JP1708687S - 半導体処理チャンバのための堆積リング - Google Patents

半導体処理チャンバのための堆積リング

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Publication number
JP1708687S
JP1708687S JP2021022122F JP2021022122F JP1708687S JP 1708687 S JP1708687 S JP 1708687S JP 2021022122 F JP2021022122 F JP 2021022122F JP 2021022122 F JP2021022122 F JP 2021022122F JP 1708687 S JP1708687 S JP 1708687S
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processing chamber
semiconductor processing
sedimentation ring
sedimentation
ring
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JP2021022122F
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JP2021022122F 2020-07-31 2021-02-01 半導体処理チャンバのための堆積リング Active JP1708687S (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/744,882 USD933726S1 (en) 2020-07-31 2020-07-31 Deposition ring for a semiconductor processing chamber

Publications (1)

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JP1708687S true JP1708687S (ja) 2022-03-01

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JP2021002209F Active JP1704604S (ja) 2020-07-31 2021-02-01 半導体処理チャンバのための堆積リング
JP2021022122F Active JP1708687S (ja) 2020-07-31 2021-02-01 半導体処理チャンバのための堆積リング

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JP2021002209F Active JP1704604S (ja) 2020-07-31 2021-02-01 半導体処理チャンバのための堆積リング

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US (1) USD933726S1 (ja)
JP (2) JP1704604S (ja)
TW (2) TWD217572S (ja)

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USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD990441S1 (en) * 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate
CA210024S (en) * 2022-01-31 2023-07-28 Hamilton Kent Inc Gasket
TWD228601S (zh) 2022-04-04 2023-11-11 美商應用材料股份有限公司 用於基板處理腔室的抗旋轉處理套件的擋板

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Also Published As

Publication number Publication date
JP1704604S (ja) 2022-01-13
USD933726S1 (en) 2021-10-19
TWD217686S (zh) 2022-03-11
TWD217572S (zh) 2022-03-11

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