IT9083643A0 - Procedimento di incapsulamento in resina di un dispositivo a semiconduttore di potenza montato su dissipatore allontanando i reofori dal dissipatore mediante l'azione del controstampo in fase di chiusura dello stampo - Google Patents

Procedimento di incapsulamento in resina di un dispositivo a semiconduttore di potenza montato su dissipatore allontanando i reofori dal dissipatore mediante l'azione del controstampo in fase di chiusura dello stampo

Info

Publication number
IT9083643A0
IT9083643A0 IT83643A IT8364390A IT9083643A0 IT 9083643 A0 IT9083643 A0 IT 9083643A0 IT 83643 A IT83643 A IT 83643A IT 8364390 A IT8364390 A IT 8364390A IT 9083643 A0 IT9083643 A0 IT 9083643A0
Authority
IT
Italy
Prior art keywords
heatsink
mold
encapsulating
leads
closing
Prior art date
Application number
IT83643A
Other languages
English (en)
Other versions
IT9083643A1 (it
IT1247649B (it
Inventor
Paolo Casati
De Martiis Carlo Cognetti
Giuseppe Marchisi
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Priority to IT08364390A priority Critical patent/IT1247649B/it
Publication of IT9083643A0 publication Critical patent/IT9083643A0/it
Priority to EP91830471A priority patent/EP0484297B1/en
Priority to DE69119029T priority patent/DE69119029T2/de
Priority to US07/784,303 priority patent/US5244838A/en
Publication of IT9083643A1 publication Critical patent/IT9083643A1/it
Priority to US08/045,983 priority patent/US5370517A/en
Application granted granted Critical
Publication of IT1247649B publication Critical patent/IT1247649B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/228—Injection plunger or ram: transfer molding type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT08364390A 1990-10-31 1990-10-31 Procedimento di incapsulamento in resina di un dispositivo a semiconduttore di potenza montato su dissipatore allontanando i reofori dal dissipatore mediante l'azione del controstampo in fase di chiusura dello stampo IT1247649B (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT08364390A IT1247649B (it) 1990-10-31 1990-10-31 Procedimento di incapsulamento in resina di un dispositivo a semiconduttore di potenza montato su dissipatore allontanando i reofori dal dissipatore mediante l'azione del controstampo in fase di chiusura dello stampo
EP91830471A EP0484297B1 (en) 1990-10-31 1991-10-30 Process for assembling and resin-encapsulating a semiconductor power device mounted on a heat sink
DE69119029T DE69119029T2 (de) 1990-10-31 1991-10-30 Verfahren zum Zusammenbau und zur Harzummantelung eines Leistungshalbleiters, der auf einem Kühlkörper angebracht ist
US07/784,303 US5244838A (en) 1990-10-31 1991-10-31 Process and apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device
US08/045,983 US5370517A (en) 1990-10-31 1993-04-09 Apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT08364390A IT1247649B (it) 1990-10-31 1990-10-31 Procedimento di incapsulamento in resina di un dispositivo a semiconduttore di potenza montato su dissipatore allontanando i reofori dal dissipatore mediante l'azione del controstampo in fase di chiusura dello stampo

Publications (3)

Publication Number Publication Date
IT9083643A0 true IT9083643A0 (it) 1990-10-31
IT9083643A1 IT9083643A1 (it) 1992-05-01
IT1247649B IT1247649B (it) 1994-12-28

Family

ID=11323577

Family Applications (1)

Application Number Title Priority Date Filing Date
IT08364390A IT1247649B (it) 1990-10-31 1990-10-31 Procedimento di incapsulamento in resina di un dispositivo a semiconduttore di potenza montato su dissipatore allontanando i reofori dal dissipatore mediante l'azione del controstampo in fase di chiusura dello stampo

Country Status (4)

