FR2799051A1 - COMPONENT WITH OPTICAL RECOGNITION MARKING - Google Patents

Abstract

Component (2) having a marker (1) recognizable by an optical image processing system for defining a mounting position of a component using the marker. The defined machining of the edges (3) or shaping of at least one marker (1) allows a quality marker independent of the manufacturing technique, that of lighting and the quality of the material and thus allows to produce a long-term stable marker so that the optical image processing system does not require adaptation to modified conditions and so that the contrast of the marker (1) with respect to the surrounding area is good, so that the edges (3) and thus the mounting position of the component can be defined and reproduced very precisely on the component.

Description

STATE OF THE ART The present invention relates to a component having

  at least one marker recognizable by a milking system

optical image.

  The invention also relates to a method for recognizing at least one marker of a component having at least one marker recognizable by the optical image processing system, and to a method for determining a position.

  for mounting at least one component in a milking system

  optical image ment with a component or at least one.

  In the case of very precise assemblies of electronic chips or of components in or on circuits, image processing systems using an optical lighting technique, an observation camera and an operating computer are used to determine a mounting position for controlling a positioning system with the component to be mounted. Recognition of a mounting position uses rounding, which is generally unwanted but linked to the production of edges in the area of the

  mounting position of the electronic chip. These rounded areas

  dies appear in bright field lighting, under the

  form of coaxial reflected light from a light source

  as dark in the observation camera and consti-

  thus kill an exploitable contrast with respect to the zones

planes that appear clear.

  The disadvantages are related to the fact that the ar-

  rounds are very little pronounced, which does not give cons

  sufficient traste between a rounding and the surrounding area

  rounding. This does not detect my-

  niere specifies the position of the edge or even not to de-

  tect at all; in addition, rounding may vary due to

  fabrications, so that the contrast varies and the

  poses the risk of being positioned in different locations

  rents. Rounding caused for example by withdrawals from

  are dependent on the sharpening of the manufacturing tools

  tion and change over time. It would be possible to adapt the image processing system to the variation

  continues rounding. But if you use multiple systems,

  manufacturing, we encounter difficulties, because the ar-

  The components produced at the same time in different manufacturing systems are different and therefore it would be difficult to adapt the image processing system 5 appropriately. Advantages of the invention The object of the present invention is to remedy these drawbacks and to this end relates to a component of the

  type defined above characterized in that at least one

  has at least one edge which is inclined, rounded

or flattened.

  The invention also relates to a method of the type

  defined above, characterized in that the processing system

  Image ment includes an optical light source, a camera

  observation camera and an operating computer and to recognize at least one marker, bright field lighting or dark field lighting with lighting is used

coaxial incident.

  According to another advantageous characteristic of the invention, at least one marker on the component is first produced by a relative position determination using the image processing system to define a mounting position for the component, then transmits the mounting position to the positioning system and finally at least the part is placed by the positioning system in a position of

mounting defined on the component.

  The component according to the invention or the method has the advantage compared to the state of the art, of being independent of the manufacturing technique, of the lighting technique or of the quality of the material and of constituting thus much more stable markers or markers in the long term, so that the image processing system does not have to be adapted to variable conditions but corresponds to a defined shape of the edges or of the shaping. The contrast of the marker with respect to its surrounding area is so good that the edges and thus the mounting position of a part in or on the component are defined more precisely and are more reproducible. This reduces manufacturing time by avoiding long adaptations of the image processing system. The more precise positioning improves inter alia the functioning of the electronic chip for example the reproducible behavior with respect to the driving current of a sensor chip in a sensor support of a mass air flow meter device. The cost of

  production is also reduced thanks to better quality

  lity. According to a particularly advantageous advantage, a simple geometric modification or the shape of the component

  without influencing the function gives the desired result.

