JP2000505246A5 - - Google Patents

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Publication number
JP2000505246A5
JP2000505246A5 JP1998521415A JP52141598A JP2000505246A5 JP 2000505246 A5 JP2000505246 A5 JP 2000505246A5 JP 1998521415 A JP1998521415 A JP 1998521415A JP 52141598 A JP52141598 A JP 52141598A JP 2000505246 A5 JP2000505246 A5 JP 2000505246A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998521415A
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English (en)
Japanese (ja)
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JP4615631B2 (ja
JP2000505246A (ja
Filing date
Publication date
Priority claimed from US08/745,597 external-priority patent/US5888630A/en
Application filed filed Critical
Publication of JP2000505246A publication Critical patent/JP2000505246A/ja
Publication of JP2000505246A5 publication Critical patent/JP2000505246A5/ja
Application granted granted Critical
Publication of JP4615631B2 publication Critical patent/JP4615631B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP52141598A 1996-11-08 1997-10-17 面内に熱膨張率勾配を設計する方法 Expired - Lifetime JP4615631B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/745,597 1996-11-08
US08/745,597 US5888630A (en) 1996-11-08 1996-11-08 Apparatus and method for unit area composition control to minimize warp in an integrated circuit chip package assembly
PCT/US1997/018639 WO1998020556A1 (en) 1996-11-08 1997-10-17 Method of increasing package reliability by designing in plane cte gradients

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010178017A Division JP5491316B2 (ja) 1996-11-08 2010-08-06 パッケージの信頼性を高める方法、層状構造及びその製造方法

Publications (3)

Publication Number Publication Date
JP2000505246A JP2000505246A (ja) 2000-04-25
JP2000505246A5 true JP2000505246A5 (enExample) 2005-06-16
JP4615631B2 JP4615631B2 (ja) 2011-01-19

Family

ID=24997393

Family Applications (2)

Application Number Title Priority Date Filing Date
JP52141598A Expired - Lifetime JP4615631B2 (ja) 1996-11-08 1997-10-17 面内に熱膨張率勾配を設計する方法
JP2010178017A Expired - Lifetime JP5491316B2 (ja) 1996-11-08 2010-08-06 パッケージの信頼性を高める方法、層状構造及びその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010178017A Expired - Lifetime JP5491316B2 (ja) 1996-11-08 2010-08-06 パッケージの信頼性を高める方法、層状構造及びその製造方法

Country Status (4)

Country Link
US (3) US5888630A (enExample)
JP (2) JP4615631B2 (enExample)
AU (1) AU4758497A (enExample)
WO (1) WO1998020556A1 (enExample)

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US8384189B2 (en) * 2005-03-29 2013-02-26 Megica Corporation High performance system-on-chip using post passivation process
US8826531B1 (en) 2005-04-05 2014-09-09 Amkor Technology, Inc. Method for making an integrated circuit substrate having laminated laser-embedded circuit layers
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US8872329B1 (en) 2009-01-09 2014-10-28 Amkor Technology, Inc. Extended landing pad substrate package structure and method
US8399773B2 (en) * 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
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