JP2001244316A - 基板のロボットアラインメント装置及び方法 - Google Patents

基板のロボットアラインメント装置及び方法

Info

Publication number
JP2001244316A
JP2001244316A JP2000393003A JP2000393003A JP2001244316A JP 2001244316 A JP2001244316 A JP 2001244316A JP 2000393003 A JP2000393003 A JP 2000393003A JP 2000393003 A JP2000393003 A JP 2000393003A JP 2001244316 A JP2001244316 A JP 2001244316A
Authority
JP
Japan
Prior art keywords
substrate
end effector
slot
robot
relative
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000393003A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001244316A5 (cg-RX-API-DMAC7.html
Inventor
M White John
エム． ホワイト ジョン
Shinichi Kurita
クリタ シンイチ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2001244316A publication Critical patent/JP2001244316A/ja
Publication of JP2001244316A5 publication Critical patent/JP2001244316A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2000393003A 1999-12-23 2000-12-25 基板のロボットアラインメント装置及び方法 Pending JP2001244316A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/470,821 US6577923B1 (en) 1999-12-23 1999-12-23 Apparatus and method for robotic alignment of substrates
US09/470821 1999-12-23

Publications (2)

Publication Number Publication Date
JP2001244316A true JP2001244316A (ja) 2001-09-07
JP2001244316A5 JP2001244316A5 (cg-RX-API-DMAC7.html) 2005-11-04

Family

ID=23869196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000393003A Pending JP2001244316A (ja) 1999-12-23 2000-12-25 基板のロボットアラインメント装置及び方法

Country Status (5)

Country Link
US (1) US6577923B1 (cg-RX-API-DMAC7.html)
EP (1) EP1126506A3 (cg-RX-API-DMAC7.html)
JP (1) JP2001244316A (cg-RX-API-DMAC7.html)
KR (1) KR100753290B1 (cg-RX-API-DMAC7.html)
SG (1) SG90220A1 (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6577923B1 (en) * 1999-12-23 2003-06-10 Applied Materials, Inc. Apparatus and method for robotic alignment of substrates
JP2022523156A (ja) * 2019-02-14 2022-04-21 パーシモン テクノロジーズ コーポレイション ２リンクアームを有するリニアロボット