  According to other advantageous features of the invention: an inclined, rounded or flat surface of at least one marker is accentuated to give good contrast in the image processing system, at least one marker is found outside or in the area of a mounting position of at least one component to be mounted in the mounting position on the component, a relative position is entered

  at least one edge on the component by the processing system

  image so that from the position of at least one existing edge, we can define the mounting position of at least one component to be mounted, at least one marker is produced by a cavity or a boss on the element with an edge, at least one marker has a round and / or polygonal cross-sectional surface at an upper surface of the component, the component is a sensor support with a sensor bowl in the form of a cavity for receiving for a measuring element of a mass air measuring device,

  in particular the mass of air drawn in from the combustion engine

  internal tion, at least one marker is formed by a fillet edge or a cavity along the edges in the cavity, the component is made of metal, semiconductor, ceramic or

made of plastic.

  The application of the marker (s) during the pro-

  yielded from manufacturing the component and a complete grasp of the outline of the cavity or the boss are particularly advantageous.

  In addition, it is advantageous to install the

  in the mounting position area.

  Drawings: The present invention will be described below in more detail with the aid of various examples of

  realization represented in a simplified way in the

  attached sins in which: - Figures la-lg show a top view and a sectional view of different embodiments of markers for a component, - Figures 2a-2f show different views of a cavity

  without marker and two possibilities of marker on a com-

  posing, - Figure 3 shows an example of a sensor support for a mass air flow device,

  - Figure 4 is a section along line IV-IV of the figure

  gure 3, - figure 5 shows two markers on a component outside a cavity, - figure 6 shows the original image of an observation camera, - figure 7 is a schematic view of the bright field and dark field lighting, - figure 8 shows the effect of bright field lighting

on a marker.

  Description of the exemplary embodiments

  Figures la-lg are top views and side views of component 2 with examples of markers (marks). Figure la is a top view of the component 2 with a marker 1 having at least one edge 3. The marker 1 has for example a square section at the height of the upper surface 12 of the component 2. The surface of the section in height of the upper surface 2 can for example also

  be triangular, rectangular or polygonal.

  Figures lb and lc show by way of example two different embodiments of the marker 1 in section along the line A-A of Figure la. The marker 1 is for example constituted by a triangular boss 6 on the component 2 (FIG. 1b) or by a triangular cavity 7 (FIG. 1c) in the component 2. The boss 6 or the cavity 7 has at least one inclined surface 8. It does not matter which side the inclined surface is provided for. 8. Different alignment of the surface

  inclined 8 is also shown in Figures lb, lc.

  The edge 3 of Figures lb, lc is for example perpendicular to the surface 12. The boss 6 can also be for example conical. Another example of component marker 1 shape

2 is given by FIG. Ld.

  FIG. 1d is a top view of the component 2 with a marker 1 having at least one edge 3. The marker 1 has for example a surface of semicircular section at the height of the surface 12 of the component 2. The surface of the section at the height of the upper surface 12 may for example also be in the form of a half-ellipse. The marker

  1 is made by way of example as a boss 6 as the

  be the sectional view along line B-B of FIG. 1d given in FIG. The marker can also be produced in the form of a cavity 7. The marker then consists of a boss 13. The curvature of the boss 13 can be convex or

  concave. The edge 3 of figure le is for example perpendicular

ring on the surface 12.

  Figure if shows another example of a form of

marker 1 for component 2.

  Figure if is a top view of component 2 with the marker. The marker 1 has for example a round cross-sectional area at the height of the upper surface 12. The cross-sectional area of the upper surface 12

  can also be of form, for example elliptical. On Tue-

  queur 1 is for example made as a cavity 7 of frustoconical section as shown in Figure lg by a cut the

  along line C-C in Figure lf.

  The cavity 7 can also have a cross section

semi-circular or semi-elliptical.

  Figure 2 shows as an example how a

  rectangular cavity 15 can receive markers 1. The fi

  gure 2a is a top view of a component 2 having a

  vity 15 of rectangular shape at the level of the upper surface

  lower 12. The cavity has a rectangular bottom 16 and bounded by edges 3. The cavity 15 and the bottom 16 can also have another polygonal and / or round geometry.5 FIG. 2b shows a section along line a-

  a of Figure 2a without marker 1 made directly.

  The edge 3 is perpendicular to the surface 12 and / or the bottom 16. In FIG. 2c, the component 2 is produced to form a marker 1 resulting from the finishing of the edge 3 on or in

  the cavity of component 2 according to FIG. 2a or also manufacture

that directly.

  Possible developments of this marker 1 are given in FIGS. 2d, 2e representing a section along

line b-b in Figure 2c.

  Figure 2d shows an inclined edge 3 like that of Figure 2b at the height of the upper surface 12 by means of the inclined surface 8 relative to the cavity so that the section of the cavity 15 is larger at the surface higher than at bottom level 16. A

  instead of the inclined surface 8, one could also pre-

  see any rounding 13. The inclined surface 8 or the rounding 13 can go from the level of the upper surface 12 to the level of the bottom 16. But this is not necessary

  as also shown in Figure 2d.

  The marker 1 can also be produced to form a cavity 7 in the bottom 16 of the cavity 15 as shown in FIG. 2e. By comparison with FIG. 1c or FIG. 1g, the bottom 16 constitutes the upper surface 12 from which a cavity is made 7. In place of the cavity 7, it is also possible to make a boss 6 at the level

  of edge 3 (Figure 2b). The cavity 7 or a boss 6 eventually

  can be realized as already described in Figure 1. In particular, the alignment of the

  inclined surface 8 of the cavity 7 plays no role.

  The inclined surface 8 of the inclined edges 3 (fi-

  gure 2b) of the rectangular cavity 15 of FIG. 2d defi-

  nit the position and size of the cavity, which allows to determine a mounting position for a microchip or a component. To determine the mounting position, it is not necessary to grasp the entire contour of the bottom 16 of the cavity 15 or the section of the cavity 15 at

  the upper surface 12. It suffices to determine a posi-

  tion of two non-opposing markers. These are, for example, markers 17, 18 shown in FIG. 2f. Markers

  17, 18 form part of the marker 1 of FIGS. 2d, 2e.

  Marker 1 in Figure 2c is shown in broken lines.

  pus. The production of markers 17, 18 depends on the modes of

realization of Figures 1, 2d, 2e.

  Markers 17, 18 do not touch each other

  because the point of intersection of these two edges can

  be calculated, if the shape of the cavity 15 (for example a rec-

  tangle) is known. Like the size of the known cavity, it is also possible to calculate other vertices of the cavity 15, which makes it possible to precisely position the component.

in the cavity 15.

  For each other geometric shape and dimension

  or mounting position of an electronic chip or other com-

  posants in a cavity 15 which exist for example and which

  are known to the image processing system,

  Minimize beforehand the number and the nature of markers 1 which are necessary to define the position and the size of the

cavity 15.

  At least one marker 1 can be produced by an additional cavity 7 or a boss 6 or as a leave of at least one edge 3 of the component 2 during the manufacture of a

  component 2 or at least during an additional step.

  Figure 3 shows a sensor holder 20 as

  example of a component which is part of a device for measuring the mass of a fluid, in particular the mass of air as-

  hacked by an internal combustion engine. The construction of the sensor support 20 and of the air mass measurement device is described in documents DE 44 26 102 C2 or 35 US 5 693 879.

  The sensor support 20 comprises a sheet metal element 22 connected to a base support 21; this sheet metal element is provided with a plastic surround 23. The sensor support 20 has an upstream edge 24. The sensor support 20 is provided with a cavity 27 with a bottom 28. The bottom 28 of the cavity is divided by a channel 35 into a bearing surface 36 and a sensor base surface 28. The bearing surface 36 has four edges 42a-d; an edge 42d constitutes a

  ridge for channel 35. Similarly, the surface 38 of the bottom of the cap-

  tor has four edges 43a-d; an edge 43b constitutes an edge for the channel 35. In the cavity 27 of the sensor, there has been mounted a component or a measuring element 46 shown here in broken lines; this component is swept away by the

  fluid. The assembly procedure will be described later.

  The cavity 27 of the sensor is provided with two cutouts 47, 47 ′ parallel to the upstream leading edge 24 and forming the edges of the cavity 27 of the sensor. The cuts 47, 47 ′ have a ramp 8 which already exists and will no longer be considered in this

construction as marker 1.

  At the edges 42a-c, 43a, c, d of the sur-

  bearing face 36 and the base surface of the sensor 38, starting for example to dig as shown in the

  FIG. 2e, a ramp 8 is produced which then constitutes a step

queur 1.

  Marker 1 may consist of an inclined surface of the stop 42d, 43b of channel 35 at the bottom

  27 of the sensor cavity or at the bottom of the channel 35.

  We can for example use the existing ramp 8 of the cavities

47, 47 'as marker 1.

  Figure 4 is a section along the line IV-IV of Figure 3. It shows the sheet metal element 22 surrounded by the plastic element 23. The marker 1 is for example provided in a cavity 7 in the form of 'A ramp 8 in the bottom surface of the sensor 38. This marker 1 can

  be carried out as described in the part of

  see Figure 2e. Markers 1 are made directly

  tement by a suitable shaping tool during the shaping of the plastic element 23 of the sensor support 20. The mounting of the measuring element 46 in the

  the sensor cavity is therefore more precise.

  Figure 5 shows component 2 with a cavity

  rectangular 15 in which we want to place an electronic chip

  or a component represented here as a metering element

  sure 46 which must be positioned in the middle very precisely. On component 2, apart from the mounting position of the measuring element 46 and the cavity 15, there are

  two markers 1, 1 '(see figures la-lg). The number of mar-

  queurs 1, 1 'between them do not necessarily correspond to the length of an edge 51 or that of the edge of the cavity 15 opposite the edge 51. The direct connection of the markers 1, 1' form a virtual straight line 52. The virtual straight line 52 is at a predetermined distance 56 from the edge 51 or from the edge opposite to the edge 51 in the cavity 15, because the edge 51 or the opposite edge and the line 52 are parallel. But it is not necessary that the line 52 and that the edge 51 or the opposite edge are parallel. It only takes one

  position of line 52 and edge 51 or oppo-

  known. There exists a coordinate system 57 having a zero point, determined with respect to component 2. If we know the distance of the markers 1, 1 'relative to each other, the position of the markers 1, 1' in the coordinate system 57, the distance 56 or the position of the line 52

  and edge 51 or the opposite edge, as well as a geometry-

  sort of cavity 15, you can mount the measuring element 46

and proceed with its installation.

  It is thus possible to produce markers 1, 1 ′ on a component 2 and which are not located

  outside the mounting position. As some inform

  mations of a cavity such as the shape (for example rectan-

  gular) and the dimensions are known, by a choice

  appropriate at least one marker 1 on the bottom 2 and the po-

  relative position of the marker with respect to the cavity 15, the mounting position can be defined. But it is also

  the component to be mounted must be placed in a box

  vity 15 or on a boss. The mounting position may not be

  only part of a flat surface of component 2.

  FIG. 6 represents the image of a camera of a shooting system. This camera image is processed by an operating computer 81 (FIG. 7), then according to

  a determined algorithm to form a scale image.

  The rounded edges form an optimum passage in the

  image image giving ideal contrast. This is how one can precisely define a bend 63 and an edge 64. The bend 63 and the edge 64 are indicated by a broken line. A smooth, shiny component 2 surface means that there will be no disturbance in the scale image.

  Figure 7 schematically shows an installation

  measurement of lighting by a bright field. The composition

  sant 2 is illuminated by a light source 70 with coaxial light 71. The camera 72 receives the reflected image 75 coming from the component 2. The camera 72 and the light source 70 form an angle between them. The light scattered 76 by the component 2 is not received by the camera 72. The reflecting surfaces appear as clear, because they are perceived by the camera 72 while the scattering surfaces appear as dark, since they are not received by the camera 72 The principle of lighting by a dark field is similar. The light source 70 illuminates a component 2 with coaxial light. Camera 72 is shown

  in this case in dashed line position, because this po-

  sition is different from that of component 2 and receives all the scattered light 76, so that the scattered surfaces

  and the reflective surfaces appear dark.

