JP2000192279A5 - - Google Patents

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Publication number
JP2000192279A5
JP2000192279A5 JP1998366192A JP36619298A JP2000192279A5 JP 2000192279 A5 JP2000192279 A5 JP 2000192279A5 JP 1998366192 A JP1998366192 A JP 1998366192A JP 36619298 A JP36619298 A JP 36619298A JP 2000192279 A5 JP2000192279 A5 JP 2000192279A5
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JP
Japan
Prior art keywords
silver
group
alkyl
aliphatic
hydroxypropylene
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JP1998366192A
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English (en)
Japanese (ja)
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JP3718790B2 (ja
JP2000192279A (ja
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Priority to JP36619298A priority Critical patent/JP3718790B2/ja
Priority claimed from JP36619298A external-priority patent/JP3718790B2/ja
Publication of JP2000192279A publication Critical patent/JP2000192279A/ja
Publication of JP2000192279A5 publication Critical patent/JP2000192279A5/ja
Application granted granted Critical
Publication of JP3718790B2 publication Critical patent/JP3718790B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP36619298A 1998-12-24 1998-12-24 銀及び銀合金メッキ浴 Expired - Fee Related JP3718790B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP36619298A JP3718790B2 (ja) 1998-12-24 1998-12-24 銀及び銀合金メッキ浴

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36619298A JP3718790B2 (ja) 1998-12-24 1998-12-24 銀及び銀合金メッキ浴

Publications (3)

Publication Number Publication Date
JP2000192279A JP2000192279A (ja) 2000-07-11
JP2000192279A5 true JP2000192279A5 (enrdf_load_stackoverflow) 2005-01-06
JP3718790B2 JP3718790B2 (ja) 2005-11-24

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ID=18486154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36619298A Expired - Fee Related JP3718790B2 (ja) 1998-12-24 1998-12-24 銀及び銀合金メッキ浴

Country Status (1)

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JP (1) JP3718790B2 (enrdf_load_stackoverflow)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10026680C1 (de) * 2000-05-30 2002-02-21 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten
MX230531B (es) * 2000-10-19 2005-09-12 Atotech Deutschland Gmbh Bano de cobre y metodo para depositar un revestimiento mate de cobre.
JP2002322595A (ja) * 2001-04-25 2002-11-08 Sekisui Chem Co Ltd 導電性微粒子及び微粒子のめっき方法及び接続構造体
DE10124002C1 (de) * 2001-05-17 2003-02-06 Ami Doduco Gmbh Saures Silberbad
JP4660806B2 (ja) * 2001-05-30 2011-03-30 石原薬品株式会社 無電解銀メッキ浴
US6773573B2 (en) * 2001-10-02 2004-08-10 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
WO2007010653A1 (ja) * 2005-07-19 2007-01-25 Konica Minolta Holding, Inc. 常温溶融塩および表示素子
EP2221396A1 (en) 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Lead-Free Tin Alloy Electroplating Compositions and Methods
JP5150016B2 (ja) * 2009-05-12 2013-02-20 石原薬品株式会社 スズ又はスズ合金メッキ浴、及び当該メッキ浴を用いたバレルメッキ方法
CN102071445B (zh) * 2011-02-28 2012-06-20 济南德锡科技有限公司 一种无氰镀银光亮剂及其电镀液
US8980077B2 (en) 2012-03-30 2015-03-17 Rohm And Haas Electronic Materials Llc Plating bath and method
US20180327922A1 (en) * 2015-11-06 2018-11-15 Jcu Corporation Nickel-plating additive and satin nickel-plating bath containing same
JP6432667B2 (ja) 2017-01-31 2018-12-05 三菱マテリアル株式会社 錫合金めっき液
WO2018142776A1 (ja) 2017-01-31 2018-08-09 三菱マテリアル株式会社 錫合金めっき液
KR102742970B1 (ko) 2017-04-05 2024-12-13 바스프 에스이 니트로 방향족 화합물의 이소시아네이트로의 직접 카르보닐화를 위한 불균일 촉매
JP6645609B2 (ja) * 2018-07-27 2020-02-14 三菱マテリアル株式会社 錫合金めっき液
JP7035883B2 (ja) * 2018-07-27 2022-03-15 三菱マテリアル株式会社 剥離液
EP3835458B1 (en) 2018-07-27 2023-08-16 Mitsubishi Materials Corporation Tin alloy plating solution
US11434577B2 (en) * 2019-10-17 2022-09-06 Rohm And Haas Electronic Materials Llc Acid aqueous binary silver-bismuth alloy electroplating compositions and methods
US20210172082A1 (en) * 2019-12-10 2021-06-10 Rohm And Haas Electronic Materials Llc Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods
KR20220113671A (ko) * 2019-12-12 2022-08-16 미쓰비시 마테리알 가부시키가이샤 디티아폴리에테르디올, 그 제조 방법, 디티아폴리에테르디올을 포함하는 SnAg 도금액, 및 SnAg 도금액을 사용하여 도금 피막을 형성하는 방법
JP7455675B2 (ja) * 2020-06-04 2024-03-26 上村工業株式会社 錫または錫合金めっき浴
JP2022111432A (ja) 2021-01-20 2022-08-01 株式会社Jcu 電解銀めっき浴およびこれを用いた電解銀めっき方法
CN114059112A (zh) * 2021-08-04 2022-02-18 中国科学院宁波材料技术与工程研究所 一种无氰镀银的电镀液及其应用

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