JP2000021953A - 半導体処理方法 - Google Patents
半導体処理方法Info
- Publication number
- JP2000021953A JP2000021953A JP18918598A JP18918598A JP2000021953A JP 2000021953 A JP2000021953 A JP 2000021953A JP 18918598 A JP18918598 A JP 18918598A JP 18918598 A JP18918598 A JP 18918598A JP 2000021953 A JP2000021953 A JP 2000021953A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- orientation flat
- cassette
- transfer
- processing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 33
- 238000003672 processing method Methods 0.000 title claims abstract description 15
- 235000012431 wafers Nutrition 0.000 claims abstract description 107
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 238000006243 chemical reaction Methods 0.000 claims abstract description 3
- 238000006073 displacement reaction Methods 0.000 abstract description 8
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18918598A JP2000021953A (ja) | 1998-07-03 | 1998-07-03 | 半導体処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18918598A JP2000021953A (ja) | 1998-07-03 | 1998-07-03 | 半導体処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000021953A true JP2000021953A (ja) | 2000-01-21 |
| JP2000021953A5 JP2000021953A5 (enExample) | 2006-01-26 |
Family
ID=16236938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18918598A Pending JP2000021953A (ja) | 1998-07-03 | 1998-07-03 | 半導体処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000021953A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007173285A (ja) * | 2005-12-19 | 2007-07-05 | Nec Electronics Corp | ウェーハプローバ装置およびウェーハ検査方法 |
-
1998
- 1998-07-03 JP JP18918598A patent/JP2000021953A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007173285A (ja) * | 2005-12-19 | 2007-07-05 | Nec Electronics Corp | ウェーハプローバ装置およびウェーハ検査方法 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040929 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050617 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20051207 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060627 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20061024 |