DE69009429T2 - Kühlkörper mit verbesserter Lebensdauer und thermischer Leitfähigkeit. - Google Patents
Kühlkörper mit verbesserter Lebensdauer und thermischer Leitfähigkeit.Info
- Publication number
- DE69009429T2 DE69009429T2 DE69009429T DE69009429T DE69009429T2 DE 69009429 T2 DE69009429 T2 DE 69009429T2 DE 69009429 T DE69009429 T DE 69009429T DE 69009429 T DE69009429 T DE 69009429T DE 69009429 T2 DE69009429 T2 DE 69009429T2
- Authority
- DE
- Germany
- Prior art keywords
- heatsink
- service life
- thermal conductivity
- improved service
- improved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33998189 | 1989-12-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69009429D1 DE69009429D1 (de) | 1994-07-07 |
DE69009429T2 true DE69009429T2 (de) | 1994-09-15 |
Family
ID=18332602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69009429T Expired - Fee Related DE69009429T2 (de) | 1989-12-29 | 1990-12-19 | Kühlkörper mit verbesserter Lebensdauer und thermischer Leitfähigkeit. |
Country Status (3)
Country | Link |
---|---|
US (1) | US5448107A (de) |
EP (1) | EP0435155B1 (de) |
DE (1) | DE69009429T2 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5293930A (en) * | 1992-09-24 | 1994-03-15 | Hewlett-Packard Company | Surface-to-air heat exchanger for electronic devices |
US5461766A (en) * | 1994-01-26 | 1995-10-31 | Sun Microsystems, Inc. | Method for integrally packaging an integrated circuit with a heat transfer apparatus |
US5441102A (en) * | 1994-01-26 | 1995-08-15 | Sun Microsystems, Inc. | Heat exchanger for electronic equipment |
US5637921A (en) * | 1995-04-21 | 1997-06-10 | Sun Microsystems, Inc. | Sub-ambient temperature electronic package |
US5798566A (en) * | 1996-01-11 | 1998-08-25 | Ngk Spark Plug Co., Ltd. | Ceramic IC package base and ceramic cover |
JP3517831B2 (ja) * | 1999-07-13 | 2004-04-12 | 宏巳 片岡 | ヒートシンク並びにその製造方法 |
US6706329B1 (en) * | 2002-11-21 | 2004-03-16 | Ming-Ho Chien | Local nickel plating for aluminum alloy radiator |
WO2004093187A1 (ja) * | 2003-04-16 | 2004-10-28 | Fujitsu Limited | 電子部品パッケージ、電子部品パッケージ組立体およびプリント基板ユニット |
US7443683B2 (en) * | 2004-11-19 | 2008-10-28 | Hewlett-Packard Development Company, L.P. | Cooling apparatus for electronic devices |
US7563625B2 (en) * | 2005-01-11 | 2009-07-21 | SemiLEDs Optoelectronics Co., Ltd. | Method of making light-emitting diodes (LEDs) with improved light extraction by roughening |
US7186580B2 (en) * | 2005-01-11 | 2007-03-06 | Semileds Corporation | Light emitting diodes (LEDs) with improved light extraction by roughening |
US9130114B2 (en) | 2005-01-11 | 2015-09-08 | SemiLEDs Optoelectronics Co., Ltd. | Vertical light emitting diode (VLED) dice having confinement layers with roughened surfaces and methods of fabrication |
US7524686B2 (en) * | 2005-01-11 | 2009-04-28 | Semileds Corporation | Method of making light emitting diodes (LEDs) with improved light extraction by roughening |
US7378288B2 (en) * | 2005-01-11 | 2008-05-27 | Semileds Corporation | Systems and methods for producing light emitting diode array |
US7897420B2 (en) * | 2005-01-11 | 2011-03-01 | SemiLEDs Optoelectronics Co., Ltd. | Light emitting diodes (LEDs) with improved light extraction by roughening |
US20060154393A1 (en) * | 2005-01-11 | 2006-07-13 | Doan Trung T | Systems and methods for removing operating heat from a light emitting diode |
