IT8223326A0 - Dispositivi a circuito integrato a semiconduttori e procedimento per la loro fabbricazione. - Google Patents

Dispositivi a circuito integrato a semiconduttori e procedimento per la loro fabbricazione.

Info

Publication number
IT8223326A0
IT8223326A0 IT8223326A IT2332682A IT8223326A0 IT 8223326 A0 IT8223326 A0 IT 8223326A0 IT 8223326 A IT8223326 A IT 8223326A IT 2332682 A IT2332682 A IT 2332682A IT 8223326 A0 IT8223326 A0 IT 8223326A0
Authority
IT
Italy
Prior art keywords
procedure
manufacturing
integrated circuit
semiconductor integrated
circuit devices
Prior art date
Application number
IT8223326A
Other languages
English (en)
Other versions
IT1153730B (it
Inventor
Setsuo Ogura
Shizuo Kondo
Makoto Furihata
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of IT8223326A0 publication Critical patent/IT8223326A0/it
Application granted granted Critical
Publication of IT1153730B publication Critical patent/IT1153730B/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8248Combination of bipolar and field-effect technology
    • H01L21/8249Bipolar and MOS technology
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8248Combination of bipolar and field-effect technology
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0214Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
    • H01L27/0229Particular design considerations for integrated circuits for internal polarisation, e.g. I2L of bipolar structures
    • H01L27/0233Integrated injection logic structures [I2L]
    • H01L27/0244I2L structures integrated in combination with analog structures
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K19/00Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0175Coupling arrangements; Interface arrangements
    • H03K19/018Coupling arrangements; Interface arrangements using bipolar transistors only
    • H03K19/01806Interface arrangements
    • H03K19/01818Interface arrangements for integrated injection logic (I2L)

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Bipolar Integrated Circuits (AREA)
IT23326/82A 1981-09-24 1982-09-17 Dispositivi a circuito integrato a semiconduttori e procedimento per la loro fabbricazione IT1153730B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56149433A JPS5851561A (ja) 1981-09-24 1981-09-24 半導体集積回路装置

Publications (2)

Publication Number Publication Date
IT8223326A0 true IT8223326A0 (it) 1982-09-17
IT1153730B IT1153730B (it) 1987-01-14

Family

ID=15474999

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23326/82A IT1153730B (it) 1981-09-24 1982-09-17 Dispositivi a circuito integrato a semiconduttori e procedimento per la loro fabbricazione

Country Status (8)

Country Link
JP (1) JPS5851561A (it)
DE (1) DE3235409A1 (it)
FR (2) FR2514200A1 (it)
GB (3) GB2107117B (it)
HK (2) HK69187A (it)
IT (1) IT1153730B (it)
MY (1) MY8700644A (it)
SG (1) SG40887G (it)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5955052A (ja) * 1982-09-24 1984-03-29 Hitachi Ltd 半導体集積回路装置の製造方法
JPS60253261A (ja) * 1984-05-29 1985-12-13 Clarion Co Ltd Iil素子を含む集積回路
JPH0387403A (ja) * 1989-08-31 1991-04-12 Mitsubishi Electric Corp 融雪装置
JP2550736B2 (ja) * 1990-02-14 1996-11-06 三菱電機株式会社 融雪装置
KR920015363A (ko) * 1991-01-22 1992-08-26 김광호 Ttl 입력 버퍼회로

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3594241A (en) * 1968-01-11 1971-07-20 Tektronix Inc Monolithic integrated circuit including field effect transistors and bipolar transistors,and method of making
IT947674B (it) * 1971-04-28 1973-05-30 Ibm Tecnica di diffusione epitassiale per la fabbricazione di transisto ri bipolari e transistori fet
JPS52117086A (en) * 1976-03-29 1977-10-01 Sharp Corp Semiconductor device for touch type switch
JPS52156580A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Semiconductor integrated circuit device and its production
US4258379A (en) * 1978-09-25 1981-03-24 Hitachi, Ltd. IIL With in and outdiffused emitter pocket
US4429326A (en) * 1978-11-29 1984-01-31 Hitachi, Ltd. I2 L Memory with nonvolatile storage
JPS5611661A (en) * 1979-07-09 1981-02-05 Sankyo Seiki Mfg Co Ltd Magnetic card reader of normal card containing type
JPS56116661A (en) * 1980-02-20 1981-09-12 Hitachi Ltd Semiconductor integrated circuit device and manufacture thereof

Also Published As

Publication number Publication date
FR2514200A1 (fr) 1983-04-08
GB2154061A (en) 1985-08-29
GB8502453D0 (en) 1985-03-06
HK69187A (en) 1987-10-02
GB2154060B (en) 1986-05-14
GB2107117B (en) 1986-04-09
MY8700644A (en) 1987-12-31
FR2514200B1 (it) 1984-07-27
IT1153730B (it) 1987-01-14
GB2107117A (en) 1983-04-20
GB2154061B (en) 1986-04-09
SG40887G (en) 1987-07-17
GB2154060A (en) 1985-08-29
HK69887A (en) 1987-10-02
FR2533367A1 (fr) 1984-03-23
FR2533367B1 (fr) 1986-01-24
DE3235409A1 (de) 1983-04-14
GB8502454D0 (en) 1985-03-06
JPS5851561A (ja) 1983-03-26

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