FR2751990B1 - Alliage a base de cuivre a conductivite electrique et a temperature d'adoucissement elevees pour des applications dans l'electronique - Google Patents

Alliage a base de cuivre a conductivite electrique et a temperature d'adoucissement elevees pour des applications dans l'electronique

Info

Publication number
FR2751990B1
FR2751990B1 FR9609575A FR9609575A FR2751990B1 FR 2751990 B1 FR2751990 B1 FR 2751990B1 FR 9609575 A FR9609575 A FR 9609575A FR 9609575 A FR9609575 A FR 9609575A FR 2751990 B1 FR2751990 B1 FR 2751990B1
Authority
FR
France
Prior art keywords
copper
electrical conductivity
based alloy
softening temperature
high electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9609575A
Other languages
English (en)
Other versions
FR2751990A1 (fr
Inventor
Texte Gerard Durant
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Griset Ets
Original Assignee
Griset Ets
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9494626&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FR2751990(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Griset Ets filed Critical Griset Ets
Priority to FR9609575A priority Critical patent/FR2751990B1/fr
Priority to IT97TO000641A priority patent/IT1293454B1/it
Priority to DE19732837A priority patent/DE19732837C2/de
Priority to KR1019970036208A priority patent/KR100429109B1/ko
Priority to MXPA/A/1997/005772A priority patent/MXPA97005772A/xx
Priority to JP20459497A priority patent/JP4199320B2/ja
Publication of FR2751990A1 publication Critical patent/FR2751990A1/fr
Publication of FR2751990B1 publication Critical patent/FR2751990B1/fr
Application granted granted Critical
Priority to US09/329,906 priority patent/US6149741A/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Non-Insulated Conductors (AREA)
FR9609575A 1996-07-30 1996-07-30 Alliage a base de cuivre a conductivite electrique et a temperature d'adoucissement elevees pour des applications dans l'electronique Expired - Fee Related FR2751990B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR9609575A FR2751990B1 (fr) 1996-07-30 1996-07-30 Alliage a base de cuivre a conductivite electrique et a temperature d'adoucissement elevees pour des applications dans l'electronique
IT97TO000641A IT1293454B1 (it) 1996-07-30 1997-07-15 Lega a base di rame a conduttivita' elettrica e a temperatura di addolcimento elevate per applicazioni nell'elettronica.
MXPA/A/1997/005772A MXPA97005772A (en) 1996-07-30 1997-07-30 Copper based alloy with electric conductivity and elevated adulted temperature for electronic applications
KR1019970036208A KR100429109B1 (ko) 1996-07-30 1997-07-30 전기적도전성이좋고연화온도가높은전자회로부품용지지대및그제조방법
DE19732837A DE19732837C2 (de) 1996-07-30 1997-07-30 Verfahren zur Herstellung von Trägern für Bauteile von Schaltungen, sowie ein nach dem Verfahren hergestellter Träger
JP20459497A JP4199320B2 (ja) 1996-07-30 1997-07-30 支持体の製造方法
US09/329,906 US6149741A (en) 1996-07-30 1999-06-10 Copper-based alloy having a high electrical conductivity and a high softening temperature for application in electronics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9609575A FR2751990B1 (fr) 1996-07-30 1996-07-30 Alliage a base de cuivre a conductivite electrique et a temperature d'adoucissement elevees pour des applications dans l'electronique

Publications (2)

Publication Number Publication Date
FR2751990A1 FR2751990A1 (fr) 1998-02-06
FR2751990B1 true FR2751990B1 (fr) 1998-10-02

Family

ID=9494626

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9609575A Expired - Fee Related FR2751990B1 (fr) 1996-07-30 1996-07-30 Alliage a base de cuivre a conductivite electrique et a temperature d'adoucissement elevees pour des applications dans l'electronique

Country Status (6)

