JP2001022075A5 - - Google Patents

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Publication number
JP2001022075A5
JP2001022075A5 JP1999198164A JP19816499A JP2001022075A5 JP 2001022075 A5 JP2001022075 A5 JP 2001022075A5 JP 1999198164 A JP1999198164 A JP 1999198164A JP 19816499 A JP19816499 A JP 19816499A JP 2001022075 A5 JP2001022075 A5 JP 2001022075A5
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JP
Japan
Prior art keywords
resin
resist
epoxy
monomer unit
integer
Prior art date
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Application number
JP1999198164A
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English (en)
Japanese (ja)
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JP2001022075A (ja
JP4544550B2 (ja
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Priority to JP19816499A priority Critical patent/JP4544550B2/ja
Priority claimed from JP19816499A external-priority patent/JP4544550B2/ja
Publication of JP2001022075A publication Critical patent/JP2001022075A/ja
Publication of JP2001022075A5 publication Critical patent/JP2001022075A5/ja
Application granted granted Critical
Publication of JP4544550B2 publication Critical patent/JP4544550B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP19816499A 1999-07-12 1999-07-12 レジスト用樹脂、化学増幅型レジスト組成物およびレジストパターン形成方法 Expired - Lifetime JP4544550B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19816499A JP4544550B2 (ja) 1999-07-12 1999-07-12 レジスト用樹脂、化学増幅型レジスト組成物およびレジストパターン形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19816499A JP4544550B2 (ja) 1999-07-12 1999-07-12 レジスト用樹脂、化学増幅型レジスト組成物およびレジストパターン形成方法

Publications (3)

Publication Number Publication Date
JP2001022075A JP2001022075A (ja) 2001-01-26
JP2001022075A5 true JP2001022075A5 (enExample) 2006-08-31
JP4544550B2 JP4544550B2 (ja) 2010-09-15

Family

ID=16386539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19816499A Expired - Lifetime JP4544550B2 (ja) 1999-07-12 1999-07-12 レジスト用樹脂、化学増幅型レジスト組成物およびレジストパターン形成方法

Country Status (1)

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JP (1) JP4544550B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006080786A1 (en) * 2005-01-25 2006-08-03 Lg Chem. Ltd. Thermally curable resin composition with extended storage stability and good adhesive property
WO2007055134A1 (ja) * 2005-11-10 2007-05-18 Nec Corporation 光導波路形成用感光性樹脂組成物、光導波路、及び光導波路の製造方法
JP5432456B2 (ja) * 2008-01-23 2014-03-05 出光興産株式会社 アダマンタン系共重合樹脂、樹脂組成物及びその用途
JP5506621B2 (ja) * 2009-10-16 2014-05-28 富士フイルム株式会社 感光性樹脂組成物、硬化膜、硬化膜の形成方法、有機el表示装置、及び、液晶表示装置
JP5451570B2 (ja) * 2009-10-16 2014-03-26 富士フイルム株式会社 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機el表示装置、及び、液晶表示装置
JP5623897B2 (ja) * 2010-01-22 2014-11-12 富士フイルム株式会社 ポジ型感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機el表示装置、及び、液晶表示装置
JP5524036B2 (ja) * 2010-01-25 2014-06-18 富士フイルム株式会社 ポジ型感光性樹脂組成物、硬化膜の形成方法、硬化膜、液晶表示装置、及び、有機el表示装置
JP5734152B2 (ja) * 2011-09-30 2015-06-10 富士フイルム株式会社 感光性樹脂組成物、硬化膜並びにその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5429627A (en) * 1977-08-09 1979-03-05 Somar Mfg Positive resist material and use thereof
JP3643657B2 (ja) * 1996-07-22 2005-04-27 ダイセル化学工業株式会社 水性樹脂分散液
JPH1087747A (ja) * 1996-09-10 1998-04-07 Toyo Ink Mfg Co Ltd 放射線硬化型液状樹脂
JPH10316721A (ja) * 1997-05-15 1998-12-02 Nippon Steel Chem Co Ltd アルカリ可溶性樹脂及びそれを用いた画像形成用材料

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