ITUA20162174A1 - Procedimento di fabbricazione di un sensore di pressione mems e relativo sensore di pressione mems - Google Patents
Procedimento di fabbricazione di un sensore di pressione mems e relativo sensore di pressione memsInfo
- Publication number
- ITUA20162174A1 ITUA20162174A1 ITUA2016A002174A ITUA20162174A ITUA20162174A1 IT UA20162174 A1 ITUA20162174 A1 IT UA20162174A1 IT UA2016A002174 A ITUA2016A002174 A IT UA2016A002174A IT UA20162174 A ITUA20162174 A IT UA20162174A IT UA20162174 A1 ITUA20162174 A1 IT UA20162174A1
- Authority
- IT
- Italy
- Prior art keywords
- pressure sensor
- mems pressure
- manufacture
- relative
- mems
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0006—Interconnects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00158—Diaphragms, membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0111—Bulk micromachining
- B81C2201/0116—Thermal treatment for structural rearrangement of substrate atoms, e.g. for making buried cavities
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUA2016A002174A ITUA20162174A1 (it) | 2016-03-31 | 2016-03-31 | Procedimento di fabbricazione di un sensore di pressione mems e relativo sensore di pressione mems |
US15/276,617 US10048148B2 (en) | 2016-03-31 | 2016-09-26 | Process for manufacturing a MEMS pressure sensor, and corresponding MEMS pressure sensor |
CN201610868540.0A CN107265395B (zh) | 2016-03-31 | 2016-09-29 | 用于制造mems压力传感器的方法和相应的mems压力传感器 |
CN201621095937.2U CN206126837U (zh) | 2016-03-31 | 2016-09-29 | 具有微机械结构的mems压力传感器 |
CN202010562184.6A CN111704104A (zh) | 2016-03-31 | 2016-09-29 | 用于制造mems压力传感器的方法和相应的mems压力传感器 |
EP16194692.6A EP3225586B1 (en) | 2016-03-31 | 2016-10-19 | Process for manufacturing a mems pressure sensor, and corresponding mems pressure sensor |
US15/958,461 US10578505B2 (en) | 2016-03-31 | 2018-04-20 | Process for manufacturing a MEMS pressure sensor, and corresponding MEMS pressure sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUA2016A002174A ITUA20162174A1 (it) | 2016-03-31 | 2016-03-31 | Procedimento di fabbricazione di un sensore di pressione mems e relativo sensore di pressione mems |
Publications (1)
Publication Number | Publication Date |
---|---|
ITUA20162174A1 true ITUA20162174A1 (it) | 2017-10-01 |
Family
ID=56235946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITUA2016A002174A ITUA20162174A1 (it) | 2016-03-31 | 2016-03-31 | Procedimento di fabbricazione di un sensore di pressione mems e relativo sensore di pressione mems |
Country Status (4)
Country | Link |
---|---|
US (2) | US10048148B2 (it) |
EP (1) | EP3225586B1 (it) |
CN (3) | CN107265395B (it) |
IT (1) | ITUA20162174A1 (it) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITTO20130502A1 (it) * | 2013-06-18 | 2014-12-19 | St Microelectronics Asia | Dispositivo elettronico con sensore di temperatura integrato e relativo metodo di fabbricazione |
US10753815B2 (en) * | 2015-10-28 | 2020-08-25 | Hewlett-Packard Development Company, L.P. | Relative pressure sensor |
ITUA20162174A1 (it) * | 2016-03-31 | 2017-10-01 | St Microelectronics Srl | Procedimento di fabbricazione di un sensore di pressione mems e relativo sensore di pressione mems |
