GB2107117B - Semiconductor integrated circuit devices - Google Patents

Semiconductor integrated circuit devices

Info

Publication number
GB2107117B
GB2107117B GB08227060A GB8227060A GB2107117B GB 2107117 B GB2107117 B GB 2107117B GB 08227060 A GB08227060 A GB 08227060A GB 8227060 A GB8227060 A GB 8227060A GB 2107117 B GB2107117 B GB 2107117B
Authority
GB
United Kingdom
Prior art keywords
integrated circuit
semiconductor integrated
circuit devices
devices
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08227060A
Other versions
GB2107117A (en
Inventor
Setsuo Ogura
Shizuo Kondo
Makoto Furihata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB2107117A publication Critical patent/GB2107117A/en
Application granted granted Critical
Publication of GB2107117B publication Critical patent/GB2107117B/en
Priority to SG40987A priority Critical patent/SG40987G/en
Priority to MY648/87A priority patent/MY8700648A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8248—Combination of bipolar and field-effect technology
    • H01L21/8249—Bipolar and MOS technology
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8248—Combination of bipolar and field-effect technology
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0214—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
    • H01L27/0229—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L of bipolar structures
    • H01L27/0233—Integrated injection logic structures [I2L]
    • H01L27/0244—I2L structures integrated in combination with analog structures
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0175—Coupling arrangements; Interface arrangements
    • H03K19/018—Coupling arrangements; Interface arrangements using bipolar transistors only
    • H03K19/01806—Interface arrangements
    • H03K19/01818—Interface arrangements for integrated injection logic (I2L)
GB08227060A 1981-09-24 1982-09-22 Semiconductor integrated circuit devices Expired GB2107117B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SG40987A SG40987G (en) 1981-09-24 1987-05-06 Methods of manufacturing semiconductor circuit devices
MY648/87A MY8700648A (en) 1981-09-24 1987-12-30 Methods of manufacturing semiconductor circuit devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56149433A JPS5851561A (en) 1981-09-24 1981-09-24 Semiconductor integrated circuit device

Publications (2)

Publication Number Publication Date
GB2107117A GB2107117A (en) 1983-04-20
GB2107117B true GB2107117B (en) 1986-04-09

Family

ID=15474999

Family Applications (3)

Application Number Title Priority Date Filing Date
GB08227060A Expired GB2107117B (en) 1981-09-24 1982-09-22 Semiconductor integrated circuit devices
GB08502453A Expired GB2154060B (en) 1981-09-24 1985-01-31 Semiconductor integrated circuit devices
GB08502454A Expired GB2154061B (en) 1981-09-24 1985-01-31 Methods of manufacturing semiconductor circuit devices

Family Applications After (2)

Application Number Title Priority Date Filing Date
GB08502453A Expired GB2154060B (en) 1981-09-24 1985-01-31 Semiconductor integrated circuit devices
GB08502454A Expired GB2154061B (en) 1981-09-24 1985-01-31 Methods of manufacturing semiconductor circuit devices

Country Status (8)

Country Link
JP (1) JPS5851561A (en)
DE (1) DE3235409A1 (en)
FR (2) FR2514200A1 (en)
GB (3) GB2107117B (en)
HK (2) HK69187A (en)
IT (1) IT1153730B (en)
MY (1) MY8700644A (en)
SG (1) SG40887G (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5955052A (en) * 1982-09-24 1984-03-29 Hitachi Ltd Semiconductor integrated circuit device and manufacture thereof
JPS60253261A (en) * 1984-05-29 1985-12-13 Clarion Co Ltd Integrated circuit containing iil element
JPH0387403A (en) * 1989-08-31 1991-04-12 Mitsubishi Electric Corp Snow melting device
JP2550736B2 (en) * 1990-02-14 1996-11-06 三菱電機株式会社 Snow melting equipment
KR920015363A (en) * 1991-01-22 1992-08-26 김광호 TTL input buffer circuit

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3594241A (en) * 1968-01-11 1971-07-20 Tektronix Inc Monolithic integrated circuit including field effect transistors and bipolar transistors,and method of making
IT947674B (en) * 1971-04-28 1973-05-30 Ibm EPITAXIAL DIFFUSION TECHNIQUE FOR THE MANUFACTURE OF TRANSISTIC BIPOLAR RI AND FET TRANSISTORS
JPS52117086A (en) * 1976-03-29 1977-10-01 Sharp Corp Semiconductor device for touch type switch
JPS52156580A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Semiconductor integrated circuit device and its production
US4258379A (en) * 1978-09-25 1981-03-24 Hitachi, Ltd. IIL With in and outdiffused emitter pocket
US4429326A (en) * 1978-11-29 1984-01-31 Hitachi, Ltd. I2 L Memory with nonvolatile storage
JPS5611661A (en) * 1979-07-09 1981-02-05 Sankyo Seiki Mfg Co Ltd Magnetic card reader of normal card containing type
JPS56116661A (en) * 1980-02-20 1981-09-12 Hitachi Ltd Semiconductor integrated circuit device and manufacture thereof

Also Published As

Publication number Publication date
SG40887G (en) 1987-07-17
JPS5851561A (en) 1983-03-26
MY8700644A (en) 1987-12-31
FR2533367B1 (en) 1986-01-24
IT8223326A0 (en) 1982-09-17
GB2154060A (en) 1985-08-29
DE3235409A1 (en) 1983-04-14
GB2154061B (en) 1986-04-09
HK69187A (en) 1987-10-02
GB8502454D0 (en) 1985-03-06
FR2533367A1 (en) 1984-03-23
FR2514200A1 (en) 1983-04-08
GB2154060B (en) 1986-05-14
GB8502453D0 (en) 1985-03-06
FR2514200B1 (en) 1984-07-27
IT1153730B (en) 1987-01-14
GB2154061A (en) 1985-08-29
HK69887A (en) 1987-10-02
GB2107117A (en) 1983-04-20

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19940922