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JP2001222624A (ja) * 2000-02-10 2001-08-17 Sony Corp 情報提供システム、情報提供方法、部品情報提供装置及び部品情報提供方法
JP4327599B2 (ja) * 2001-11-29 2009-09-09 ダイアモンド セミコンダクタ グループ エルエルシー ウエーハ取り扱い装置及び方法
US20080011421A1 (en) * 2002-04-26 2008-01-17 Accretech Usa, Inc. Processing chamber having labyrinth seal
US7135852B2 (en) * 2002-12-03 2006-11-14 Sensarray Corporation Integrated process condition sensing wafer and data analysis system
US7505832B2 (en) * 2003-05-12 2009-03-17 Applied Materials, Inc. Method and apparatus for determining a substrate exchange position in a processing system
US8545159B2 (en) * 2003-10-01 2013-10-01 Jusung Engineering Co., Ltd. Apparatus having conveyor and method of transferring substrate using the same
KR100568867B1 (ko) * 2004-03-18 2006-04-10 삼성전자주식회사 웨이퍼 좌표감지장치 및 그 웨이퍼 좌표감지 기능을 갖는반도체 제조설비
US7440091B2 (en) * 2004-10-26 2008-10-21 Applied Materials, Inc. Sensors for dynamically detecting substrate breakage and misalignment of a moving substrate
US7444205B2 (en) * 2004-10-29 2008-10-28 Neil Desmond Modular self structuring and computing system
KR101025632B1 (ko) * 2004-11-30 2011-03-30 가부시키가이샤 야스카와덴키 얼라인먼트 장치
JP2006196716A (ja) * 2005-01-14 2006-07-27 Matsushita Electric Ind Co Ltd 半導体製造装置および半導体装置の製造方法
US20060245871A1 (en) * 2005-03-10 2006-11-02 Wen-Ming Lo Wafer transfer system, wafer transfer method, cassette exchange system and cassette exchange method
KR20070004230A (ko) * 2005-07-04 2007-01-09 삼성전자주식회사 반도체 웨이퍼 이송용 로봇
KR100693760B1 (ko) * 2005-08-16 2007-03-12 주식회사 디엠에스 고밀도의 현상처리가 가능한 기판처리장치 및 방법
KR100693759B1 (ko) * 2005-08-16 2007-03-12 주식회사 디엠에스 고밀도 처리가 가능한 기판처리장치 및 방법
US20080279672A1 (en) * 2007-05-11 2008-11-13 Bachrach Robert Z Batch equipment robots and methods of stack to array work-piece transfer for photovoltaic factory
JP5235376B2 (ja) * 2007-10-05 2013-07-10 川崎重工業株式会社 ロボットのターゲット位置検出装置
EP2149831B1 (de) * 2008-07-31 2012-02-01 Siemens Aktiengesellschaft Steuerungsverfahren für einen Verbund aus mehreren, hintereinander und/oder nebeneinander angeordneten, mehrachsigen Handlingsgeräten sowie Datenspeichermedium, Steuerungssystem und Verbund
US8276959B2 (en) 2008-08-08 2012-10-02 Applied Materials, Inc. Magnetic pad for end-effectors
JP6021909B2 (ja) 2011-07-21 2016-11-09 ブルックス オートメーション インコーポレイテッド 低温試料グループホルダーにおける寸法変化の補正のための方法と装置
CH706473A1 (de) * 2012-05-04 2013-11-15 Erowa Ag Überwachugungseinrichtung zur Überwachung von Positionen eines Roboters sowie Fertigungsanlage mit einer Überwachungseinrichtung.
JP6208419B2 (ja) * 2012-09-19 2017-10-04 株式会社ダイヘン 算出装置、搬送ロボットシステム、及び算出方法
US10224232B2 (en) 2013-01-18 2019-03-05 Persimmon Technologies Corporation Robot having two arms with unequal link lengths
US9666465B2 (en) 2013-12-12 2017-05-30 Seagate Technology Llc Positioning apparatus
WO2016077387A1 (en) 2014-11-10 2016-05-19 Brooks Automation, Inc. Tool auto-teach method and apparatus
KR102430044B1 (ko) * 2015-02-06 2022-08-05 퍼시몬 테크놀로지스 코포레이션 동등하지 않은 링크 길이를 가진 아암을 구비한 로봇
CN108292589B (zh) * 2015-11-23 2023-05-16 应用材料公司 在处理工具中的板载计量(obm)设计与影响
US12228395B2 (en) 2017-02-14 2025-02-18 Applied Materials, Inc. Substrate position calibration for substrate supports in substrate processing systems
US11201078B2 (en) * 2017-02-14 2021-12-14 Applied Materials, Inc. Substrate position calibration for substrate supports in substrate processing systems
US10290523B2 (en) * 2017-03-17 2019-05-14 Asm Ip Holding B.V. Wafer processing apparatus, recording medium and wafer conveying method
WO2020167947A1 (en) * 2019-02-14 2020-08-20 Persimmon Technologies Corporation Radar based position measurement for robot systems
TW202228961A (zh) * 2021-01-27 2022-08-01 日商發那科股份有限公司 選擇順應性裝配機械手臂機器人
JP7903960B2 (ja) * 2022-11-30 2026-08-12 東京エレクトロン株式会社 搬送システム、処理システムおよび搬送方法

