JP2000223385A5 - - Google Patents
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- Publication number
- JP2000223385A5 JP2000223385A5 JP1999023945A JP2394599A JP2000223385A5 JP 2000223385 A5 JP2000223385 A5 JP 2000223385A5 JP 1999023945 A JP1999023945 A JP 1999023945A JP 2394599 A JP2394599 A JP 2394599A JP 2000223385 A5 JP2000223385 A5 JP 2000223385A5
- Authority
- JP
- Japan
- Prior art keywords
- inspection
- yield
- defect
- chip
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007689 inspection Methods 0.000 claims description 36
- 238000004458 analytical method Methods 0.000 claims description 21
- 230000007547 defect Effects 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 6
- 230000001186 cumulative effect Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000013480 data collection Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000007405 data analysis Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02394599A JP4080087B2 (ja) | 1999-02-01 | 1999-02-01 | 分析方法，分析システム及び分析装置 |
| US09/494,939 US6539272B1 (en) | 1999-02-01 | 2000-02-01 | Electric device inspection method and electric device inspection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02394599A JP4080087B2 (ja) | 1999-02-01 | 1999-02-01 | 分析方法，分析システム及び分析装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000223385A JP2000223385A (ja) | 2000-08-11 |
| JP2000223385A5 true JP2000223385A5 (enExample) | 2005-02-03 |
| JP4080087B2 JP4080087B2 (ja) | 2008-04-23 |
Family
ID=12124693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02394599A Expired - Fee Related JP4080087B2 (ja) | 1999-02-01 | 1999-02-01 | 分析方法，分析システム及び分析装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US6539272B1 (enExample) |
| JP (1) | JP4080087B2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6694208B1 (en) * | 2000-05-15 | 2004-02-17 | Promos Technologies, Inc. | Method for prioritizing failure modes to improve yield rate in manufacturing semiconductor devices |
| JP3678133B2 (ja) * | 2000-10-30 | 2005-08-03 | 株式会社日立製作所 | 検査システムおよび半導体デバイスの製造方法 |
| JP4357134B2 (ja) | 2001-03-29 | 2009-11-04 | 株式会社日立製作所 | 検査システムと検査装置と半導体デバイスの製造方法及び検査プログラム |
| JP4170611B2 (ja) * | 2001-03-29 | 2008-10-22 | 株式会社東芝 | 半導体集積回路の不良検出方法及び不良検出装置 |
| JP2003100826A (ja) | 2001-09-26 | 2003-04-04 | Hitachi Ltd | 検査データ解析プログラムと検査装置と検査システム |
| US6948141B1 (en) | 2001-10-25 | 2005-09-20 | Kla-Tencor Technologies Corporation | Apparatus and methods for determining critical area of semiconductor design data |
| US6918101B1 (en) | 2001-10-25 | 2005-07-12 | Kla -Tencor Technologies Corporation | Apparatus and methods for determining critical area of semiconductor design data |
| US6751519B1 (en) * | 2001-10-25 | 2004-06-15 | Kla-Tencor Technologies Corporation | Methods and systems for predicting IC chip yield |
| JP2007264914A (ja) * | 2006-03-28 | 2007-10-11 | Hitachi Global Storage Technologies Netherlands Bv | データ解析方法 |
| KR100763707B1 (ko) | 2006-08-28 | 2007-10-04 | 동부일렉트로닉스 주식회사 | 반도체 제조에서의 결함에 의한 수율손실기여도 산출 방법 |
| JP2010210527A (ja) * | 2009-03-11 | 2010-09-24 | Horiba Ltd | 異物検査除去装置及び異物検査除去プログラム |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3986571B2 (ja) | 1994-12-09 | 2007-10-03 | 日本テキサス・インスツルメンツ株式会社 | 歩留り予測装置とその方法 |
| US5598341A (en) | 1995-03-10 | 1997-01-28 | Advanced Micro Devices, Inc. | Real-time in-line defect disposition and yield forecasting system |
| US5971586A (en) * | 1995-04-21 | 1999-10-26 | Sony Corporation | Identifying causes of semiconductor production yield loss |
| JPH0974056A (ja) | 1995-09-06 | 1997-03-18 | Matsushita Electric Ind Co Ltd | 半導体装置の歩留り予測方法およびその装置 |
| US6259960B1 (en) * | 1996-11-01 | 2001-07-10 | Joel Ltd. | Part-inspecting system |
| TW331650B (en) * | 1997-05-26 | 1998-05-11 | Taiwan Semiconductor Mfg Co Ltd | Integrated defect yield management system for semiconductor manufacturing |
| US6265232B1 (en) * | 1998-08-21 | 2001-07-24 | Micron Technology, Inc. | Yield based, in-line defect sampling method |
| US6324481B1 (en) * | 1998-10-21 | 2001-11-27 | Texas Instruments Incorporated | Method for the calculation of wafer probe yield limits from in-line defect monitor data |
| US6240329B1 (en) * | 1998-11-09 | 2001-05-29 | Chin-Yang Sun | Method and apparatus for a semiconductor wafer inspection system using a knowledge-based system |
-
1999
- 1999-02-01 JP JP02394599A patent/JP4080087B2/ja not_active Expired - Fee Related
-
2000
- 2000-02-01 US US09/494,939 patent/US6539272B1/en not_active Expired - Lifetime
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