IT1293454B1 - Lega a base di rame a conduttivita' elettrica e a temperatura di addolcimento elevate per applicazioni nell'elettronica. - Google Patents

Lega a base di rame a conduttivita' elettrica e a temperatura di addolcimento elevate per applicazioni nell'elettronica.

Info

Publication number
IT1293454B1
IT1293454B1 IT97TO000641A ITTO970641A IT1293454B1 IT 1293454 B1 IT1293454 B1 IT 1293454B1 IT 97TO000641 A IT97TO000641 A IT 97TO000641A IT TO970641 A ITTO970641 A IT TO970641A IT 1293454 B1 IT1293454 B1 IT 1293454B1
Authority
IT
Italy
Prior art keywords
electronics
copper
applications
electric conductivity
based alloy
Prior art date
Application number
IT97TO000641A
Other languages
English (en)
Inventor
Gerard Durand-Texte
Original Assignee
Griset Ets
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9494626&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=IT1293454(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Griset Ets filed Critical Griset Ets
Publication of ITTO970641A1 publication Critical patent/ITTO970641A1/it
Application granted granted Critical
Publication of IT1293454B1 publication Critical patent/IT1293454B1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Non-Insulated Conductors (AREA)
IT97TO000641A 1996-07-30 1997-07-15 Lega a base di rame a conduttivita' elettrica e a temperatura di addolcimento elevate per applicazioni nell'elettronica. IT1293454B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9609575A FR2751990B1 (fr) 1996-07-30 1996-07-30 Alliage a base de cuivre a conductivite electrique et a temperature d'adoucissement elevees pour des applications dans l'electronique

Publications (2)

Publication Number Publication Date
ITTO970641A1 ITTO970641A1 (it) 1999-01-15
IT1293454B1 true IT1293454B1 (it) 1999-03-01

Family

ID=9494626

Family Applications (1)

Application Number Title Priority Date Filing Date
IT97TO000641A IT1293454B1 (it) 1996-07-30 1997-07-15 Lega a base di rame a conduttivita' elettrica e a temperatura di addolcimento elevate per applicazioni nell'elettronica.

Country Status (6)

Country Link
US (1) US6149741A (it)
JP (1) JP4199320B2 (it)
KR (1) KR100429109B1 (it)
DE (1) DE19732837C2 (it)
FR (1) FR2751990B1 (it)
IT (1) IT1293454B1 (it)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349085A (ja) * 1999-06-01 2000-12-15 Nec Corp 半導体装置及び半導体装置の製造方法
JP3465108B2 (ja) * 2000-05-25 2003-11-10 株式会社神戸製鋼所 電気・電子部品用銅合金
FR2880358B1 (fr) * 2005-01-06 2007-12-28 Trefimetaux Alliages de cuivre et produits lamines correspondants pour applications electroniques
EP2045344B1 (en) 2006-07-21 2012-05-23 Kabushiki Kaisha Kobe Seiko Sho Process for producing copper alloy sheets for electrical/electronic part
US20140048587A1 (en) * 2012-02-07 2014-02-20 Paul Rivest Brazing alloy and processes for making and using

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2375285A (en) * 1943-01-22 1945-05-08 Chase Brass & Copper Co Spring
SU490855A1 (ru) * 1974-04-04 1975-11-05 Предприятие П/Я В-2836 Сплав на основе меди
JPS5815528B2 (ja) * 1975-07-04 1983-03-26 株式会社東芝 セキシユツコウカガタドウゴウキン
KR840001426B1 (ko) * 1982-10-20 1984-09-26 이영세 전기전자 부품용 동합금 및 동합금판의 제조방법
JPH0674463B2 (ja) * 1983-01-29 1994-09-21 古河電気工業株式会社 リ−ドフレ−ム用銅合金
JPS60114546A (ja) * 1983-11-24 1985-06-21 Mitsubishi Electric Corp 電子機器材料用銅合金
GB2158095B (en) * 1984-04-26 1988-04-20 Poong San Metal Corp Copper alloys for integrated circuit leads
JPS62120450A (ja) * 1985-11-19 1987-06-01 Nakasato Kk 電気・電子機器用電気機械的接続ばね材料の製造法
JPS62278243A (ja) * 1986-05-27 1987-12-03 Dowa Mining Co Ltd リ−ドフレ−ム材用銅合金およびその製造法
ES2011467B3 (es) * 1986-06-20 1990-01-16 Km-Kabelmetal Ag Empleo de una aleacion de cobre
DE3620655A1 (de) * 1986-06-20 1987-12-23 Kabel Metallwerke Ghh Verwendung einer kupferlegierung
JPH0387341A (ja) * 1989-08-30 1991-04-12 Nippon Mining Co Ltd 曲げ加工性の良好な高強度りん青銅の製造方法
JPH03104845A (ja) * 1989-09-18 1991-05-01 Nippon Mining Co Ltd 曲げ加工性の良好な高強度りん青銅の製造方法
JP2871801B2 (ja) * 1990-04-13 1999-03-17 古河電気工業株式会社 析出硬化型銅合金の溶体化処理方法
JPH04165055A (ja) * 1990-10-29 1992-06-10 Hitachi Cable Ltd 半導体装置用リードフレーム材
JPH04311544A (ja) * 1991-04-08 1992-11-04 Nikko Kyodo Co Ltd 通電材料
JP3087341B2 (ja) 1991-05-21 2000-09-11 ミノルタ株式会社 積層型感光体
JPH05226543A (ja) * 1991-11-19 1993-09-03 Natl Semiconductor Corp <Ns> リードフレーム用保護コーティング
KR940010455B1 (ko) * 1992-09-24 1994-10-22 김영길 고강도, 우수한 전기전도도 및 열적안정성을 갖는 동(Cu)합금 및 그 제조방법
JP3104845B2 (ja) 1995-09-04 2000-10-30 株式会社小糸製作所 車両用灯具
KR0157258B1 (ko) * 1995-12-08 1998-11-16 정훈보 석출 경화형 동합금의 제조방법

Also Published As

Publication number Publication date
FR2751990A1 (fr) 1998-02-06
DE19732837A1 (de) 1998-03-05
JPH1068032A (ja) 1998-03-10
MX9705772A (es) 1998-08-30
ITTO970641A1 (it) 1999-01-15
US6149741A (en) 2000-11-21
KR100429109B1 (ko) 2004-07-12
KR980009485A (ko) 1998-04-30
DE19732837C2 (de) 2003-01-16
FR2751990B1 (fr) 1998-10-02
JP4199320B2 (ja) 2008-12-17

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