IT1318755B1 - Componente con un marcatore riconoscibile otticamente - Google Patents

Componente con un marcatore riconoscibile otticamente

Info

Publication number
IT1318755B1
IT1318755B1 IT2000MI001870A ITMI20001870A IT1318755B1 IT 1318755 B1 IT1318755 B1 IT 1318755B1 IT 2000MI001870 A IT2000MI001870 A IT 2000MI001870A IT MI20001870 A ITMI20001870 A IT MI20001870A IT 1318755 B1 IT1318755 B1 IT 1318755B1
Authority
IT
Italy
Prior art keywords
component
optically recognizable
recognizable marker
marker
optically
Prior art date
Application number
IT2000MI001870A
Other languages
English (en)
Inventor
Hans Hecht
Gerhard Hueftle
Rainer Schard
Uwe Konzelmann
Andreas Stark
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20001870A0 publication Critical patent/ITMI20001870A0/it
Publication of ITMI20001870A1 publication Critical patent/ITMI20001870A1/it
Application granted granted Critical
Publication of IT1318755B1 publication Critical patent/IT1318755B1/it

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6842—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow with means for influencing the fluid flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Guiding Agricultural Machines (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Supply And Installment Of Electrical Components (AREA)
IT2000MI001870A 1999-08-21 2000-08-10 Componente con un marcatore riconoscibile otticamente IT1318755B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19939825A DE19939825A1 (de) 1999-08-21 1999-08-21 Bauelement mit einem optisch erkennbaren Marker

Publications (3)

Publication Number Publication Date
ITMI20001870A0 ITMI20001870A0 (it) 2000-08-10
ITMI20001870A1 ITMI20001870A1 (it) 2002-02-10
IT1318755B1 true IT1318755B1 (it) 2003-09-10

Family

ID=7919255

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2000MI001870A IT1318755B1 (it) 1999-08-21 2000-08-10 Componente con un marcatore riconoscibile otticamente

Country Status (4)

Country Link
JP (1) JP2001124520A (it)
DE (1) DE19939825A1 (it)
FR (1) FR2799051A1 (it)
IT (1) IT1318755B1 (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3538188B2 (ja) * 2002-04-02 2004-06-14 三菱電機株式会社 感熱式流量検出素子およびその製造方法
DE102010042022B4 (de) 2010-10-06 2022-12-15 Robert Bosch Gmbh Verfahren zur Herstellung einer Sensorvorrichtung und Sensorvorrichtung hergestellt nach einem solchen Verfahren
JP2012084606A (ja) * 2010-10-07 2012-04-26 Tokai Rika Co Ltd 部品実装部材及び部品実装方法
NL2011575C2 (en) * 2013-10-08 2015-04-09 Besi Netherlands B V Method for positioning a carrier with electronic components and electronic component produced with such method.

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2539206A1 (de) * 1975-09-03 1977-03-17 Siemens Ag Verfahren zur automatischen justierung von halbleiterscheiben
JPS59224123A (ja) * 1983-05-20 1984-12-17 Oki Electric Ind Co Ltd ウエハアライメントマ−ク
JP2538870B2 (ja) * 1986-01-28 1996-10-02 富士通株式会社 半導体装置
US5260771A (en) * 1988-03-07 1993-11-09 Hitachi, Ltd. Method of making semiconductor integrated circuit, pattern detecting method, and system for semiconductor alignment and reduced stepping exposure for use in same
JPH07335721A (ja) * 1994-06-13 1995-12-22 Mitsubishi Electric Corp アライメントマークを有する半導体装置
JPH08250391A (ja) * 1995-03-10 1996-09-27 Nikon Corp 位置検出用マーク及び位置検出方法
JPH10284359A (ja) * 1997-04-11 1998-10-23 Mitsubishi Electric Corp ウエハの認識装置及びウエハの認識方法

Also Published As

Publication number Publication date
FR2799051A1 (fr) 2001-03-30
ITMI20001870A1 (it) 2002-02-10
JP2001124520A (ja) 2001-05-11
ITMI20001870A0 (it) 2000-08-10
DE19939825A1 (de) 2001-03-01

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