JP2001152398A5 - - Google Patents

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Publication number
JP2001152398A5
JP2001152398A5 JP2000237548A JP2000237548A JP2001152398A5 JP 2001152398 A5 JP2001152398 A5 JP 2001152398A5 JP 2000237548 A JP2000237548 A JP 2000237548A JP 2000237548 A JP2000237548 A JP 2000237548A JP 2001152398 A5 JP2001152398 A5 JP 2001152398A5
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JP
Japan
Prior art keywords
plating solution
plating
potential
concentration
additive
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Pending
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JP2000237548A
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English (en)
Japanese (ja)
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JP2001152398A (ja
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Publication date
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Priority to JP2000237548A priority Critical patent/JP2001152398A/ja
Priority claimed from JP2000237548A external-priority patent/JP2001152398A/ja
Publication of JP2001152398A publication Critical patent/JP2001152398A/ja
Publication of JP2001152398A5 publication Critical patent/JP2001152398A5/ja
Pending legal-status Critical Current

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JP2000237548A 1999-08-05 2000-08-04 電気めっき方法、めっき液評価方法、めっき装置、半導体装置の製造方法 Pending JP2001152398A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000237548A JP2001152398A (ja) 1999-08-05 2000-08-04 電気めっき方法、めっき液評価方法、めっき装置、半導体装置の製造方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP22261099 1999-08-05
JP11-222610 1999-09-14
JP26072999 1999-09-14
JP11-260729 1999-09-14
JP2000237548A JP2001152398A (ja) 1999-08-05 2000-08-04 電気めっき方法、めっき液評価方法、めっき装置、半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2001152398A JP2001152398A (ja) 2001-06-05
JP2001152398A5 true JP2001152398A5 (cg-RX-API-DMAC7.html) 2006-10-05

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ID=27330686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000237548A Pending JP2001152398A (ja) 1999-08-05 2000-08-04 電気めっき方法、めっき液評価方法、めっき装置、半導体装置の製造方法

Country Status (1)

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JP (1) JP2001152398A (cg-RX-API-DMAC7.html)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4672189B2 (ja) * 2001-06-11 2011-04-20 凸版印刷株式会社 配線基板または半導体回路の製造方法
JP3860111B2 (ja) * 2002-12-19 2006-12-20 大日本スクリーン製造株式会社 メッキ装置およびメッキ方法
JP4534983B2 (ja) * 2003-03-25 2010-09-01 凸版印刷株式会社 電気銅めっき液の分析方法、その分析装置
JP2004325441A (ja) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc 分析方法
WO2006110437A1 (en) * 2005-04-08 2006-10-19 The Trustees Of Columbia University In The City Of New York Systems and methods for monitoring plating and etching baths
JP4676350B2 (ja) * 2006-02-14 2011-04-27 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
TW201139754A (en) * 2010-02-24 2011-11-16 Sumitomo Bakelite Co Method of processing substrate and substrate processor
JP6170938B2 (ja) 2011-12-12 2017-07-26 ノベラス・システムズ・インコーポレーテッドＮｏｖｅｌｌｕｓ Ｓｙｓｔｅｍｓ Ｉｎｃｏｒｐｏｒａｔｅｄ 電気めっき溶液内のレベラー濃度の監視
US9689083B2 (en) 2013-06-14 2017-06-27 Lam Research Corporation TSV bath evaluation using field versus feature contrast
JP6011874B2 (ja) * 2013-07-01 2016-10-19 住友金属鉱山株式会社 めっき液に含まれる抑制剤の評価方法
CN103388172B (zh) * 2013-07-22 2016-06-22 苏州昕皓新材料科技有限公司 一种快速判断电镀添加剂性能的方法
US10094038B2 (en) 2015-04-13 2018-10-09 Lam Research Corporation Monitoring electrolytes during electroplating
US20180298515A1 (en) * 2015-04-27 2018-10-18 Jcu Corporation Method for managing copper sulfate plating solution
US10590560B1 (en) * 2018-08-22 2020-03-17 Eci Technology, Inc. Control of additive turnover in an electrodeposition solution
JP7291911B2 (ja) * 2019-05-30 2023-06-16 長野県 電気ニッケルめっき液中の添加剤濃度推定方法
CN115362285A (zh) 2020-03-30 2022-11-18 朗姆研究公司 调平化合物控制
CN117007102A (zh) * 2022-04-27 2023-11-07 安泰科技股份有限公司 一种电镀添加剂的定量分析方法和系统

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