IT8220712A0 - Procedimento e apparecchiatura per allineare una fetta di semiconduttore. - Google Patents

Procedimento e apparecchiatura per allineare una fetta di semiconduttore.

Info

Publication number
IT8220712A0
IT8220712A0 IT8220712A IT2071282A IT8220712A0 IT 8220712 A0 IT8220712 A0 IT 8220712A0 IT 8220712 A IT8220712 A IT 8220712A IT 2071282 A IT2071282 A IT 2071282A IT 8220712 A0 IT8220712 A0 IT 8220712A0
Authority
IT
Italy
Prior art keywords
slice
aligning
semiconductor
procedure
equipment
Prior art date
Application number
IT8220712A
Other languages
English (en)
Other versions
IT1205252B (it
Inventor
Martin Feldman
Alan David White
Donald Lawrence White
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of IT8220712A0 publication Critical patent/IT8220712A0/it
Application granted granted Critical
Publication of IT1205252B publication Critical patent/IT1205252B/it

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
IT20712/82A 1981-04-15 1982-04-13 Procedimento e apparecchiatura per allineare una fetta di semiconduttore IT1205252B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/254,486 US4398824A (en) 1981-04-15 1981-04-15 Wafer tilt compensation in zone plate alignment system

Publications (2)

Publication Number Publication Date
IT8220712A0 true IT8220712A0 (it) 1982-04-13
IT1205252B IT1205252B (it) 1989-03-15

Family

ID=22964476

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20712/82A IT1205252B (it) 1981-04-15 1982-04-13 Procedimento e apparecchiatura per allineare una fetta di semiconduttore

Country Status (10)

Country Link
US (1) US4398824A (it)
JP (1) JPS57178343A (it)
BE (1) BE892840A (it)
CA (1) CA1166363A (it)
DE (1) DE3213338C2 (it)
FR (1) FR2504288B1 (it)
GB (1) GB2098728B (it)
HK (1) HK7486A (it)
IT (1) IT1205252B (it)
NL (1) NL8201571A (it)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3306840A1 (de) * 1983-02-26 1984-09-06 GdA Gesellschaft für digitale Automation mbH, 8000 München Messanordnung zum justieren des werkzeugflansches eines industrieroboters
US4636080A (en) * 1984-05-07 1987-01-13 At&T Bell Laboratories Two-dimensional imaging with line arrays
JPH0814484B2 (ja) * 1985-04-09 1996-02-14 株式会社ニコン パタ−ン位置測定装置
US4790642A (en) * 1986-12-01 1988-12-13 Gca Corporation/Tropel Division Integrated metrology for microlithographic objective reducing lens
US5325176A (en) * 1988-02-16 1994-06-28 Canon Kabushiki Kaisha Position detecting method and apparatus including Fraunhofer diffraction detector
US5327221A (en) * 1988-02-16 1994-07-05 Canon Kabushiki Kaisha Device for detecting positional relationship between two objects
US5294980A (en) * 1988-03-24 1994-03-15 Canon Kabushiki Kaisha Positioning detecting method and apparatus
US5235408A (en) * 1988-09-05 1993-08-10 Canon Kabushiki Kaisha Position detecting method and apparatus
JP2626076B2 (ja) * 1988-09-09 1997-07-02 キヤノン株式会社 位置検出装置
US5155370A (en) * 1988-09-09 1992-10-13 Canon Kabushiki Kaisha Device for detecting the relative position of first and second objects
JP2546350B2 (ja) * 1988-09-09 1996-10-23 キヤノン株式会社 位置合わせ装置
EP0358511B1 (en) * 1988-09-09 2001-07-18 Canon Kabushiki Kaisha Device for detecting positional relationship between two objects
JP2734004B2 (ja) * 1988-09-30 1998-03-30 キヤノン株式会社 位置合わせ装置
JP2704001B2 (ja) * 1989-07-18 1998-01-26 キヤノン株式会社 位置検出装置
DE69013790T2 (de) * 1989-08-04 1995-05-04 Canon Kk Verfahren und Vorrichtung zur Positionsbestimmung.
DE4135959C2 (de) * 1991-10-31 1994-01-20 Leica Ag Heerbrugg Verfahren zur Messung der Neigungen von Grenzflächen in einem optischen System
FR2789068B1 (fr) 1999-02-03 2001-03-16 Optique Et Microsystemes Sa Dispositif d'alignement pour l'assemblage de microsystemes et pour la micro distribution sur microsystemes ou sur microcomposants biotechnologiques
DE19963345A1 (de) 1999-12-27 2001-07-05 Leica Microsystems Optische Messanordnung und Verfahren zur Neigungsmessung
US6778266B2 (en) * 2002-01-12 2004-08-17 Taiwan Semiconductor Manufacturing Co., Ltd Semiconductor wafer tilt monitoring on semiconductor fabrication equipment plate
TWI251722B (en) 2002-09-20 2006-03-21 Asml Netherlands Bv Device inspection
JP4773329B2 (ja) * 2005-12-22 2011-09-14 パナソニック株式会社 界面位置測定方法および測定装置、層厚測定方法および測定装置、並びに、光ディスクの製造方法および製造装置
DE102013207243B4 (de) * 2013-04-22 2019-10-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und verfahren zur herstellung einer struktur aus aushärtbarem material durch abformung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3990798A (en) * 1975-03-07 1976-11-09 Bell Telephone Laboratories, Incorporated Method and apparatus for aligning mask and wafer
US4037969A (en) * 1976-04-02 1977-07-26 Bell Telephone Laboratories, Incorporated Zone plate alignment marks
US4326805A (en) * 1980-04-11 1982-04-27 Bell Telephone Laboratories, Incorporated Method and apparatus for aligning mask and wafer members

Also Published As

Publication number Publication date
FR2504288B1 (fr) 1985-06-28
GB2098728B (en) 1985-06-05
US4398824A (en) 1983-08-16
JPS57178343A (en) 1982-11-02
FR2504288A1 (fr) 1982-10-22
GB2098728A (en) 1982-11-24
CA1166363A (en) 1984-04-24
DE3213338A1 (de) 1982-11-04
BE892840A (fr) 1982-08-02
HK7486A (en) 1986-02-07
JPH0145736B2 (it) 1989-10-04
NL8201571A (nl) 1982-11-01
IT1205252B (it) 1989-03-15
DE3213338C2 (de) 1986-07-10

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