IT201600109764A1 - Sensore mems di tipo piezoelettrico, quale sensore di forza, sensore di pressione, sensore di deformazione o microfono, a sensibilita' migliorata - Google Patents
Sensore mems di tipo piezoelettrico, quale sensore di forza, sensore di pressione, sensore di deformazione o microfono, a sensibilita' migliorataInfo
- Publication number
- IT201600109764A1 IT201600109764A1 IT102016000109764A IT201600109764A IT201600109764A1 IT 201600109764 A1 IT201600109764 A1 IT 201600109764A1 IT 102016000109764 A IT102016000109764 A IT 102016000109764A IT 201600109764 A IT201600109764 A IT 201600109764A IT 201600109764 A1 IT201600109764 A1 IT 201600109764A1
- Authority
- IT
- Italy
- Prior art keywords
- sensor
- microphone
- deformation
- piezoelectric type
- improved sensitivity
- Prior art date
Links
- 230000035945 sensitivity Effects 0.000 title 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
- H04R17/02—Microphones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0027—Structures for transforming mechanical energy, e.g. potential energy of a spring into translation, sound into translation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
- B81B3/0037—For increasing stroke, i.e. achieve large displacement of actuated parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00158—Diaphragms, membranes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/308—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/802—Drive or control circuitry or methods for piezoelectric or electrostrictive devices not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0315—Cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/04—Electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102016000109764A IT201600109764A1 (it) | 2016-10-31 | 2016-10-31 | Sensore mems di tipo piezoelettrico, quale sensore di forza, sensore di pressione, sensore di deformazione o microfono, a sensibilita' migliorata |
CN201720708385.6U CN207891041U (zh) | 2016-10-31 | 2017-06-16 | 压电mems传感器、声换能器和电子器件 |
CN201710459683.0A CN108017036B (zh) | 2016-10-31 | 2017-06-16 | 具有改进灵敏度的压电mems传感器,诸如力、压力、变形传感器或麦克风 |
US15/629,518 US10356531B2 (en) | 2016-10-31 | 2017-06-21 | Piezoelectric MEMS sensor, such as force, pressure, deformation sensor or microphone, with improved sensitivity |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102016000109764A IT201600109764A1 (it) | 2016-10-31 | 2016-10-31 | Sensore mems di tipo piezoelettrico, quale sensore di forza, sensore di pressione, sensore di deformazione o microfono, a sensibilita' migliorata |
Publications (1)
Publication Number | Publication Date |
---|---|
IT201600109764A1 true IT201600109764A1 (it) | 2018-05-01 |
Family
ID=58010296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT102016000109764A IT201600109764A1 (it) | 2016-10-31 | 2016-10-31 | Sensore mems di tipo piezoelettrico, quale sensore di forza, sensore di pressione, sensore di deformazione o microfono, a sensibilita' migliorata |
Country Status (3)
Country | Link |
---|---|
US (1) | US10356531B2 (it) |
CN (2) | CN108017036B (it) |
IT (1) | IT201600109764A1 (it) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT201600109764A1 (it) * | 2016-10-31 | 2018-05-01 | St Microelectronics Srl | Sensore mems di tipo piezoelettrico, quale sensore di forza, sensore di pressione, sensore di deformazione o microfono, a sensibilita' migliorata |
CN109244232B (zh) * | 2018-09-13 | 2023-07-04 | 徐景辉 | 微机电系统压电换能器及制作方法 |
IT201900002663A1 (it) * | 2019-02-25 | 2020-08-25 | St Microelectronics Srl | Sensore di pressione includente un trasduttore microelettromeccanico e relativo metodo di rilevazione di pressione |
US11553280B2 (en) | 2019-06-05 | 2023-01-10 | Skyworks Global Pte. Ltd. | Piezoelectric MEMS diaphragm microphone |
US11350219B2 (en) | 2019-08-13 | 2022-05-31 | Skyworks Solutions, Inc. | Piezoelectric MEMS microphone |
CN112752209B (zh) * | 2019-10-31 | 2022-03-25 | 华为技术有限公司 | 一种压电式mems传感器以及相关设备 |
IT202000010264A1 (it) * | 2020-05-07 | 2021-11-07 | St Microelectronics Srl | Attuatore piezoelettrico avente un sensore di deformazione e relativo procedimento di fabbricazione |
TWI788671B (zh) * | 2020-06-02 | 2023-01-01 | 晶極光電科技股份有限公司 | 多孔壓力感測器的製造方法及其裝置 |
