DE60018655D1 - Prüfvorrichtung - Google Patents

Prüfvorrichtung

Info

Publication number
DE60018655D1
DE60018655D1 DE60018655T DE60018655T DE60018655D1 DE 60018655 D1 DE60018655 D1 DE 60018655D1 DE 60018655 T DE60018655 T DE 60018655T DE 60018655 T DE60018655 T DE 60018655T DE 60018655 D1 DE60018655 D1 DE 60018655D1
Authority
DE
Germany
Prior art keywords
tester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60018655T
Other languages
English (en)
Other versions
DE60018655T2 (de
Inventor
Mitsutoshi Higashi
Kei Murayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Publication of DE60018655D1 publication Critical patent/DE60018655D1/de
Application granted granted Critical
Publication of DE60018655T2 publication Critical patent/DE60018655T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE60018655T 1999-08-27 2000-08-25 Prüfvorrichtung Expired - Lifetime DE60018655T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24116299 1999-08-27
JP24116299 1999-08-27

Publications (2)

Publication Number Publication Date
DE60018655D1 true DE60018655D1 (de) 2005-04-21
DE60018655T2 DE60018655T2 (de) 2005-08-04

Family

ID=17070191

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60018655T Expired - Lifetime DE60018655T2 (de) 1999-08-27 2000-08-25 Prüfvorrichtung

Country Status (4)

Country Link
US (1) US6738504B1 (de)
EP (1) EP1079420B1 (de)
KR (1) KR100711225B1 (de)
DE (1) DE60018655T2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4576062B2 (ja) * 2001-03-21 2010-11-04 富士機械製造株式会社 リード位置検出方法，電気部品装着方法およびリード位置検出装置
US7428326B1 (en) * 2001-11-30 2008-09-23 Universal Instruments Corporation Method for improving reliability in a component placement machine by vacuum nozzle inspection
US7755376B2 (en) 2005-10-12 2010-07-13 Delta Design, Inc. Camera based pin grid array (PGA) inspection system with pin base mask and low angle lighting
US9703623B2 (en) 2014-11-11 2017-07-11 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Adjusting the use of a chip/socket having a damaged pin
JP6829946B2 (ja) * 2016-04-28 2021-02-17 川崎重工業株式会社 部品検査装置および方法
WO2019138469A1 (ja) * 2018-01-10 2019-07-18 株式会社Ｆｕｊｉ 作業機、及び極性の判定方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4821157A (en) 1986-02-21 1989-04-11 Hewlett-Packard Co. System for sensing and forming objects such as leads of electronic components
NL8601818A (nl) 1986-07-11 1988-02-01 Picanol Nv Werkwijze om de positie van de inslagdraden van een weefsel te kontroleren.
JPS63276300A (ja) 1987-05-07 1988-11-14 Fujitsu Ltd ピン曲り検出方法
US5115475A (en) * 1990-06-04 1992-05-19 Motorola, Inc. Automatic semiconductor package inspection method
JP2870142B2 (ja) * 1990-07-17 1999-03-10 日本電気株式会社 コプラナリティ測定方法及びその装置
US5097516A (en) 1991-02-28 1992-03-17 At&T Bell Laboratories Technique for illuminating a surface with a gradient intensity line of light to achieve enhanced two-dimensional imaging
US5214841A (en) * 1992-09-23 1993-06-01 Emhart Inc. Machine for placing surface mount components
US5648853A (en) 1993-12-09 1997-07-15 Robotic Vision Systems, Inc. System for inspecting pin grid arrays
JP3385442B2 (ja) 1994-05-31 2003-03-10 株式会社ニュークリエイション 検査用光学系および検査装置
US5991434A (en) * 1996-11-12 1999-11-23 St. Onge; James W. IC lead inspection system configurable for different camera positions
CN1113390C (zh) 1997-03-05 2003-07-02 西门子公司 检查连接球存在的方法
US6262803B1 (en) 1998-09-10 2001-07-17 Acuity Imaging, Llc System and method for three-dimensional inspection using patterned light projection
JP2001013085A (ja) 1999-06-30 2001-01-19 Nidek Co Ltd 欠陥検査装置
JP4821157B2 (ja) * 2004-03-31 2011-11-24 大日本印刷株式会社 高分子化合物、高透明性ポリイミド、樹脂組成物及び物品
KR101509782B1 (ko) * 2009-08-27 2015-04-08 현대자동차주식회사 차량의 연료펌프 윤활유 벤트 구조

Also Published As

Publication number Publication date
EP1079420A3 (de) 2001-08-08
EP1079420B1 (de) 2005-03-16
EP1079420A2 (de) 2001-02-28
KR20010021438A (ko) 2001-03-15
US6738504B1 (en) 2004-05-18
DE60018655T2 (de) 2005-08-04
KR100711225B1 (ko) 2007-04-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition