JP2001035994A - 半導体集積回路装置およびシステム基板 - Google Patents

半導体集積回路装置およびシステム基板

Info

Publication number
JP2001035994A
JP2001035994A JP11201965A JP20196599A JP2001035994A JP 2001035994 A JP2001035994 A JP 2001035994A JP 11201965 A JP11201965 A JP 11201965A JP 20196599 A JP20196599 A JP 20196599A JP 2001035994 A JP2001035994 A JP 2001035994A
Authority
JP
Japan
Prior art keywords
chip
integrated circuit
semiconductor integrated
printed wiring
well
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11201965A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001035994A5 (enExample
Inventor
Tomoyoshi Momohara
朋美 桃原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP11201965A priority Critical patent/JP2001035994A/ja
Publication of JP2001035994A publication Critical patent/JP2001035994A/ja
Publication of JP2001035994A5 publication Critical patent/JP2001035994A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Dram (AREA)
JP11201965A 1999-07-15 1999-07-15 半導体集積回路装置およびシステム基板 Pending JP2001035994A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11201965A JP2001035994A (ja) 1999-07-15 1999-07-15 半導体集積回路装置およびシステム基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11201965A JP2001035994A (ja) 1999-07-15 1999-07-15 半導体集積回路装置およびシステム基板

Publications (2)

Publication Number Publication Date
JP2001035994A true JP2001035994A (ja) 2001-02-09
JP2001035994A5 JP2001035994A5 (enExample) 2005-06-23

Family

ID=16449708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11201965A Pending JP2001035994A (ja) 1999-07-15 1999-07-15 半導体集積回路装置およびシステム基板

Country Status (1)

Country Link
JP (1) JP2001035994A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7045899B2 (en) 2002-10-15 2006-05-16 Oki Electric Industry Co., Ltd. Semiconductor device and fabrication method of the same
KR100744979B1 (ko) * 2005-05-20 2007-08-02 엔이씨 일렉트로닉스 가부시키가이샤 아날로그 반도체 칩 및 디지털 반도체 칩이 순서대로적층된 ｓｉｐ 타입 패키지, 및 그 제조 방법
JP2010002878A (ja) * 2008-06-20 2010-01-07 Renei Kagi Kofun Yugenkoshi ソース・ドライバおよび液晶ディスプレイ
US7656030B2 (en) 2006-01-11 2010-02-02 Renesas Technology Corp. Semiconductor device
EP2720267A1 (en) 2012-10-15 2014-04-16 J-Devices Corporation Semiconductor storage device and method for producing the same

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5737867A (en) * 1980-08-18 1982-03-02 Mitsubishi Electric Corp Semiconductor device
JPH05109978A (ja) * 1991-10-17 1993-04-30 Fujitsu Ltd 半導体装置
JPH07273275A (ja) * 1994-03-29 1995-10-20 Toshiba Corp 半導体装置
JPH09260441A (ja) * 1996-03-26 1997-10-03 Mitsubishi Electric Corp 半導体装置
JPH1070243A (ja) * 1996-05-30 1998-03-10 Toshiba Corp 半導体集積回路装置およびその検査方法およびその検査装置
JPH10256483A (ja) * 1997-03-11 1998-09-25 Toshiba Corp Ｍｏｓ型半導体集積回路
JPH113969A (ja) * 1997-06-13 1999-01-06 Matsushita Electric Ind Co Ltd チップ部品が積層された基板部品
JPH11121686A (ja) * 1997-10-21 1999-04-30 Rohm Co Ltd 多層チップの組み立て方法
JPH11135714A (ja) * 1997-10-29 1999-05-21 Rohm Co Ltd 半導体装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5737867A (en) * 1980-08-18 1982-03-02 Mitsubishi Electric Corp Semiconductor device
JPH05109978A (ja) * 1991-10-17 1993-04-30 Fujitsu Ltd 半導体装置
JPH07273275A (ja) * 1994-03-29 1995-10-20 Toshiba Corp 半導体装置
JPH09260441A (ja) * 1996-03-26 1997-10-03 Mitsubishi Electric Corp 半導体装置
JPH1070243A (ja) * 1996-05-30 1998-03-10 Toshiba Corp 半導体集積回路装置およびその検査方法およびその検査装置
JPH10256483A (ja) * 1997-03-11 1998-09-25 Toshiba Corp Ｍｏｓ型半導体集積回路
JPH113969A (ja) * 1997-06-13 1999-01-06 Matsushita Electric Ind Co Ltd チップ部品が積層された基板部品
JPH11121686A (ja) * 1997-10-21 1999-04-30 Rohm Co Ltd 多層チップの組み立て方法
JPH11135714A (ja) * 1997-10-29 1999-05-21 Rohm Co Ltd 半導体装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7045899B2 (en) 2002-10-15 2006-05-16 Oki Electric Industry Co., Ltd. Semiconductor device and fabrication method of the same
KR100744979B1 (ko) * 2005-05-20 2007-08-02 엔이씨 일렉트로닉스 가부시키가이샤 아날로그 반도체 칩 및 디지털 반도체 칩이 순서대로적층된 ｓｉｐ 타입 패키지, 및 그 제조 방법
US7656030B2 (en) 2006-01-11 2010-02-02 Renesas Technology Corp. Semiconductor device
JP2010002878A (ja) * 2008-06-20 2010-01-07 Renei Kagi Kofun Yugenkoshi ソース・ドライバおよび液晶ディスプレイ
EP2720267A1 (en) 2012-10-15 2014-04-16 J-Devices Corporation Semiconductor storage device and method for producing the same
US8897051B2 (en) 2012-10-15 2014-11-25 J-Devices Corporation Semiconductor storage device and method for producing the same
EP3855492A2 (en) 2012-10-15 2021-07-28 J-Devices Corporation Semiconductor storage device and method for producing the same

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