US11681399B2 (en) * | 2021-06-30 | 2023-06-20 | UltraSense Systems, Inc. | User-input systems and methods of detecting a user input at a cover member of a user-input system |
CN113820064A (zh) * | 2021-08-04 | 2021-12-21 | 惠州Tcl云创科技有限公司 | 利用扬声器测量气压的方法、装置、终端设备及存储介质 |
CN114166402A (zh) * | 2021-12-01 | 2022-03-11 | 深圳市锐迪芯电子有限公司 | 一种mems气流压力传感器及其制备方法 |
EP4231528A1 (en) * | 2022-02-17 | 2023-08-23 | Kohler (China) Investment Co. Ltd. | Control device and sanitary equipment |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007117198A1 (en) * | 2006-04-07 | 2007-10-18 | Niklaus Consulting | Microelectromechanical pressure sensor with integrated circuit and method of manufacturing such |
WO2009072704A1 (en) * | 2007-12-05 | 2009-06-11 | Electronics And Telecommunications Research Institute | Micro piezoresistive pressure sensor and manufacturing method thereof |
EP2204641A1 (en) * | 2008-12-30 | 2010-07-07 | STMicroelectronics Srl | Integrated electronic microbalance, in particular integrated chemical sensor for detecting odorous matters |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2669426B1 (fr) * | 1990-11-16 | 1993-10-29 | Onera | Transducteur de force a poutre vibrante piezoelectrique pour capteur accelerometrique. |
US5427975A (en) * | 1993-05-10 | 1995-06-27 | Delco Electronics Corporation | Method of micromachining an integrated sensor on the surface of a silicon wafer |
US5425841A (en) * | 1993-06-16 | 1995-06-20 | Kulite Semiconductor Products, Inc. | Piezoresistive accelerometer with enhanced performance |
US6006607A (en) * | 1998-08-31 | 1999-12-28 | Maxim Integrated Products, Inc. | Piezoresistive pressure sensor with sculpted diaphragm |
US6225140B1 (en) * | 1998-10-13 | 2001-05-01 | Institute Of Microelectronics | CMOS compatable surface machined pressure sensor and method of fabricating the same |
US7307775B2 (en) * | 2000-12-07 | 2007-12-11 | Texas Instruments Incorporated | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
JP2007049473A (ja) * | 2005-08-10 | 2007-02-22 | Murata Mfg Co Ltd | 圧電振動装置 |
JP5191762B2 (ja) * | 2008-03-06 | 2013-05-08 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタ、および通信装置 |
EP3796671A1 (en) | 2008-06-30 | 2021-03-24 | The Regents of the University of Michigan | Piezoelectric mems microphone |
US8222796B2 (en) * | 2008-10-15 | 2012-07-17 | International Business Machines Corporation | Micro-electro-mechanical device with a piezoelectric actuator |
JP2010118730A (ja) * | 2008-11-11 | 2010-05-27 | Toshiba Corp | 圧電デバイス及びその製造方法 |
JP5652775B2 (ja) * | 2009-05-29 | 2015-01-14 | トレックス・セミコンダクター株式会社 | 加速度センサー素子およびこれを有する加速度センサー |
US9341529B2 (en) * | 2009-11-04 | 2016-05-17 | Rohm Co., Ltd | Pressure sensor and method for manufacturing pressure sensor |
US9372111B2 (en) * | 2012-08-21 | 2016-06-21 | Board Of Regents, The University Of Texas System | Acoustic sensor |
US9805966B2 (en) * | 2014-07-25 | 2017-10-31 | Akoustis, Inc. | Wafer scale packaging |
IT201600109764A1 (it) * | 2016-10-31 | 2018-05-01 | St Microelectronics Srl | Sensore mems di tipo piezoelettrico, quale sensore di forza, sensore di pressione, sensore di deformazione o microfono, a sensibilita' migliorata |
-
2016
- 2016-10-31 IT IT102016000109764A patent/IT201600109764A1/it unknown
-
2017
- 2017-06-16 CN CN201710459683.0A patent/CN108017036B/zh active Active
- 2017-06-16 CN CN201720708385.6U patent/CN207891041U/zh active Active
- 2017-06-21 US US15/629,518 patent/US10356531B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007117198A1 (en) * | 2006-04-07 | 2007-10-18 | Niklaus Consulting | Microelectromechanical pressure sensor with integrated circuit and method of manufacturing such |
WO2009072704A1 (en) * | 2007-12-05 | 2009-06-11 | Electronics And Telecommunications Research Institute | Micro piezoresistive pressure sensor and manufacturing method thereof |
EP2204641A1 (en) * | 2008-12-30 | 2010-07-07 | STMicroelectronics Srl | Integrated electronic microbalance, in particular integrated chemical sensor for detecting odorous matters |
Also Published As
Publication number | Publication date |
---|---|
CN108017036A (zh) | 2018-05-11 |
CN207891041U (zh) | 2018-09-21 |
CN108017036B (zh) | 2023-04-11 |
US10356531B2 (en) | 2019-07-16 |
US20180124521A1 (en) | 2018-05-03 |
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