DE102017202605A1 (de) * | 2017-02-17 | 2018-08-23 | Robert Bosch Gmbh | Mikromechanische Anordnung mit einem sensitiven Element und dazugehöriges Herstellungsverfahren |
CN108072477B (zh) * | 2017-12-05 | 2020-09-18 | 北京遥测技术研究所 | 一种mems气压传感器以及提高其长期稳定性的方法 |
IT201800001092A1 (it) * | 2018-01-16 | 2019-07-16 | St Microelectronics Srl | Sensore di pressione piezoresistivo microelettromeccanico con capacita' di auto-diagnosi e relativo procedimento di fabbricazione |
CN109029828B (zh) * | 2018-06-07 | 2019-08-02 | 江苏大学 | 一种电容式差压传感器及其输出特性计算方法与制作方法 |
CN109141728A (zh) * | 2018-07-18 | 2019-01-04 | 江苏大学 | 一种感压膜中间固定式电容压力传感器及制作方法 |
CN110862063A (zh) * | 2018-08-28 | 2020-03-06 | 无锡华润上华科技有限公司 | 温度传感器制备方法及温度传感器 |
US11865581B2 (en) | 2018-11-21 | 2024-01-09 | Stmicroelectronics S.R.L. | Ultrasonic MEMS acoustic transducer with reduced stress sensitivity and manufacturing process thereof |
DE102018222758A1 (de) * | 2018-12-21 | 2020-06-25 | Robert Bosch Gmbh | MEMS-Sensor mit einer Membran sowie Verfahren zur Herstellung eines MEMS-Sensors |
DE102018222738A1 (de) | 2018-12-21 | 2020-06-25 | Robert Bosch Gmbh | Mikromechanische Drucksensorvorrichtung und ein entsprechendes Herstellungsverfahren |
CN109809355A (zh) * | 2019-03-06 | 2019-05-28 | 苏州敏芯微电子技术股份有限公司 | 压力传感器及其制造方法 |
JP7147650B2 (ja) * | 2019-03-20 | 2022-10-05 | 株式会社デンソー | 半導体装置およびその製造方法 |
CN112357875B (zh) * | 2020-11-06 | 2023-12-26 | 杭州士兰微电子股份有限公司 | Mems传感器及其制备方法 |
DE102022201813A1 (de) | 2022-02-22 | 2023-08-24 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zum Bilden einer zumindest eine Aussparung umgebenden Schichtstruktur und Vorrichtung mit einer Schichtstruktur |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120043627A1 (en) * | 2010-08-23 | 2012-02-23 | Freescale Semiconductor, Inc. | MEMS Sensor Device With Multi-Stimulus Sensing and Method of Fabricating Same |
EP2423157A2 (en) * | 2010-08-23 | 2012-02-29 | Freescale Semiconductor, Inc. | MEMS pressure sensor device and method of fabricating same |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5332469A (en) * | 1992-11-12 | 1994-07-26 | Ford Motor Company | Capacitive surface micromachined differential pressure sensor |
US5427975A (en) * | 1993-05-10 | 1995-06-27 | Delco Electronics Corporation | Method of micromachining an integrated sensor on the surface of a silicon wafer |
DE60127148T2 (de) | 2001-12-28 | 2007-12-13 | Stmicroelectronics S.R.L., Agrate Brianza | Herstellungsverfahren für SOI Scheibe durch Wärmebehandlung und Oxidation von vergrabenen Kanälen |
DE602004027597D1 (de) * | 2004-03-19 | 2010-07-22 | St Microelectronics Srl | Halbleiterdrucksensor und Verfahren zur Herstellung |
EP2043728A2 (en) * | 2006-07-11 | 2009-04-08 | Microchips, Inc. | Multi-reservoir pump device for dialysis, biosensing, or delivery of substances |
US8193596B2 (en) * | 2008-09-03 | 2012-06-05 | Solid State System Co., Ltd. | Micro-electro-mechanical systems (MEMS) package |
IT1395550B1 (it) * | 2008-12-23 | 2012-09-28 | St Microelectronics Rousset | Trasduttore acustico integrato in tecnologia mems e relativo processo di fabbricazione |
