JP1658652S - - Google Patents

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Publication number
JP1658652S
JP1658652S JPD2019-17637F JP2019017637F JP1658652S JP 1658652 S JP1658652 S JP 1658652S JP 2019017637 F JP2019017637 F JP 2019017637F JP 1658652 S JP1658652 S JP 1658652S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2019-17637F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2019-17637F priority Critical patent/JP1658652S/ja
Priority to TW108307123F priority patent/TWD208179S/zh
Priority to US29/716,458 priority patent/USD939459S1/en
Application granted granted Critical
Publication of JP1658652S publication Critical patent/JP1658652S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JPD2019-17637F 2019-08-07 2019-08-07 Active JP1658652S (cs)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2019-17637F JP1658652S (cs) 2019-08-07 2019-08-07
TW108307123F TWD208179S (zh) 2019-08-07 2019-11-21 基板處理裝置用晶舟之部分
US29/716,458 USD939459S1 (en) 2019-08-07 2019-12-10 Boat for wafer processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2019-17637F JP1658652S (cs) 2019-08-07 2019-08-07

Publications (1)

Publication Number Publication Date
JP1658652S true JP1658652S (cs) 2020-04-27

Family

ID=70335647

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2019-17637F Active JP1658652S (cs) 2019-08-07 2019-08-07

Country Status (3)

Country Link
US (1) USD939459S1 (cs)
JP (1) JP1658652S (cs)
TW (1) TWD208179S (cs)

Families Citing this family (19)

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Publication number Priority date Publication date Assignee Title
KR102552458B1 (ko) * 2019-07-31 2023-07-06 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 기판 지지구 및 반도체 장치의 제조 방법
USD989012S1 (en) 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
JP1700782S (ja) * 2021-04-14 2021-11-29 基板処理装置用ボート
JP1727916S (ja) 2021-10-15 2022-10-21 ハンドリング用キャリア基板
USD1054388S1 (en) 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
JP1724481S (ja) 2021-10-15 2022-09-12 ハンドリング用キャリア基板
JP1724567S (ja) 2021-10-15 2022-09-12 ハンドリング用キャリア基板
JP1718604S (ja) 2021-10-15 2022-06-29 ハンドリング用キャリア基板
JP1718541S (ja) 2021-10-15 2022-06-29 ハンドリング用キャリア基板
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
JP1731674S (cs) * 2022-05-30 2022-12-08
JP1731673S (cs) * 2022-05-30 2022-12-08
JP1731675S (cs) * 2022-05-30 2022-12-08
USD1064005S1 (en) * 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing
USD1069863S1 (en) * 2022-08-04 2025-04-08 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
JP1768691S (ja) 2023-12-19 2024-04-19 金属ガスケット

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USD404015S (en) * 1997-01-31 1999-01-12 Tokyo Electron Ltd. Wafer boat for use in a semiconductor wafer heat processing apparatus
USD411176S (en) * 1997-08-20 1999-06-22 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
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US6341935B1 (en) * 2000-06-14 2002-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer boat having improved wafer holding capability
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JP3377996B1 (ja) * 2001-12-27 2003-02-17 東京エレクトロン株式会社 熱処理用ボート及び縦型熱処理装置
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TWD119911S1 (zh) * 2006-05-01 2007-11-11 東京威力科創股份有限公司 晶舟
TWD130137S1 (zh) * 2006-10-25 2009-08-01 東京威力科創股份有限公司 晶舟
TWD133942S1 (zh) * 2008-03-28 2010-03-21 東京威力科創股份有限公司 晶舟
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD616396S1 (en) * 2009-03-12 2010-05-25 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
TWD166332S (zh) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 基板處理裝置用晶舟之部分
TWD163542S (zh) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 基板處理裝置用晶舟
TWD167988S (zh) * 2013-07-29 2015-05-21 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD168827S (zh) * 2013-07-29 2015-07-01 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD165429S (zh) * 2013-07-29 2015-01-11 日立國際電氣股份有限公司 半導體製造裝置用晶舟
JP1563649S (cs) * 2016-02-12 2016-11-21
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus

Also Published As

Publication number Publication date
USD939459S1 (en) 2021-12-28
TWD208179S (zh) 2020-11-11

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