JP2001345255A5 - - Google Patents

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Publication number
JP2001345255A5
JP2001345255A5 JP2000165026A JP2000165026A JP2001345255A5 JP 2001345255 A5 JP2001345255 A5 JP 2001345255A5 JP 2000165026 A JP2000165026 A JP 2000165026A JP 2000165026 A JP2000165026 A JP 2000165026A JP 2001345255 A5 JP2001345255 A5 JP 2001345255A5
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JP
Japan
Prior art keywords
gate valve
gas
exposure apparatus
housing
gas curtain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2000165026A
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English (en)
Japanese (ja)
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JP2001345255A (ja
JP3595756B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2000165026A priority Critical patent/JP3595756B2/ja
Priority claimed from JP2000165026A external-priority patent/JP3595756B2/ja
Priority to US09/864,256 priority patent/US6638672B2/en
Priority to EP01304750A priority patent/EP1160839A3/en
Publication of JP2001345255A publication Critical patent/JP2001345255A/ja
Application granted granted Critical
Publication of JP3595756B2 publication Critical patent/JP3595756B2/ja
Publication of JP2001345255A5 publication Critical patent/JP2001345255A5/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000165026A 2000-06-01 2000-06-01 露光装置、リソグラフィ装置、ロードロック装置、デバイス製造方法およびリソグラフィ方法 Expired - Fee Related JP3595756B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000165026A JP3595756B2 (ja) 2000-06-01 2000-06-01 露光装置、リソグラフィ装置、ロードロック装置、デバイス製造方法およびリソグラフィ方法
US09/864,256 US6638672B2 (en) 2000-06-01 2001-05-25 Exposure apparatus, coating/developing apparatus, method of transferring a substrate, method of producing a device, semiconductor production factory, and method of maintaining an exposure apparatus
EP01304750A EP1160839A3 (en) 2000-06-01 2001-05-30 Exposure apparatus, coating/developing apparatus, method of transferring a substrate, method of producing a device, semiconductor production factory, and method of maintaining an exposure apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000165026A JP3595756B2 (ja) 2000-06-01 2000-06-01 露光装置、リソグラフィ装置、ロードロック装置、デバイス製造方法およびリソグラフィ方法

Publications (3)

Publication Number Publication Date
JP2001345255A JP2001345255A (ja) 2001-12-14
JP3595756B2 JP3595756B2 (ja) 2004-12-02
JP2001345255A5 true JP2001345255A5 (enExample) 2004-12-16

Family

ID=18668563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000165026A Expired - Fee Related JP3595756B2 (ja) 2000-06-01 2000-06-01 露光装置、リソグラフィ装置、ロードロック装置、デバイス製造方法およびリソグラフィ方法

Country Status (3)

Country Link
US (1) US6638672B2 (enExample)
EP (1) EP1160839A3 (enExample)
JP (1) JP3595756B2 (enExample)

