ITUB20161080A1 - Dispositivo sensore di pressione di tipo micro-elettro-meccanico con ridotta sensibilita' alla temperatura - Google Patents

Dispositivo sensore di pressione di tipo micro-elettro-meccanico con ridotta sensibilita' alla temperatura

Info

Publication number
ITUB20161080A1
ITUB20161080A1 ITUB2016A001080A ITUB20161080A ITUB20161080A1 IT UB20161080 A1 ITUB20161080 A1 IT UB20161080A1 IT UB2016A001080 A ITUB2016A001080 A IT UB2016A001080A IT UB20161080 A ITUB20161080 A IT UB20161080A IT UB20161080 A1 ITUB20161080 A1 IT UB20161080A1
Authority
IT
Italy
Prior art keywords
electro
micro
pressure sensor
sensor device
mechanical type
Prior art date
Application number
ITUB2016A001080A
Other languages
English (en)
Inventor
Enri Duqi
Sebastiano Conti
Lorenzo Baldo
Flavio Francesco Villa
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to ITUB2016A001080A priority Critical patent/ITUB20161080A1/it
Priority to US15/276,613 priority patent/US9975756B2/en
Priority to CN201621255067.0U priority patent/CN206872419U/zh
Priority to CN201611035493.8A priority patent/CN107117577B/zh
Priority to EP16194672.8A priority patent/EP3210934B1/en
Publication of ITUB20161080A1 publication Critical patent/ITUB20161080A1/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0027—Structures for transforming mechanical energy, e.g. potential energy of a spring into translation, sound into translation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
    • B81B7/0019—Protection against thermal alteration or destruction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0086—Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B81C1/00373—Selective deposition, e.g. printing or microcontact printing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/145—Housings with stress relieving means
    • G01L19/146—Housings with stress relieving means using flexible element between the transducer and the support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0183—Selective deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Child & Adolescent Psychology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
ITUB2016A001080A 2016-02-25 2016-02-25 Dispositivo sensore di pressione di tipo micro-elettro-meccanico con ridotta sensibilita' alla temperatura ITUB20161080A1 (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
ITUB2016A001080A ITUB20161080A1 (it) 2016-02-25 2016-02-25 Dispositivo sensore di pressione di tipo micro-elettro-meccanico con ridotta sensibilita' alla temperatura
US15/276,613 US9975756B2 (en) 2016-02-25 2016-09-26 Micro-electro-mechanical pressure device and methods of forming same
CN201621255067.0U CN206872419U (zh) 2016-02-25 2016-09-30 微机电压力传感器装置
CN201611035493.8A CN107117577B (zh) 2016-02-25 2016-09-30 具有较低的温度灵敏度的微机电型压力装置
EP16194672.8A EP3210934B1 (en) 2016-02-25 2016-10-19 Micro-electro-mechanical type pressure device having low sensitivity to temperature

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUB2016A001080A ITUB20161080A1 (it) 2016-02-25 2016-02-25 Dispositivo sensore di pressione di tipo micro-elettro-meccanico con ridotta sensibilita' alla temperatura

Publications (1)

Publication Number Publication Date
ITUB20161080A1 true ITUB20161080A1 (it) 2017-08-25

Family

ID=55949001

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUB2016A001080A ITUB20161080A1 (it) 2016-02-25 2016-02-25 Dispositivo sensore di pressione di tipo micro-elettro-meccanico con ridotta sensibilita' alla temperatura

Country Status (4)

Country Link
US (1) US9975756B2 (it)
EP (1) EP3210934B1 (it)
CN (2) CN107117577B (it)
IT (1) ITUB20161080A1 (it)

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ITUB20161080A1 (it) * 2016-02-25 2017-08-25 St Microelectronics Srl Dispositivo sensore di pressione di tipo micro-elettro-meccanico con ridotta sensibilita' alla temperatura
DE102017203384B3 (de) * 2017-03-02 2018-01-18 Robert Bosch Gmbh Mikromechanischer Drucksensor
US10407298B2 (en) * 2017-07-28 2019-09-10 Advanced Semiconductor Engineering Korea, Inc. Microelectromechanical systems and method of manufacturing the same
CN107894297B (zh) * 2017-11-07 2020-02-18 无锡必创传感科技有限公司 一种压力传感器芯片及其制造方法
US20210002128A1 (en) 2018-12-03 2021-01-07 X-Celeprint Limited Enclosed cavity structures
US11981560B2 (en) * 2020-06-09 2024-05-14 Analog Devices, Inc. Stress-isolated MEMS device comprising substrate having cavity and method of manufacture

