JP2000192279A5 - - Google Patents

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Publication number
JP2000192279A5
JP2000192279A5 JP1998366192A JP36619298A JP2000192279A5 JP 2000192279 A5 JP2000192279 A5 JP 2000192279A5 JP 1998366192 A JP1998366192 A JP 1998366192A JP 36619298 A JP36619298 A JP 36619298A JP 2000192279 A5 JP2000192279 A5 JP 2000192279A5
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JP
Japan
Prior art keywords
silver
group
alkyl
aliphatic
hydroxypropylene
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Application number
JP1998366192A
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English (en)
Japanese (ja)
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JP3718790B2 (ja
JP2000192279A (ja
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Priority to JP36619298A priority Critical patent/JP3718790B2/ja
Priority claimed from JP36619298A external-priority patent/JP3718790B2/ja
Publication of JP2000192279A publication Critical patent/JP2000192279A/ja
Publication of JP2000192279A5 publication Critical patent/JP2000192279A5/ja
Application granted granted Critical
Publication of JP3718790B2 publication Critical patent/JP3718790B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP36619298A 1998-12-24 1998-12-24 銀及び銀合金メッキ浴 Expired - Fee Related JP3718790B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP36619298A JP3718790B2 (ja) 1998-12-24 1998-12-24 銀及び銀合金メッキ浴

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36619298A JP3718790B2 (ja) 1998-12-24 1998-12-24 銀及び銀合金メッキ浴

Publications (3)

Publication Number Publication Date
JP2000192279A JP2000192279A (ja) 2000-07-11
JP2000192279A5 true JP2000192279A5 (enrdf_load_html_response) 2005-01-06
JP3718790B2 JP3718790B2 (ja) 2005-11-24

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ID=18486154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36619298A Expired - Fee Related JP3718790B2 (ja) 1998-12-24 1998-12-24 銀及び銀合金メッキ浴

Country Status (1)

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JP (1) JP3718790B2 (enrdf_load_html_response)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10026680C1 (de) * 2000-05-30 2002-02-21 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten
AU2002215939A1 (en) * 2000-10-19 2002-04-29 Atotech Deutschland Gmbh Copper bath and method of depositing a matt copper coating
JP2002322595A (ja) * 2001-04-25 2002-11-08 Sekisui Chem Co Ltd 導電性微粒子及び微粒子のめっき方法及び接続構造体
DE10124002C1 (de) * 2001-05-17 2003-02-06 Ami Doduco Gmbh Saures Silberbad
JP4660806B2 (ja) * 2001-05-30 2011-03-30 石原薬品株式会社 無電解銀メッキ浴
US6773573B2 (en) * 2001-10-02 2004-08-10 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
JP5412724B2 (ja) * 2005-07-19 2014-02-12 コニカミノルタ株式会社 常温溶融塩および表示素子
EP2221396A1 (en) 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Lead-Free Tin Alloy Electroplating Compositions and Methods
JP5150016B2 (ja) * 2009-05-12 2013-02-20 石原薬品株式会社 スズ又はスズ合金メッキ浴、及び当該メッキ浴を用いたバレルメッキ方法
CN102071445B (zh) * 2011-02-28 2012-06-20 济南德锡科技有限公司 一种无氰镀银光亮剂及其电镀液
US8980077B2 (en) * 2012-03-30 2015-03-17 Rohm And Haas Electronic Materials Llc Plating bath and method
WO2017077655A1 (ja) * 2015-11-06 2017-05-11 株式会社Ｊｃｕ ニッケルめっき用添加剤およびこれを含有するサテンニッケルめっき浴
JP6432667B2 (ja) 2017-01-31 2018-12-05 三菱マテリアル株式会社 錫合金めっき液
WO2018142776A1 (ja) 2017-01-31 2018-08-09 三菱マテリアル株式会社 錫合金めっき液
WO2018185168A1 (en) 2017-04-05 2018-10-11 Basf Se Heterogeneous catalysts for the direct carbonylation of nitro aromatic compounds to isocyanates
CN112236548B (zh) * 2018-07-27 2022-03-04 三菱综合材料株式会社 锡合金镀液
JP7035883B2 (ja) * 2018-07-27 2022-03-15 三菱マテリアル株式会社 剥離液
JP6645609B2 (ja) 2018-07-27 2020-02-14 三菱マテリアル株式会社 錫合金めっき液
US11434577B2 (en) * 2019-10-17 2022-09-06 Rohm And Haas Electronic Materials Llc Acid aqueous binary silver-bismuth alloy electroplating compositions and methods
US20210172082A1 (en) * 2019-12-10 2021-06-10 Rohm And Haas Electronic Materials Llc Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods
US20240116861A1 (en) * 2019-12-12 2024-04-11 Mitsubishi Materials Corporation Dithiapolyether diol, method for producing same, snag plating solution containing dithiapolyether diol, and method for forming plating film with use of snag plating solution
JP7455675B2 (ja) * 2020-06-04 2024-03-26 上村工業株式会社 錫または錫合金めっき浴
JP7740879B2 (ja) 2021-01-20 2025-09-17 株式会社Jcu 電解銀めっき浴およびこれを用いた電解銀めっき方法
CN114059112A (zh) * 2021-08-04 2022-02-18 中国科学院宁波材料技术与工程研究所 一种无氰镀银的电镀液及其应用

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