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JP2002252161A (ja) * 2001-02-23 2002-09-06 Hitachi Ltd 半導体製造システム
US8796589B2 (en) * 2001-07-15 2014-08-05 Applied Materials, Inc. Processing system with the dual end-effector handling
US6800172B2 (en) 2002-02-22 2004-10-05 Micron Technology, Inc. Interfacial structure for semiconductor substrate processing chambers and substrate transfer chambers and for semiconductor substrate processing chambers and accessory attachments, and semiconductor substrate processor
US6858264B2 (en) * 2002-04-24 2005-02-22 Micron Technology, Inc. Chemical vapor deposition methods
US6814813B2 (en) * 2002-04-24 2004-11-09 Micron Technology, Inc. Chemical vapor deposition apparatus
US6838114B2 (en) 2002-05-24 2005-01-04 Micron Technology, Inc. Methods for controlling gas pulsing in processes for depositing materials onto micro-device workpieces
US6821347B2 (en) 2002-07-08 2004-11-23 Micron Technology, Inc. Apparatus and method for depositing materials onto microelectronic workpieces
US6955725B2 (en) 2002-08-15 2005-10-18 Micron Technology, Inc. Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
JP4316210B2 (ja) * 2002-08-27 2009-08-19 東京エレクトロン株式会社 保守システム，基板処理装置及び遠隔操作装置
KR20040024516A (ko) * 2002-09-13 2004-03-20 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조방법
EP1398669A1 (en) * 2002-09-13 2004-03-17 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US6926775B2 (en) * 2003-02-11 2005-08-09 Micron Technology, Inc. Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
US7335396B2 (en) 2003-04-24 2008-02-26 Micron Technology, Inc. Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers
US7344755B2 (en) 2003-08-21 2008-03-18 Micron Technology, Inc. Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers
US7235138B2 (en) 2003-08-21 2007-06-26 Micron Technology, Inc. Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces
US7422635B2 (en) 2003-08-28 2008-09-09 Micron Technology, Inc. Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
US7056806B2 (en) 2003-09-17 2006-06-06 Micron Technology, Inc. Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
US7282239B2 (en) 2003-09-18 2007-10-16 Micron Technology, Inc. Systems and methods for depositing material onto microfeature workpieces in reaction chambers
US7323231B2 (en) 2003-10-09 2008-01-29 Micron Technology, Inc. Apparatus and methods for plasma vapor deposition processes
US7581511B2 (en) 2003-10-10 2009-09-01 Micron Technology, Inc. Apparatus and methods for manufacturing microfeatures on workpieces using plasma vapor processes
US7647886B2 (en) 2003-10-15 2010-01-19 Micron Technology, Inc. Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers
TWI311691B (en) * 2003-10-30 2009-07-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7258892B2 (en) 2003-12-10 2007-08-21 Micron Technology, Inc. Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition
US7906393B2 (en) 2004-01-28 2011-03-15 Micron Technology, Inc. Methods for forming small-scale capacitor structures
JP4572896B2 (ja) * 2004-02-19 2010-11-04 株式会社ニコン 露光装置及びデバイスの製造方法
US7584942B2 (en) 2004-03-31 2009-09-08 Micron Technology, Inc. Ampoules for producing a reaction gas and systems for depositing materials onto microfeature workpieces in reaction chambers
US8133554B2 (en) 2004-05-06 2012-03-13 Micron Technology, Inc. Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces
US7699932B2 (en) 2004-06-02 2010-04-20 Micron Technology, Inc. Reactors, systems and methods for depositing thin films onto microfeature workpieces
US7408615B2 (en) * 2004-06-21 2008-08-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4781049B2 (ja) * 2005-08-30 2011-09-28 キヤノン株式会社 露光装置およびデバイス製造方法
US8794896B2 (en) * 2005-12-14 2014-08-05 Tokyo Electron Limited Vacuum processing apparatus and zonal airflow generating unit
US8113757B2 (en) 2006-08-01 2012-02-14 Tokyo Electron Limited Intermediate transfer chamber, substrate processing system, and exhaust method for the intermediate transfer chamber
JP5037058B2 (ja) * 2006-08-01 2012-09-26 東京エレクトロン株式会社 中間搬送室、基板処理システム、及び当該中間搬送室の排気方法
JP2010177673A (ja) * 2009-01-30 2010-08-12 Semes Co Ltd 基板処理設備及び基板処理方法
JP2010287686A (ja) * 2009-06-10 2010-12-24 Tokyo Electron Ltd 塗布、現像装置及び基板の裏面洗浄方法。
US9136149B2 (en) * 2012-11-16 2015-09-15 Taiwan Semiconductor Manufacturing Company, Ltd. Loading port, system for etching and cleaning wafers and method of use
US20170292764A1 (en) * 2016-04-12 2017-10-12 Michael D. Newman Cryogenic exhaust control system and freezer having same
JP6951923B2 (ja) * 2017-09-27 2021-10-20 東京エレクトロン株式会社 基板処理装置、基板処理方法及びコンピュータ記憶媒体
TWI815827B (zh) * 2017-11-07 2023-09-21 日商東京威力科創股份有限公司 基板處理裝置
TWI840362B (zh) * 2018-06-04 2024-05-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 水氣降低的晶圓處置腔室
US11194259B2 (en) * 2018-08-30 2021-12-07 Taiwan Semiconductor Manufacturing Co., Ltd. Equipment module with enhanced protection from airborne contaminants, and method of operation
US11740564B2 (en) * 2020-06-18 2023-08-29 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography apparatus and method using the same
CN114200791B (zh) * 2020-09-17 2023-12-08 株式会社斯库林集团 显影装置及显影方法
US12062562B2 (en) * 2021-04-22 2024-08-13 Taiwan Semiconductor Manufacturing Co., Ltd. Air curtain for defect reduction
KR102315216B1 (ko) * 2021-05-13 2021-10-20 주식회사 엘에스텍 반도체 제조 설비용 에어 커튼 장치
CN115877665A (zh) * 2021-09-29 2023-03-31 长鑫存储技术有限公司 控温装置及控温方法
US20250250665A1 (en) * 2024-02-02 2025-08-07 Applied Materials, Inc. Chamber Port Assembly

Family Cites Families (3)

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Publication number Priority date Publication date Assignee Title
JPH0370134A (ja) * 1989-08-09 1991-03-26 Fujitsu Ltd 溶剤蒸気乾燥装置および乾燥方法
JPH0492410A (ja) * 1990-08-07 1992-03-25 Mitsubishi Electric Corp 半導体製造装置
US5997588A (en) * 1995-10-13 1999-12-07 Advanced Semiconductor Materials America, Inc. Semiconductor processing system with gas curtain

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