JP2001267379A5 - - Google Patents

Download PDF

Info

Publication number
JP2001267379A5
JP2001267379A5 JP2000074992A JP2000074992A JP2001267379A5 JP 2001267379 A5 JP2001267379 A5 JP 2001267379A5 JP 2000074992 A JP2000074992 A JP 2000074992A JP 2000074992 A JP2000074992 A JP 2000074992A JP 2001267379 A5 JP2001267379 A5 JP 2001267379A5
Authority
JP
Japan
Prior art keywords
wafer
chip
semiconductor device
control data
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000074992A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001267379A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000074992A priority Critical patent/JP2001267379A/ja
Priority claimed from JP2000074992A external-priority patent/JP2001267379A/ja
Publication of JP2001267379A publication Critical patent/JP2001267379A/ja
Publication of JP2001267379A5 publication Critical patent/JP2001267379A5/ja
Pending legal-status Critical Current

Links

JP2000074992A 2000-03-17 2000-03-17 半導体装置の製造方法 Pending JP2001267379A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000074992A JP2001267379A (ja) 2000-03-17 2000-03-17 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000074992A JP2001267379A (ja) 2000-03-17 2000-03-17 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2001267379A JP2001267379A (ja) 2001-09-28
JP2001267379A5 true JP2001267379A5 (zh) 2004-12-02

Family

ID=18592947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000074992A Pending JP2001267379A (ja) 2000-03-17 2000-03-17 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2001267379A (zh)

Similar Documents

Publication Publication Date Title
EP1139414A3 (en) Method for failure analysis during the manufacturing semiconductor devices
WO2000066549A3 (en) Apparatus and methods for collecting global data during a reticle inspection
CN101251712A (zh) 一种半导体制造工艺中的掩模版图验证方法
JP2004363304A5 (zh)
JP2001267379A5 (zh)
US6969620B2 (en) Semiconductor device inspection system
JP2604556B2 (ja) 半導体ウエハおよびその識別方法
JPH0574888A (ja) ウエーハプロービング装置
JPS58103151A (ja) 半導体基板の検査方法
KR0168353B1 (ko) 넌패턴 웨이퍼의 검사방법
JP3487297B2 (ja) 半導体装置の検査方法及び検査用ウェハ及び検査用パターンマスク
JP2007147393A (ja) 基板検査装置及び方法
JP2001267379A (ja) 半導体装置の製造方法
JPS594019A (ja) パタ−ン比較検査方法
JPH09199377A (ja) チップ製造方法
JPH05121496A (ja) 不良チツプ除去方法
JPH079379Y2 (ja) Icウエハ試験用自動プローバ
JP2001168153A (ja) 基板処理装置
JPH01287449A (ja) パターン欠陥検査装置
JPS58103150A (ja) 半導体基板の製造方法
JPS6381356A (ja) ホトマスク
JPS594009A (ja) 半導体基板
JPS6254932A (ja) 半導体ウエ−ハの試験方法
JPH0461251A (ja) 半導体装置の製造管理システム
JPS6028231A (ja) 半導体装置