DE102010064120B4 (de) * | 2010-12-23 | 2023-05-25 | Robert Bosch Gmbh | Bauteil und Verfahren zu dessen Herstellung |
US20130001710A1 (en) * | 2011-06-29 | 2013-01-03 | Invensense, Inc. | Process for a sealed mems device with a portion exposed to the environment |
WO2014060845A1 (en) * | 2012-09-12 | 2014-04-24 | Funai Electric Co., Ltd. | Maintenance valves for micro-fluid ejection heads |
GB2506174A (en) * | 2012-09-24 | 2014-03-26 | Wolfson Microelectronics Plc | Protecting a MEMS device from excess pressure and shock |
US9676614B2 (en) * | 2013-02-01 | 2017-06-13 | Analog Devices, Inc. | MEMS device with stress relief structures |
DE102013217726B4 (de) * | 2013-09-05 | 2021-07-29 | Robert Bosch Gmbh | Mikromechanisches Bauteil für eine kapazitive Sensorvorrichtung und Herstellungsverfahren für ein mikromechanisches Bauteil für eine kapazitive Sensorvorrichtung |
EP2887387A1 (en) * | 2013-12-20 | 2015-06-24 | Nxp B.V. | Semiconductor device and associated method |
DE102014200500A1 (de) * | 2014-01-14 | 2015-07-16 | Robert Bosch Gmbh | Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren |
US9114976B1 (en) * | 2014-03-07 | 2015-08-25 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor arrangement with stress release configuration |
US10023461B2 (en) * | 2014-10-31 | 2018-07-17 | Stmicroelectronics S.R.L. | Microintegrated encapsulated MEMS sensor with mechanical decoupling and manufacturing process thereof |
JP2018521317A (ja) * | 2015-06-15 | 2018-08-02 | テクノロジアン テュトキムスケスクス ヴェーテーテー オサケ ユキチュア | Mems容量式圧力センサおよびその製造方法 |
CN205262665U (zh) * | 2015-06-22 | 2016-05-25 | 意法半导体股份有限公司 | 压力传感器 |
ITUA20162174A1 (it) * | 2016-03-31 | 2017-10-01 | St Microelectronics Srl | Procedimento di fabbricazione di un sensore di pressione mems e relativo sensore di pressione mems |
-
2016
- 2016-03-31 IT ITUA2016A002174A patent/ITUA20162174A1/it unknown
- 2016-09-26 US US15/276,617 patent/US10048148B2/en active Active
- 2016-09-29 CN CN201610868540.0A patent/CN107265395B/zh active Active
- 2016-09-29 CN CN202010562184.6A patent/CN111704104A/zh active Pending
- 2016-09-29 CN CN201621095937.2U patent/CN206126837U/zh not_active Withdrawn - After Issue
- 2016-10-19 EP EP16194692.6A patent/EP3225586B1/en active Active
-
2018
- 2018-04-20 US US15/958,461 patent/US10578505B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120043627A1 (en) * | 2010-08-23 | 2012-02-23 | Freescale Semiconductor, Inc. | MEMS Sensor Device With Multi-Stimulus Sensing and Method of Fabricating Same |
EP2423157A2 (en) * | 2010-08-23 | 2012-02-29 | Freescale Semiconductor, Inc. | MEMS pressure sensor device and method of fabricating same |
Also Published As
Publication number | Publication date |
---|---|
CN107265395A (zh) | 2017-10-20 |
US10048148B2 (en) | 2018-08-14 |
US20170284882A1 (en) | 2017-10-05 |
CN206126837U (zh) | 2017-04-26 |
US10578505B2 (en) | 2020-03-03 |
CN111704104A (zh) | 2020-09-25 |
EP3225586B1 (en) | 2019-05-08 |
CN107265395B (zh) | 2020-07-21 |
US20180299337A1 (en) | 2018-10-18 |
EP3225586A1 (en) | 2017-10-04 |
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