JP2001124520A - 光学的に認識可能なマーカを備えた構造エレメント - Google Patents

光学的に認識可能なマーカを備えた構造エレメント

Info

Publication number
JP2001124520A
JP2001124520A JP2000250234A JP2000250234A JP2001124520A JP 2001124520 A JP2001124520 A JP 2001124520A JP 2000250234 A JP2000250234 A JP 2000250234A JP 2000250234 A JP2000250234 A JP 2000250234A JP 2001124520 A JP2001124520 A JP 2001124520A
Authority
JP
Japan
Prior art keywords
structural element
marker
edge
image processing
processing system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000250234A
Other languages
English (en)
Japanese (ja)
Inventor
Hans Hecht
ヘヒト ハンス
Gerhard Hueftle
ヒュフトレ ゲルハルト
Schalt Rainer
シャルト ライナー
Uwe Dr Konzelmann
コンツェルマン ウーヴェ
Stark Andreas
シュタルク アンドレアス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JP2001124520A publication Critical patent/JP2001124520A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6842—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow with means for influencing the fluid flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Guiding Agricultural Machines (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2000250234A 1999-08-21 2000-08-21 光学的に認識可能なマーカを備えた構造エレメント Pending JP2001124520A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19939825.9 1999-08-21
DE19939825A DE19939825A1 (de) 1999-08-21 1999-08-21 Bauelement mit einem optisch erkennbaren Marker

Publications (1)

Publication Number Publication Date
JP2001124520A true JP2001124520A (ja) 2001-05-11

Family

ID=7919255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000250234A Pending JP2001124520A (ja) 1999-08-21 2000-08-21 光学的に認識可能なマーカを備えた構造エレメント

Country Status (4)

Country Link
JP (1) JP2001124520A (it)
DE (1) DE19939825A1 (it)
FR (1) FR2799051A1 (it)
IT (1) IT1318755B1 (it)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012084606A (ja) * 2010-10-07 2012-04-26 Tokai Rika Co Ltd 部品実装部材及び部品実装方法
JP2017501559A (ja) * 2013-10-08 2017-01-12 ベシ ネーデルランズ ビー．ヴイ．Ｂｅｓｉ Ｎｅｔｈｅｒｌａｎｄｓ Ｂ．Ｖ． 電子部品を載せた担体の位置決め方法、及びそのような方法で製作された電子部品

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3538188B2 (ja) * 2002-04-02 2004-06-14 三菱電機株式会社 感熱式流量検出素子およびその製造方法
DE102010042022B4 (de) 2010-10-06 2022-12-15 Robert Bosch Gmbh Verfahren zur Herstellung einer Sensorvorrichtung und Sensorvorrichtung hergestellt nach einem solchen Verfahren

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2539206A1 (de) * 1975-09-03 1977-03-17 Siemens Ag Verfahren zur automatischen justierung von halbleiterscheiben
JPS59224123A (ja) * 1983-05-20 1984-12-17 Oki Electric Ind Co Ltd ウエハアライメントマ−ク
JP2538870B2 (ja) * 1986-01-28 1996-10-02 富士通株式会社 半導体装置
US5260771A (en) * 1988-03-07 1993-11-09 Hitachi, Ltd. Method of making semiconductor integrated circuit, pattern detecting method, and system for semiconductor alignment and reduced stepping exposure for use in same
JPH07335721A (ja) * 1994-06-13 1995-12-22 Mitsubishi Electric Corp アライメントマークを有する半導体装置
JPH08250391A (ja) * 1995-03-10 1996-09-27 Nikon Corp 位置検出用マーク及び位置検出方法
JPH10284359A (ja) * 1997-04-11 1998-10-23 Mitsubishi Electric Corp ウエハの認識装置及びウエハの認識方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012084606A (ja) * 2010-10-07 2012-04-26 Tokai Rika Co Ltd 部品実装部材及び部品実装方法
JP2017501559A (ja) * 2013-10-08 2017-01-12 ベシ ネーデルランズ ビー．ヴイ．Ｂｅｓｉ Ｎｅｔｈｅｒｌａｎｄｓ Ｂ．Ｖ． 電子部品を載せた担体の位置決め方法、及びそのような方法で製作された電子部品

Also Published As

Publication number Publication date
FR2799051A1 (fr) 2001-03-30
ITMI20001870A1 (it) 2002-02-10
ITMI20001870A0 (it) 2000-08-10
IT1318755B1 (it) 2003-09-10
DE19939825A1 (de) 2001-03-01

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