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US5224809A (en) * 1985-01-22 1993-07-06 Applied Materials, Inc. Semiconductor processing system with robotic autoloader and load lock
EP0244202B1 (en) * 1986-04-28 1994-09-21 Varian Associates, Inc. Wafer transfer system
US5102280A (en) 1989-03-07 1992-04-07 Ade Corporation Robot prealigner
WO1992005920A1 (en) 1990-09-27 1992-04-16 Genmark Automation Scanning end effector assembly
DE69329269T2 (de) * 1992-11-12 2000-12-28 Applied Materials, Inc. System und Verfahren für automatische Positionierung eines Substrats in einem Prozessraum
JP2683208B2 (ja) * 1993-01-28 1997-11-26 アプライド マテリアルズ インコーポレイテッド ロボット機構を用いた搬入および搬出のためのワークピース位置合わせ方法および装置
JPH09138256A (ja) * 1995-11-14 1997-05-27 Nippon Maikuronikusu:Kk 被検査基板のアライメント方法
US6286688B1 (en) * 1996-04-03 2001-09-11 Scp Global Technologies, Inc. Compliant silicon wafer handling system
TW466622B (en) * 1996-09-11 2001-12-01 Hitachi Ltd Operating method of vacuum processing device and vacuum processing device
JPH10173022A (ja) 1996-12-10 1998-06-26 Mecs:Kk ウェハ搬送装置
JP3977485B2 (ja) 1997-04-24 2007-09-19 東京エレクトロン株式会社 アームアクセス位置検出方法及び真空処理装置
JPH10335410A (ja) 1997-05-29 1998-12-18 Sony Corp ウエハ搬送装置及びウエハアライメント方法
JPH10335420A (ja) * 1997-06-04 1998-12-18 Mecs:Kk ワークのアライメント装置
JPH1126539A (ja) * 1997-07-04 1999-01-29 Kokusai Electric Co Ltd 半導体製造装置、及び該装置に於ける基板位置ずれ修正方法
WO1999002996A2 (en) 1997-07-11 1999-01-21 Genmark Automation Multiple point position scanning system
US6235634B1 (en) * 1997-10-08 2001-05-22 Applied Komatsu Technology, Inc. Modular substrate processing system
JPH11139559A (ja) 1997-11-05 1999-05-25 Jeol Ltd ウェハ搬送装置
US6132165A (en) 1998-02-23 2000-10-17 Applied Materials, Inc. Single drive, dual plane robot
JPH11297790A (ja) 1998-04-10 1999-10-29 Kokusai Electric Co Ltd 基板搬送方法及び半導体製造装置
US6085125A (en) 1998-05-11 2000-07-04 Genmark Automation, Inc. Prealigner and planarity teaching station
US6176668B1 (en) * 1998-05-20 2001-01-23 Applied Komatsu Technology, Inc. In-situ substrate transfer shuttle
US6213704B1 (en) * 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Method and apparatus for substrate transfer and processing
WO1999064207A1 (en) 1998-06-08 1999-12-16 Genmark Automation, Inc. Prealigner for substrates in a robotic system
US6242879B1 (en) * 2000-03-13 2001-06-05 Berkeley Process Control, Inc. Touch calibration system for wafer transfer robot
US6577923B1 (en) * 1999-12-23 2003-06-10 Applied Materials, Inc. Apparatus and method for robotic alignment of substrates

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6577923B1 (en) * 1999-12-23 2003-06-10 Applied Materials, Inc. Apparatus and method for robotic alignment of substrates
JP2022523156A (ja) * 2019-02-14 2022-04-21 パーシモン テクノロジーズ コーポレイション ２リンクアームを有するリニアロボット
JP7576555B2 (ja) 2019-02-14 2024-10-31 パーシモン テクノロジーズ コーポレイション ２リンクアームを有するリニアロボット

Also Published As

Publication number Publication date
EP1126506A3 (en) 2006-01-11
EP1126506A2 (en) 2001-08-22
KR20010062625A (ko) 2001-07-07
US6577923B1 (en) 2003-06-10
KR100753290B1 (ko) 2007-08-29
SG90220A1 (en) 2002-07-23

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