SG40887G - Semiconductor integrated circuit devices and method of manufacturing the same - Google Patents

Semiconductor integrated circuit devices and method of manufacturing the same

Info

Publication number
SG40887G
SG40887G SG40887A SG40887A SG40887G SG 40887 G SG40887 G SG 40887G SG 40887 A SG40887 A SG 40887A SG 40887 A SG40887 A SG 40887A SG 40887 G SG40887 G SG 40887G
Authority
SG
Singapore
Prior art keywords
manufacturing
same
integrated circuit
semiconductor integrated
circuit devices
Prior art date
Application number
SG40887A
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of SG40887G publication Critical patent/SG40887G/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0107Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs
    • H10D84/0109Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs the at least one component covered by H10D12/00 or H10D30/00 being a MOS device
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K19/00Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0175Coupling arrangements; Interface arrangements
    • H03K19/018Coupling arrangements; Interface arrangements using bipolar transistors only
    • H03K19/01806Interface arrangements
    • H03K19/01818Interface arrangements for integrated injection logic (I2L)
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0107Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/60Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
    • H10D84/65Integrated injection logic
    • H10D84/658Integrated injection logic integrated in combination with analog structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Bipolar Integrated Circuits (AREA)
SG40887A 1981-09-24 1987-05-06 Semiconductor integrated circuit devices and method of manufacturing the same SG40887G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56149433A JPS5851561A (en) 1981-09-24 1981-09-24 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
SG40887G true SG40887G (en) 1987-07-17

Family

ID=15474999

Family Applications (1)

Application Number Title Priority Date Filing Date
SG40887A SG40887G (en) 1981-09-24 1987-05-06 Semiconductor integrated circuit devices and method of manufacturing the same

Country Status (8)

Country Link
JP (1) JPS5851561A (en)
DE (1) DE3235409A1 (en)
FR (2) FR2514200A1 (en)
GB (3) GB2107117B (en)
HK (2) HK69887A (en)
IT (1) IT1153730B (en)
MY (1) MY8700644A (en)
SG (1) SG40887G (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5955052A (en) * 1982-09-24 1984-03-29 Hitachi Ltd Semiconductor integrated circuit device and manufacture thereof
JPS60253261A (en) * 1984-05-29 1985-12-13 Clarion Co Ltd Integrated circuit containing iil element
JPH0387403A (en) * 1989-08-31 1991-04-12 Mitsubishi Electric Corp Snow melting device
JP2550736B2 (en) * 1990-02-14 1996-11-06 三菱電機株式会社 Snow melting equipment
KR920015363A (en) * 1991-01-22 1992-08-26 김광호 TTL input buffer circuit

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3594241A (en) * 1968-01-11 1971-07-20 Tektronix Inc Monolithic integrated circuit including field effect transistors and bipolar transistors,and method of making
IT947674B (en) * 1971-04-28 1973-05-30 Ibm EPITAXIAL DIFFUSION TECHNIQUE FOR THE MANUFACTURE OF TRANSISTIC BIPOLAR RI AND FET TRANSISTORS
JPS52117086A (en) * 1976-03-29 1977-10-01 Sharp Corp Semiconductor device for touch type switch
JPS52156580A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Semiconductor integrated circuit device and its production
US4258379A (en) * 1978-09-25 1981-03-24 Hitachi, Ltd. IIL With in and outdiffused emitter pocket
US4429326A (en) * 1978-11-29 1984-01-31 Hitachi, Ltd. I2 L Memory with nonvolatile storage
JPS5611661A (en) * 1979-07-09 1981-02-05 Sankyo Seiki Mfg Co Ltd Magnetic card reader of normal card containing type
JPS56116661A (en) * 1980-02-20 1981-09-12 Hitachi Ltd Semiconductor integrated circuit device and manufacture thereof

Also Published As

Publication number Publication date
GB2107117A (en) 1983-04-20
FR2514200B1 (en) 1984-07-27
GB8502454D0 (en) 1985-03-06
GB2154060B (en) 1986-05-14
GB8502453D0 (en) 1985-03-06
IT8223326A0 (en) 1982-09-17
HK69887A (en) 1987-10-02
JPS5851561A (en) 1983-03-26
DE3235409A1 (en) 1983-04-14
HK69187A (en) 1987-10-02
FR2533367A1 (en) 1984-03-23
GB2154061A (en) 1985-08-29
GB2107117B (en) 1986-04-09
FR2514200A1 (en) 1983-04-08
GB2154060A (en) 1985-08-29
MY8700644A (en) 1987-12-31
FR2533367B1 (en) 1986-01-24
GB2154061B (en) 1986-04-09
IT1153730B (en) 1987-01-14

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