-04-26
WO1999004606A9 (en) 1999-05-27
TW432445B (en) 2001-05-01
WO1999004606A2 (en) 1999-01-28
WO1999004606A3 (en) 1999-04-22
US6080270A (en) 2000-06-27
JP2001510938A (ja) 2001-08-07
KR20010021787A (ko) 2001-03-15

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