ITUB20153580A1 - Dispositivo sensore microelettromeccanico con ridotta sensibilita' agli stress e relativo procedimento di fabbricazione - Google Patents

Dispositivo sensore microelettromeccanico con ridotta sensibilita' agli stress e relativo procedimento di fabbricazione

Info

Publication number
ITUB20153580A1
ITUB20153580A1 ITUB2015A003580A ITUB20153580A ITUB20153580A1 IT UB20153580 A1 ITUB20153580 A1 IT UB20153580A1 IT UB2015A003580 A ITUB2015A003580 A IT UB2015A003580A IT UB20153580 A ITUB20153580 A IT UB20153580A IT UB20153580 A1 ITUB20153580 A1 IT UB20153580A1
Authority
IT
Italy
Prior art keywords
microelettromechanical
stress
sensor device
manufacturing procedure
reduced sensitivity
Prior art date
Application number
ITUB2015A003580A
Other languages
English (en)
Inventor
Enri Duqi
Sebastiano Conti
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to ITUB2015A003580A priority Critical patent/ITUB20153580A1/it
Priority to US15/074,755 priority patent/US9914639B2/en
Priority to EP16161870.7A priority patent/EP3141521B1/en
Priority to CN201620257596.8U priority patent/CN205820885U/zh
Priority to CN201610191890.8A priority patent/CN106517079B/zh
Publication of ITUB20153580A1 publication Critical patent/ITUB20153580A1/it
Priority to US15/880,332 priority patent/US10427933B2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0054—Packages or encapsulation for reducing stress inside of the package structure between other parts not provided for in B81B7/0048 - B81B7/0051
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0051—For defining the movement, i.e. structures that guide or limit the movement of an element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/008—MEMS characterised by an electronic circuit specially adapted for controlling or driving the same
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
ITUB2015A003580A 2015-09-11 2015-09-11 Dispositivo sensore microelettromeccanico con ridotta sensibilita' agli stress e relativo procedimento di fabbricazione ITUB20153580A1 (it)

Priority Applications (6)

Application Number Priority Date Filing Date Title
ITUB2015A003580A ITUB20153580A1 (it) 2015-09-11 2015-09-11 Dispositivo sensore microelettromeccanico con ridotta sensibilita' agli stress e relativo procedimento di fabbricazione
US15/074,755 US9914639B2 (en) 2015-09-11 2016-03-18 Microelectromechanical sensor device with reduced stress-sensitivity and corresponding manufacturing process
EP16161870.7A EP3141521B1 (en) 2015-09-11 2016-03-23 Microelectromechanical sensor device with reduced stress-sensitivity and corresponding manufacturing process
CN201620257596.8U CN205820885U (zh) 2015-09-11 2016-03-30 微电机系统器件
CN201610191890.8A CN106517079B (zh) 2015-09-11 2016-03-30 有减少的应力灵敏度的微电机传感器器件和对应制造工艺
US15/880,332 US10427933B2 (en) 2015-09-11 2018-01-25 Microelectromechanical sensor device with reduced stress-sensitivity and corresponding manufacturing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUB2015A003580A ITUB20153580A1 (it) 2015-09-11 2015-09-11 Dispositivo sensore microelettromeccanico con ridotta sensibilita' agli stress e relativo procedimento di fabbricazione

Publications (1)

Publication Number Publication Date
ITUB20153580A1 true ITUB20153580A1 (it) 2017-03-11

Family

ID=54601961

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUB2015A003580A ITUB20153580A1 (it) 2015-09-11 2015-09-11 Dispositivo sensore microelettromeccanico con ridotta sensibilita' agli stress e relativo procedimento di fabbricazione

Country Status (4)

Country Link
US (2) US9914639B2 (it)
EP (1) EP3141521B1 (it)
CN (2) CN205820885U (it)
IT (1) ITUB20153580A1 (it)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITUB20153580A1 (it) * 2015-09-11 2017-03-11 St Microelectronics Srl Dispositivo sensore microelettromeccanico con ridotta sensibilita' agli stress e relativo procedimento di fabbricazione
US10278281B1 (en) * 2015-10-30 2019-04-30 Garmin International, Inc. MEMS stress isolation and stabilization system
US10196259B2 (en) 2015-12-30 2019-02-05 Mems Drive, Inc. MEMS actuator structures resistant to shock
DE102016216870B4 (de) 2016-09-06 2019-07-18 Robert Bosch Gmbh Verfahren zum Herstellen eines mikromechanischen Bauteils mit einer freigestellten Drucksensoreinrichtung
KR102359943B1 (ko) * 2017-09-13 2022-02-07 현대자동차 주식회사 마이크로폰 장치
DE102017220349B3 (de) * 2017-11-15 2018-06-14 Robert Bosch Gmbh Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren
EP3779391A1 (en) * 2019-08-14 2021-02-17 Sciosense B.V. Sensor arrangement and method for fabricating a sensor arrangement
US20220162058A1 (en) * 2020-11-24 2022-05-26 Taiwan Semiconductor Manufacturing Co., Ltd. Wire-bond damper for shock absorption

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040232507A1 (en) * 2002-05-31 2004-11-25 Eiichi Furukubo Sensor package
DE102007010711A1 (de) * 2007-02-28 2008-09-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Schaltanordnung und Verfahren zu deren Herstellung
US20110298064A1 (en) * 2009-02-06 2011-12-08 Epcos Ag Sensor module and method for producing sensor modules
US20130020718A1 (en) * 2011-07-22 2013-01-24 Taiwan Semiconductor Manufacturing Company, Ltd. MEMS Devices and Methods of Forming Same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4568202B2 (ja) * 2005-09-29 2010-10-27 Ｏｋｉセミコンダクタ株式会社 半導体装置
US8746156B2 (en) * 2009-12-17 2014-06-10 Richard J. Camarillo Portable desk apparatus and methods
FR2954505B1 (fr) 2009-12-22 2012-08-03 Commissariat Energie Atomique Structure micromecanique comportant une partie mobile presentant des butees pour des deplacements hors plan de la structure et son procede de realisation
US9242851B2 (en) * 2013-08-06 2016-01-26 Freescale Semiconductor, Inc MEMS device with differential vertical sense electrodes
US9574959B2 (en) * 2014-09-02 2017-02-21 Apple Inc. Various stress free sensor packages using wafer level supporting die and air gap technique
ITUB20153580A1 (it) * 2015-09-11 2017-03-11 St Microelectronics Srl Dispositivo sensore microelettromeccanico con ridotta sensibilita' agli stress e relativo procedimento di fabbricazione

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040232507A1 (en) * 2002-05-31 2004-11-25 Eiichi Furukubo Sensor package
DE102007010711A1 (de) * 2007-02-28 2008-09-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Schaltanordnung und Verfahren zu deren Herstellung
US20110298064A1 (en) * 2009-02-06 2011-12-08 Epcos Ag Sensor module and method for producing sensor modules
US20130020718A1 (en) * 2011-07-22 2013-01-24 Taiwan Semiconductor Manufacturing Company, Ltd. MEMS Devices and Methods of Forming Same

Also Published As

Publication number Publication date
US10427933B2 (en) 2019-10-01
US9914639B2 (en) 2018-03-13
CN106517079B (zh) 2021-05-07
US20170073220A1 (en) 2017-03-16
US20180148321A1 (en) 2018-05-31
CN205820885U (zh) 2016-12-21
EP3141521B1 (en) 2020-07-22
CN106517079A (zh) 2017-03-22
EP3141521A1 (en) 2017-03-15

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