Citations (2)

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WO2007042336A2 (en) * 2005-10-14 2007-04-19 Stmicroelectronics S.R.L. Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device
US20150001651A1 (en) * 2013-06-28 2015-01-01 Stmicroelectronics S.R.I. Mems device having a suspended diaphragm and manufacturing process thereof

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EP1577656B1 (en) 2004-03-19 2010-06-09 STMicroelectronics Srl Method for manufacturing a semiconductor pressure sensor
DE602005023761D1 (de) * 2004-10-27 2010-11-04 Epcos Ag Verringerung der luftdämpfung in einer mems-vorrichtung
EP2159558A1 (en) * 2008-08-28 2010-03-03 Sensirion AG A method for manufacturing an integrated pressure sensor
ITTO20090616A1 (it) * 2009-08-05 2011-02-06 St Microelectronics Srl Procedimento di fabbricazione di dispositivi mems dotati di cavita' sepolte e dispositivo mems cosi' ottenuto
WO2011048521A1 (en) * 2009-10-21 2011-04-28 Koninklijke Philips Electronics N.V. Microfluidic cartridge with parallel pneumatic interface plate
WO2013134741A2 (en) * 2012-03-08 2013-09-12 Cyvek, Inc. Methods and systems for manufacture of microarray assay systems, conducting microfluidic assays, and monitoring and scanning to obtain microfluidic assay results
US8217474B2 (en) * 2009-12-28 2012-07-10 Solid State System Co., Ltd. Hermetic MEMS device and method for fabricating hermetic MEMS device and package structure of MEMS device
FR2994228B1 (fr) * 2012-07-31 2017-05-12 Commissariat Energie Atomique Pompe realisee dans un substrat
ITTO20130539A1 (it) * 2013-06-28 2014-12-29 Stmicroelectronics International N V Dispositivo mems incorporante un percorso fluidico e relativo procedimento di fabbricazione
US9114976B1 (en) * 2014-03-07 2015-08-25 Taiwan Semiconductor Manufacturing Company Limited Semiconductor arrangement with stress release configuration
US10428721B2 (en) * 2014-04-25 2019-10-01 Hitachi Automotive Systems, Ltd. Cooling control device, flow rate control valve and cooling control method
CN104062059B (zh) * 2014-06-13 2017-12-01 江苏英特神斯科技有限公司 一种mems压阻式压力传感器及其制造方法
CN106257254B (zh) * 2015-06-22 2020-03-20 意法半导体股份有限公司 生成具有降低的环境温度依赖性的换能信号的压力传感器及其制造方法
ITUB20155716A1 (it) * 2015-11-19 2017-05-19 St Microelectronics Srl Dispositivo micro-elettro-meccanico dotato di due cavita' sepolte e relativo procedimento di fabbricazione
US9670057B1 (en) * 2016-01-29 2017-06-06 Infineon Technologies Ag Sensor device and method for making thereof
ITUB20161080A1 (it) * 2016-02-25 2017-08-25 St Microelectronics Srl Dispositivo sensore di pressione di tipo micro-elettro-meccanico con ridotta sensibilita' alla temperatura

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007042336A2 (en) * 2005-10-14 2007-04-19 Stmicroelectronics S.R.L. Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device
US20150001651A1 (en) * 2013-06-28 2015-01-01 Stmicroelectronics S.R.I. Mems device having a suspended diaphragm and manufacturing process thereof

Also Published As

Publication number Publication date
CN107117577B (zh) 2019-12-31
CN206872419U (zh) 2018-01-12
US20170247249A1 (en) 2017-08-31
EP3210934B1 (en) 2020-06-17
EP3210934A1 (en) 2017-08-30
US9975756B2 (en) 2018-05-22
CN107117577A (zh) 2017-09-01

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