  The camera 72 is connected to an operating computer 81

  which uses the data from camera 72 and transmits the pa-

  rameters necessary for determining the position of

  mounting to a positioning system 82.

  Figure 8 schematically shows how

  lighting by a bright field on a shape edge

  ideal, vertical 3 (figure 8a) and on an inclined edge 3.

  The angle x between the light source 70 and the camera 72 is

equal to zero or close to zero.

  The ideally vertical edge 3 according to FIG. 8a

  reflects each of the four rays 87 indicated schematically-

  so that the camera image according to figure 8b,

  that is to say the top view given in FIG. 8a represented

feels a white surface.

  In FIG. 8c, the edge 3 is for example inclined

  born, so two of the beams 87 are not reflected

  to camera 72. This is true for all rear beams.

  running at the level of marker 1 in its inclined surface 8.

  The camera image (FIG. 8d) gives a band of width 88 corresponding to the vertical projection of the marker 1 at the

figure 8c.

  The mounting of an electronic chip or a

  health in another component 2 will be done as has already been

  shown in connection with Figures 3 and 5.

  After the optical capture when determining the mounting position of the electronic chip or of the component by the operating computer 81, this information is transmitted to the positioning system 82; to position

  the component such as the measuring element 46, the ef-

  use the gripper system 84 to pick up and move

  cement so that the component, after moving in a

  plane parallel to the mounting position, then by a

  perpendicular to the assembly plane, can be set

  predefined mounting position. We can have an assembly in-

  more precise if, by installing the light source and the camera, the mounting position is again defined after weighting the gripping system in the plane and possible error / tolerance correction of the gripping system by the system positioning 82 to

  by means of a corrective movement which ensures its compensation

  station. By moving perpendicular to the mounting position, the component can then be placed in its position

mounting.

Claims (6)

CLAIMS S) Component having at least one marker recognizable by an optical image processing system, characterized in that at least one marker (1) has at least one edge (3) which is inclined (8), rounded ( 13) or flattened.   2) Component according to claim 1, characterized in that an inclined surface (8), a rounded (13) or a flat surface of at least one marker (1) is accentuated to give a   good contrast in the image processing system.   3) Component according to claim 2, characterized in that at least one marker (1) is located outside or in the region of a mounting position of at least one component to be mounted in   mounting position on the component (2).   4) Component according to claim 3, characterized in that a relative position of at least one edge (3) on the component (2) is entered by the image processing system so that from the position d '' at least one existing edge (3), we can define the mounting position of at least one component to be assembled.    ) Component according to claim 4, characterized in that at least one marker (1) is produced by a cavity (7) or a   boss (6) on the element (2) with an edge (3).   6) Component according to claim 5, characterized in that at least one marker (1) has a surface of round and / or polygonal cross section at an upper surface (12) of component (2).   7) Component according to any one of claims 1 to 6, characterized in that   component (2) is a sensor support (20) with a cu-   sensor cell (27) in the form of a cavity (15) for receiving a measurement element (46) of a mass air measurement device, in particular the mass of the air drawn in from the internal combustion.   8) Component according to claim 7, characterized in that at least one marker (1) is formed by a fillet edge or a cavity (7) along the edges (42, 43) in the cavity (27). 9) Component according to claim 1, characterized in that   component (2) is made of metal, semiconductor, ceramic than or plastic.    ) Method for recognizing at least one marker of a component having at least one marker recognizable by the   optical image processing system, according to the claim   tion 1, characterized in that the image processing system comprises an optical lighting source (70), an observation camera (72) and an operating computer (81) and for recognizing at least one marker, using bright field lighting or dark field lighting with coaxial incident lighting (71). 11) Method for determining an installation position of at least   at least one component in an image processing system op-   tick with a component or at least one component and a mar-   queur according to claim 1, characterized in that   we first realize by a relative determination of posi-   tion, at least one marker (1) on the component (2) using the image processing system to define a mounting position of the component (46), then the mounting position is transmitted to the positioning system ( 82) and finally at least the part (46) is placed by the positioning system (82) in a mounting position defined on the component (2)