MX9705772A - Aleacion rasada en cobre con conductividad electrica y con temperatura de adulzado elevadas para aplicaciones en electronica. - Google Patents
Aleacion rasada en cobre con conductividad electrica y con temperatura de adulzado elevadas para aplicaciones en electronica.Info
- Publication number
- MX9705772A MX9705772A MX9705772A MX9705772A MX9705772A MX 9705772 A MX9705772 A MX 9705772A MX 9705772 A MX9705772 A MX 9705772A MX 9705772 A MX9705772 A MX 9705772A MX 9705772 A MX9705772 A MX 9705772A
- Authority
- MX
- Mexico
- Prior art keywords
- electronics
- applications
- electric conductivity
- softening temperature
- copper based
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Se presenta el uso para la fabricacion de soportes de componentes de circuitos electronicos destinados para ser soldados con aleacion ligera, pegados y/o insertados en caliente sobre el soporte de una aleacion basada en cobre que contiene un porcentaje en masa de 0.1 a 1% de níquel y de 0.005% a 0.1% de fosforo, el resto siendo cobre o bien principalmente cobre.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9609575 | 1996-07-30 | ||
| FR9609575A FR2751990B1 (fr) | 1996-07-30 | 1996-07-30 | Alliage a base de cuivre a conductivite electrique et a temperature d'adoucissement elevees pour des applications dans l'electronique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MX9705772A true MX9705772A (es) | 1998-08-30 |
| MXPA97005772A MXPA97005772A (es) | 1998-11-12 |
Family
ID=
Also Published As
| Publication number | Publication date |
|---|---|
| JP4199320B2 (ja) | 2008-12-17 |
| DE19732837C2 (de) | 2003-01-16 |
| IT1293454B1 (it) | 1999-03-01 |
| KR980009485A (ko) | 1998-04-30 |
| FR2751990A1 (fr) | 1998-02-06 |
| JPH1068032A (ja) | 1998-03-10 |
| ITTO970641A1 (it) | 1999-01-15 |
| KR100429109B1 (ko) | 2004-07-12 |
| US6149741A (en) | 2000-11-21 |
| DE19732837A1 (de) | 1998-03-05 |
| FR2751990B1 (fr) | 1998-10-02 |
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