Country Link
US (1) US6149741A (fr)
JP (1) JP4199320B2 (fr)
KR (1) KR100429109B1 (fr)
DE (1) DE19732837C2 (fr)
FR (1) FR2751990B1 (fr)
IT (1) IT1293454B1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349085A (ja) * 1999-06-01 2000-12-15 Nec Corp 半導体装置及び半導体装置の製造方法
JP3465108B2 (ja) * 2000-05-25 2003-11-10 株式会社神戸製鋼所 電気・電子部品用銅合金
FR2880358B1 (fr) * 2005-01-06 2007-12-28 Trefimetaux Alliages de cuivre et produits lamines correspondants pour applications electroniques
EP2339038B8 (fr) 2006-07-21 2017-01-11 Kabushiki Kaisha Kobe Seiko Sho Feuille d'alliage de cuivre pour pièce électrique et électronique
US20140048587A1 (en) * 2012-02-07 2014-02-20 Paul Rivest Brazing alloy and processes for making and using

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2375285A (en) * 1943-01-22 1945-05-08 Chase Brass & Copper Co Spring
SU490855A1 (ru) * 1974-04-04 1975-11-05 Предприятие П/Я В-2836 Сплав на основе меди
JPS5815528B2 (ja) * 1975-07-04 1983-03-26 株式会社東芝 セキシユツコウカガタドウゴウキン
KR840001426B1 (ko) * 1982-10-20 1984-09-26 이영세 전기전자 부품용 동합금 및 동합금판의 제조방법
JPH0674463B2 (ja) * 1983-01-29 1994-09-21 古河電気工業株式会社 リ−ドフレ−ム用銅合金
JPS60114546A (ja) * 1983-11-24 1985-06-21 Mitsubishi Electric Corp 電子機器材料用銅合金
GB2158095B (en) * 1984-04-26 1988-04-20 Poong San Metal Corp Copper alloys for integrated circuit leads
JPS62120450A (ja) * 1985-11-19 1987-06-01 Nakasato Kk 電気・電子機器用電気機械的接続ばね材料の製造法
JPS62278243A (ja) * 1986-05-27 1987-12-03 Dowa Mining Co Ltd リ−ドフレ−ム材用銅合金およびその製造法
DE3620655A1 (de) * 1986-06-20 1987-12-23 Kabel Metallwerke Ghh Verwendung einer kupferlegierung
ES2011467B3 (es) * 1986-06-20 1990-01-16 Km-Kabelmetal Ag Empleo de una aleacion de cobre
JPH0387341A (ja) * 1989-08-30 1991-04-12 Nippon Mining Co Ltd 曲げ加工性の良好な高強度りん青銅の製造方法
JPH03104845A (ja) * 1989-09-18 1991-05-01 Nippon Mining Co Ltd 曲げ加工性の良好な高強度りん青銅の製造方法
JP2871801B2 (ja) * 1990-04-13 1999-03-17 古河電気工業株式会社 析出硬化型銅合金の溶体化処理方法
JPH04165055A (ja) * 1990-10-29 1992-06-10 Hitachi Cable Ltd 半導体装置用リードフレーム材
JPH04311544A (ja) * 1991-04-08 1992-11-04 Nikko Kyodo Co Ltd 通電材料
JP3087341B2 (ja) 1991-05-21 2000-09-11 ミノルタ株式会社 積層型感光体
JPH05226543A (ja) * 1991-11-19 1993-09-03 Natl Semiconductor Corp <Ns> リードフレーム用保護コーティング
KR940010455B1 (ko) * 1992-09-24 1994-10-22 김영길 고강도, 우수한 전기전도도 및 열적안정성을 갖는 동(Cu)합금 및 그 제조방법
JP3104845B2 (ja) 1995-09-04 2000-10-30 株式会社小糸製作所 車両用灯具
KR0157258B1 (ko) * 1995-12-08 1998-11-16 정훈보 석출 경화형 동합금의 제조방법

Also Published As

Publication number Publication date
JPH1068032A (ja) 1998-03-10
US6149741A (en) 2000-11-21
FR2751990A1 (fr) 1998-02-06
JP4199320B2 (ja) 2008-12-17
KR980009485A (ko) 1998-04-30
MX9705772A (es) 1998-08-30
DE19732837A1 (de) 1998-03-05
DE19732837C2 (de) 2003-01-16
ITTO970641A1 (it) 1999-01-15
IT1293454B1 (it) 1999-03-01
KR100429109B1 (ko) 2004-07-12

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20070330