FR2799051A1 - Composant avec un repere a reconnaissance optique - Google Patents

Composant avec un repere a reconnaissance optique Download PDF

Info

Publication number
FR2799051A1
FR2799051A1 FR0010742A FR0010742A FR2799051A1 FR 2799051 A1 FR2799051 A1 FR 2799051A1 FR 0010742 A FR0010742 A FR 0010742A FR 0010742 A FR0010742 A FR 0010742A FR 2799051 A1 FR2799051 A1 FR 2799051A1
Authority
FR
France
Prior art keywords
component
marker
cavity
edge
image processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR0010742A
Other languages
English (en)
French (fr)
Inventor
Hans Hecht
Gerhard Hueftle
Rainer Schard
Uwe Konzelmann
Andreas Stark
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2799051A1 publication Critical patent/FR2799051A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6842—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow with means for influencing the fluid flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Guiding Agricultural Machines (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Supply And Installment Of Electrical Components (AREA)
FR0010742A 1999-08-21 2000-08-21 Composant avec un repere a reconnaissance optique Withdrawn FR2799051A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19939825A DE19939825A1 (de) 1999-08-21 1999-08-21 Bauelement mit einem optisch erkennbaren Marker

Publications (1)

Publication Number Publication Date
FR2799051A1 true FR2799051A1 (fr) 2001-03-30

Family

ID=7919255

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0010742A Withdrawn FR2799051A1 (fr) 1999-08-21 2000-08-21 Composant avec un repere a reconnaissance optique

Country Status (4)

Country Link
JP (1) JP2001124520A (it)
DE (1) DE19939825A1 (it)
FR (1) FR2799051A1 (it)
IT (1) IT1318755B1 (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3538188B2 (ja) * 2002-04-02 2004-06-14 三菱電機株式会社 感熱式流量検出素子およびその製造方法
DE102010042022B4 (de) 2010-10-06 2022-12-15 Robert Bosch Gmbh Verfahren zur Herstellung einer Sensorvorrichtung und Sensorvorrichtung hergestellt nach einem solchen Verfahren
JP2012084606A (ja) * 2010-10-07 2012-04-26 Tokai Rika Co Ltd 部品実装部材及び部品実装方法
NL2011575C2 (en) * 2013-10-08 2015-04-09 Besi Netherlands B V Method for positioning a carrier with electronic components and electronic component produced with such method.

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4090068A (en) * 1975-09-03 1978-05-16 Siemens Aktiengesellschaft Process for the automatic adjustment of semiconductor wafers
JPS62173750A (ja) * 1986-01-28 1987-07-30 Fujitsu Ltd 半導体装置
US4824254A (en) * 1983-05-20 1989-04-25 Oki Electric Industry Co., Ltd. Alignment marks on semiconductor wafers and method of manufacturing the marks
US5432608A (en) * 1988-03-07 1995-07-11 Hitachi, Ltd. Method of making semiconductor integrated circuit, pattern detecting method, and system for semiconductor alignment and reduced stepping exposure for use in same
US5861320A (en) * 1995-03-10 1999-01-19 Nikon Corporation Position detection mark and position detection method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335721A (ja) * 1994-06-13 1995-12-22 Mitsubishi Electric Corp アライメントマークを有する半導体装置
JPH10284359A (ja) * 1997-04-11 1998-10-23 Mitsubishi Electric Corp ウエハの認識装置及びウエハの認識方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4090068A (en) * 1975-09-03 1978-05-16 Siemens Aktiengesellschaft Process for the automatic adjustment of semiconductor wafers
US4824254A (en) * 1983-05-20 1989-04-25 Oki Electric Industry Co., Ltd. Alignment marks on semiconductor wafers and method of manufacturing the marks
JPS62173750A (ja) * 1986-01-28 1987-07-30 Fujitsu Ltd 半導体装置
US5432608A (en) * 1988-03-07 1995-07-11 Hitachi, Ltd. Method of making semiconductor integrated circuit, pattern detecting method, and system for semiconductor alignment and reduced stepping exposure for use in same
US5861320A (en) * 1995-03-10 1999-01-19 Nikon Corporation Position detection mark and position detection method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 013 (E - 573) 14 January 1988 (1988-01-14) *

Also Published As

Publication number Publication date
ITMI20001870A1 (it) 2002-02-10
JP2001124520A (ja) 2001-05-11
ITMI20001870A0 (it) 2000-08-10
IT1318755B1 (it) 2003-09-10
DE19939825A1 (de) 2001-03-01

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