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USD259560S
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1978-07-28 |
1981-06-16 |
Hitachi, Ltd. |
Semiconductor
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*
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1978-07-28 |
1981-07-07 |
Hitachi, Ltd. |
Semiconductor
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USD259559S
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1978-07-28 |
1981-06-16 |
Hitachi, Ltd. |
Semiconductor
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USD260091S
(en)
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1978-08-25 |
1981-08-04 |
Hitachi, Ltd. |
Semiconductor
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USD259783S
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1978-08-25 |
1981-07-07 |
Hitachi, Ltd. |
Semiconductor
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1978-08-25 |
1981-09-29 |
Hitachi, Ltd. |
Semiconductor
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JPS60239043A
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1984-05-14 |
1985-11-27 |
Oki Electric Ind Co Ltd |
半導体装置用パツケ−ジの製造方法
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JP2744685B2
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1990-08-08 |
1998-04-28 |
三菱電機株式会社 |
半導体装置
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US5347160A
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1992-09-28 |
1994-09-13 |
Sundstrand Corporation |
Power semiconductor integrated circuit package
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1996-06-28 |
1998-08-25 |
Kabushiki Kaisha Gotoh Seisakusho |
Plastic molded semiconductor package with thermal dissipation means
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USD396847S
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1996-10-17 |
1998-08-11 |
Matsushita Electronics Corporation |
Semiconductor device
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USD397092S
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1997-01-03 |
1998-08-18 |
Fujitsu Limited |
Integrated circuit package
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USD396846S
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1997-04-16 |
1998-08-11 |
Matsushita Electronics Corporation |
Semiconductor device
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KR100218368B1
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1997-04-18 |
1999-09-01 |
구본준 |
리드프레임과 그를 이용한 반도체 패키지 및 그의 제조방법
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EP0884781A3
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1997-06-12 |
1999-06-30 |
Hitachi, Ltd. |
Leistungshalbleitermodul
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TW473882B
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1998-07-06 |
2002-01-21 |
Hitachi Ltd |
Semiconductor device
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1998-09-02 |
1999-11-09 |
Citizen Electronics Co., Ltd. |
Integrated circuit package
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JP2000208690A
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1999-01-12 |
2000-07-28 |
Sony Corp |
リ―ドフレ―ム、樹脂封止型半導体装置およびその製造方法
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KR100355794B1
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1999-10-15 |
2002-10-19 |
앰코 테크놀로지 코리아 주식회사 |
리드프레임 및 이를 이용한 반도체패키지
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USD444132S1
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2000-08-23 |
2001-06-26 |
Kabushiki Kaisha Toshiba |
Semiconductor element
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JP4151209B2
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2000-08-29 |
2008-09-17 |
三菱電機株式会社 |
電力用半導体装置
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USD466485S1
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2001-05-23 |
2002-12-03 |
Shindengen Electric Manufactuturing Co., Ltd. |
Semiconductor package
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2001-10-31 |
2003-04-01 |
Siliconix Incorporated |
Semiconductor chip package
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USD466873S1
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2001-10-31 |
2002-12-10 |
Siliconix Incorporated |
Semiconductor chip package
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USD480371S1
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2001-11-30 |
2003-10-07 |
Kabushiki Kaisha Toshiba |
Semiconductor device
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2002-03-11 |
2003-05-27 |
Kabushiki Kaisha Toshiba |
Semiconductor device
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2002-03-11 |
2003-06-17 |
Kabushiki Kaisha Toshiba |
Semiconductor device
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2002-03-11 |
2003-06-03 |
Kabushiki Kaisha Toshiba |
Semiconductor device
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2002-03-29 |
2003-07-08 |
Kabushiki Kaisha Toshiba |
Semiconductor device
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2003-07-28 |
2004-05-04 |
Semiconductor Components Industries, L.L.C. |
Packaged semiconductor device
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2003-07-30 |
2005-09-20 |
Delta Electronics Inc. |
Molding structure of electric element
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JP4294405B2
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2003-07-31 |
2009-07-15 |
株式会社ルネサステクノロジ |
半導体装置
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USD504874S1
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2004-08-11 |
2005-05-10 |
Semiconductor Components Industries, Llc |
Semiconductor device package
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USD510728S1
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2004-08-11 |
2005-10-18 |
Semiconductor Components Industries Llc |
Semiconductor device package
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USD587662S1
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2007-12-20 |
2009-03-03 |
Fuji Electric Device Technology Co., Ltd. |
Semiconductor device
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USD648290S1
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2010-06-08 |
2011-11-08 |
Miyoshi Electronics Corporation |
Semiconductor device
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2014-08-07 |
2016-08-02 |
Infineon Technologies Ag |
Power semiconductor module
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JP1563812S
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2016-04-11 |
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