Country Link
US (2) US5244838A (it)
EP (1) EP0484297B1 (it)
DE (1) DE69119029T2 (it)
IT (1) IT1247649B (it)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04291948A (ja) * 1991-03-20 1992-10-16 Fujitsu Ltd 半導体装置及びその製造方法及び放熱フィン
IT1252136B (it) * 1991-11-29 1995-06-05 St Microelectronics Srl Struttura di dispositivo a semiconduttore con dissipatore metallico e corpo in plastica, con mezzi per una connessione elettrica al dissipatore di alta affidabilita'
JP3057130B2 (ja) * 1993-02-18 2000-06-26 三菱電機株式会社 樹脂封止型半導体パッケージおよびその製造方法
EP0688650B1 (en) * 1994-01-13 2000-11-02 Citizen Watch Co. Ltd. Method of resin-sealing semiconductor devices
US6466446B1 (en) 1994-07-01 2002-10-15 Saint Gobain/Norton Industrial Ceramics Corporation Integrated circuit package with diamond heat sink
US5609889A (en) * 1995-05-26 1997-03-11 Hestia Technologies, Inc. Apparatus for encapsulating electronic packages
US5652463A (en) * 1995-05-26 1997-07-29 Hestia Technologies, Inc. Transfer modlded electronic package having a passage means
US5817545A (en) * 1996-01-24 1998-10-06 Cornell Research Foundation, Inc. Pressurized underfill encapsulation of integrated circuits
US5846469A (en) * 1996-05-30 1998-12-08 Pacesetter, Inc. Method for manufacturing a defibrillation electrode
US6534337B1 (en) * 1997-05-15 2003-03-18 Texas Instruments Incorporated Lead frame type plastic ball grid array package with pre-assembled ball type contacts
JPH11145364A (ja) * 1997-11-12 1999-05-28 Denso Corp 樹脂封止型半導体装置及びその製造方法
JP3087709B2 (ja) * 1997-12-08 2000-09-11 日本電気株式会社 半導体装置およびその製造方法
US6201695B1 (en) * 1998-10-26 2001-03-13 Micron Technology, Inc. Heat sink for chip stacking applications
KR100522040B1 (ko) * 2003-08-29 2005-10-17 한국기계연구원 압착성형장치의 편심보정용 자가정렬 스테이지
US7271513B2 (en) * 2005-04-15 2007-09-18 Seagate Technology Llc Thermal stress relieved overmolded mounting base
US7560309B1 (en) * 2005-07-26 2009-07-14 Marvell International Ltd. Drop-in heat sink and exposed die-back for molded flip die package
US7468886B2 (en) * 2007-03-05 2008-12-23 International Business Machines Corporation Method and structure to improve thermal dissipation from semiconductor devices
CN105705336B (zh) 2013-10-28 2018-04-24 惠普发展公司，有限责任合伙企业 以低轮廓封装体封装键合线的方法
CN117012656B (zh) * 2023-09-20 2023-12-05 广东气派科技有限公司 高密度大矩阵sot89封装结构的制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
US4215360A (en) * 1978-11-09 1980-07-29 General Motors Corporation Power semiconductor device assembly having a lead frame with interlock members
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
US4470786A (en) * 1981-07-28 1984-09-11 Omron Tateisi Electronics Co. Molding apparatus with retractable preform support pins
US4377548A (en) * 1981-11-27 1983-03-22 Sprague Electric Company Method for encapsulating a radial leaded electrical component
JPS6010632A (ja) * 1983-06-29 1985-01-19 Nec Home Electronics Ltd 半導体装置の製造方法
JPS6188535A (ja) * 1984-10-08 1986-05-06 Nec Corp 半導体装置の製造方法
US4890152A (en) * 1986-02-14 1989-12-26 Matsushita Electric Works, Ltd. Plastic molded chip carrier package and method of fabricating the same
JPH0640557B2 (ja) * 1987-10-06 1994-05-25 サンケン電気株式会社 樹脂封止型半導体装置の製造方法
JPH01179332A (ja) * 1987-12-31 1989-07-17 Sanken Electric Co Ltd 樹脂封止型電子装置の製造方法
JPH01248630A (ja) * 1988-03-30 1989-10-04 Nec Corp 樹脂封止用キャリアボード
JPH0738499B2 (ja) * 1988-06-17 1995-04-26 松下電器産業株式会社 プリント基板の防水処理方法
JP2752677B2 (ja) * 1989-01-11 1998-05-18 日本電気株式会社 半導体装置の製造方法
JPH02306639A (ja) * 1989-05-22 1990-12-20 Toshiba Corp 半導体装置の樹脂封入方法
US5044912A (en) * 1989-12-11 1991-09-03 Motorola, Inc. Mold assembly having positioning means
US5105259A (en) * 1990-09-28 1992-04-14 Motorola, Inc. Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation

Also Published As

Publication number Publication date
IT9083643A1 (it) 1992-05-01
EP0484297A2 (en) 1992-05-06
US5370517A (en) 1994-12-06
EP0484297B1 (en) 1996-04-24
US5244838A (en) 1993-09-14
IT1247649B (it) 1994-12-28
EP0484297A3 (en) 1993-03-24
DE69119029T2 (de) 1996-08-14
DE69119029D1 (de) 1996-05-30

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0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19971030