US7473936B2 (en) * | 2005-01-11 | 2009-01-06 | Semileds Corporation | Light emitting diodes (LEDs) with improved light extraction by roughening |
JP4445524B2 (ja) * | 2007-06-26 | 2010-04-07 | 株式会社東芝 | 半導体記憶装置の製造方法 |
WO2010105221A1 (en) * | 2009-03-12 | 2010-09-16 | The Board Of Regents For Oklahoma State University | Mixing nozzle for plural component materials |
DE102010042087A1 (de) * | 2010-10-06 | 2012-04-12 | Jenoptik Laser Gmbh | Lasermodul mit einer Laserdiodeneinheit und einem Kühler |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5228547B2 (de) * | 1972-07-10 | 1977-07-27 | ||
US4227036A (en) * | 1978-09-18 | 1980-10-07 | Microwave Semiconductor Corp. | Composite flanged ceramic package for electronic devices |
FR2455785A1 (fr) * | 1979-05-02 | 1980-11-28 | Thomson Csf | Support isolateur electrique, a faible resistance thermique, et embase ou boitier pour composant de puissance, comportant un tel support |
JPS55158654A (en) * | 1979-05-30 | 1980-12-10 | Aichi Steel Works Ltd | Manufacture of heat sink in aluminum |
JPS56122149A (en) * | 1980-02-29 | 1981-09-25 | Fujitsu Ltd | Heat dissipating structure for semiconductor device |
JPS5870561A (ja) * | 1981-10-23 | 1983-04-27 | Hitachi Ltd | 半導体素子用アルミニウム製冷却片 |
JPS58147050A (ja) * | 1982-02-26 | 1983-09-01 | Hitachi Ltd | 半導体素子用アルミニウム製冷却片 |
US4546409A (en) * | 1982-04-02 | 1985-10-08 | Mitsubishi Denki Kabushiki Kaisha | Device for cooling semiconductor elements |
US4620215A (en) * | 1982-04-16 | 1986-10-28 | Amdahl Corporation | Integrated circuit packaging systems with double surface heat dissipation |
DE3477101D1 (en) * | 1983-03-25 | 1989-04-13 | Mitsubishi Electric Corp | Heat radiator assembly for cooling electronic parts |
DE3315583A1 (de) * | 1983-04-29 | 1984-10-31 | Siemens AG, 1000 Berlin und 8000 München | Ein elektrisches bauteil tragendes, gut kuehlbares schaltungsmodul |
JPS60115247A (ja) * | 1983-11-28 | 1985-06-21 | Fujitsu Ltd | 半導体装置 |
AU582139B2 (en) * | 1984-03-06 | 1989-03-16 | Furukawa Aluminum Co., Ltd. | Aluminum and aluminum alloy for fin and heat exchanger using same |
JPS62279089A (ja) * | 1986-05-29 | 1987-12-03 | Nippon Kokan Kk <Nkk> | 球状黒鉛鋳鉄の溶接方法 |
US4700273A (en) * | 1986-06-03 | 1987-10-13 | Kaufman Lance R | Circuit assembly with semiconductor expansion matched thermal path |
US4788627A (en) * | 1986-06-06 | 1988-11-29 | Tektronix, Inc. | Heat sink device using composite metal alloy |
JPS6334495A (ja) * | 1986-07-29 | 1988-02-15 | Nippon Denso Co Ltd | アルミニウム熱交換器 |
US4757934A (en) * | 1987-02-06 | 1988-07-19 | Motorola, Inc. | Low stress heat sinking for semiconductors |
JPH0231863A (ja) * | 1987-11-18 | 1990-02-01 | Nordson Kk | コーティング剤の塗布並びにその熟成方法 |
-
1990
- 1990-12-19 DE DE69009429T patent/DE69009429T2/de not_active Expired - Fee Related
- 1990-12-19 EP EP90124800A patent/EP0435155B1/de not_active Expired - Lifetime
-
1992
- 1992-09-24 US US07/950,727 patent/US5448107A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5448107A (en) | 1995-09-05 |
EP0435155B1 (de) | 1994-06-01 |
EP0435155A1 (de) | 1991-07-03 |
DE69009429D1 (de) | 1994-07-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: GROSSE, BOCKHORNI, SCHUMACHER, 81476 MUENCHEN |
|
8339 | Ceased/non-payment of the annual fee |