IT1250024B - Rete di resistori a base di materiale ceramico, atta ad essere fissatasu una superficie, e procedimento per la connessione elettrica di talerete ad un substrato conduttore. - Google Patents
Rete di resistori a base di materiale ceramico, atta ad essere fissatasu una superficie, e procedimento per la connessione elettrica di talerete ad un substrato conduttore.Info
- Publication number
- IT1250024B IT1250024B ITTO910811A ITTO910811A IT1250024B IT 1250024 B IT1250024 B IT 1250024B IT TO910811 A ITTO910811 A IT TO910811A IT TO910811 A ITTO910811 A IT TO910811A IT 1250024 B IT1250024 B IT 1250024B
- Authority
- IT
- Italy
- Prior art keywords
- network
- substrate
- talerete
- procedure
- fixing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
- H01C13/02—Structural combinations of resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10045—Mounted network component having plural terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10454—Vertically mounted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10696—Single-in-line [SIL] package
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
E' descritta una rete di resistori che è adatta ad essere montata su una superficie e che non incorpora cavi terminali. La rete è fabbricata interamente a partireda materiali metallo-ceramici (cermet), ceramici e saldature e ciononostante assorbe le sollecitazioni termiche normalmente associate all'attivazione dei circuiti quando correttamente montati su un substrato. Ciò è realizzato controllando la formatura di protuberanze di saldatura e simultaneamente la distanza di montaggio fra tali protuberanze ed un substrato di cablaggio sul quale la rete è montata. In aggiunta, la rete può essere realizzata in modo da avere una configurazione SIP o DIP, a seconda che si incorpori una scanalatura aggiuntiva nel lato terminale del substrato. Sono anche illustrate due forme di attuazione alternative che incorporano varie caratteristiche dell'invenzione.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US60391290A | 1990-10-25 | 1990-10-25 |
Publications (3)
Publication Number | Publication Date |
---|---|
ITTO910811A0 ITTO910811A0 (it) | 1991-10-25 |
ITTO910811A1 ITTO910811A1 (it) | 1993-04-25 |
IT1250024B true IT1250024B (it) | 1995-03-30 |
Family
ID=24417423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITTO910811A IT1250024B (it) | 1990-10-25 | 1991-10-25 | Rete di resistori a base di materiale ceramico, atta ad essere fissatasu una superficie, e procedimento per la connessione elettrica di talerete ad un substrato conduttore. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5621619A (it) |
JP (1) | JP3342706B2 (it) |
DE (1) | DE4135007C2 (it) |
FR (1) | FR2673063B1 (it) |
GB (1) | GB2249746B (it) |
IT (1) | IT1250024B (it) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
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DE4135007C2 (de) * | 1990-10-25 | 1994-12-22 | Cts Corp | SMD-Bauelemente mit Maßnahmen gegen Lötbrückenbildung und Temperaturwechselbeanspruchung |
FR2734983B1 (fr) | 1995-05-29 | 1997-07-04 | Sgs Thomson Microelectronics | Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant |
JPH09237962A (ja) * | 1995-12-28 | 1997-09-09 | Sanyo Electric Co Ltd | 電子回路装置 |
DE19639947A1 (de) * | 1996-09-27 | 1998-04-16 | Siemens Matsushita Components | Passives Netzwerk in Chip-Bauform |
US6495195B2 (en) | 1997-02-14 | 2002-12-17 | Arcturus Engineering, Inc. | Broadband absorbing film for laser capture microdissection |
US7075640B2 (en) * | 1997-10-01 | 2006-07-11 | Arcturus Bioscience, Inc. | Consumable for laser capture microdissection |
WO1999051071A1 (de) * | 1998-03-31 | 1999-10-07 | Tyco Electronics Logistics Ag | Smd-fähige hybridschaltung |
US6047463A (en) * | 1998-06-12 | 2000-04-11 | Intermedics Inc. | Embedded trimmable resistors |
DE29813725U1 (de) | 1998-07-31 | 1998-10-01 | Siemens AG, 80333 München | An Kontaktflächen eines Schaltungssubstrats verlötbares, aus Blech geformtes elektrisches Bauelement mit Lötstop |
US6326677B1 (en) | 1998-09-04 | 2001-12-04 | Cts Corporation | Ball grid array resistor network |
US6097277A (en) * | 1998-11-05 | 2000-08-01 | Cts | Resistor network with solder sphere connector |
US6005777A (en) * | 1998-11-10 | 1999-12-21 | Cts Corporation | Ball grid array capacitor |
JP3714088B2 (ja) * | 1999-02-18 | 2005-11-09 | 株式会社村田製作所 | 電子部品及びその製造方法 |
US6246016B1 (en) * | 1999-03-11 | 2001-06-12 | Lucent Technologies, Inc. | Edge-mountable integrated circuit package and method of attaching the same to a printed wiring board |
US6194979B1 (en) | 1999-03-18 | 2001-02-27 | Cts Corporation | Ball grid array R-C network with high density |
JP2001237585A (ja) * | 2000-02-22 | 2001-08-31 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
US6246312B1 (en) | 2000-07-20 | 2001-06-12 | Cts Corporation | Ball grid array resistor terminator network |
DE10145348C1 (de) * | 2001-09-14 | 2003-03-27 | Siemens Dematic Ag | Zwischenträger für elektronische Bauelemente und Verfahren zur Lötkontaktierung eines derartigen Zwischenträgers |
US20040084211A1 (en) * | 2002-10-30 | 2004-05-06 | Sensonix, Inc. | Z-axis packaging for electronic device and method for making same |
US7180186B2 (en) * | 2003-07-31 | 2007-02-20 | Cts Corporation | Ball grid array package |
US6946733B2 (en) * | 2003-08-13 | 2005-09-20 | Cts Corporation | Ball grid array package having testing capability after mounting |
FR2916299A1 (fr) * | 2007-05-14 | 2008-11-21 | Eurofarad | Composant electronique multicouches avec canal de lavage et gorges |
JP2011228644A (ja) * | 2010-03-29 | 2011-11-10 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
USD680119S1 (en) * | 2011-11-15 | 2013-04-16 | Connectblue Ab | Module |
USD668659S1 (en) * | 2011-11-15 | 2012-10-09 | Connectblue Ab | Module |
USD689053S1 (en) * | 2011-11-15 | 2013-09-03 | Connectblue Ab | Module |
USD680545S1 (en) * | 2011-11-15 | 2013-04-23 | Connectblue Ab | Module |
USD692896S1 (en) * | 2011-11-15 | 2013-11-05 | Connectblue Ab | Module |
USD668658S1 (en) * | 2011-11-15 | 2012-10-09 | Connectblue Ab | Module |
JP6956552B2 (ja) * | 2017-07-19 | 2021-11-02 | 株式会社小糸製作所 | 車載用電子回路実装基板 |
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US3280378A (en) * | 1964-07-01 | 1966-10-18 | Cts Corp | Means for anchoring and connecting lead wires in an electrical component |
US3346774A (en) * | 1965-07-30 | 1967-10-10 | Cts Corp | Electrical component substrate with cavities for anchoring lead wires therein |
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US3492536A (en) * | 1968-01-18 | 1970-01-27 | Cts Corp | Means for anchoring and connecting lead wires to an electrical component |
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JPS5921047A (ja) * | 1982-07-27 | 1984-02-02 | Fuji Xerox Co Ltd | リ−ドレスチツプキヤリア |
JPS5945985A (ja) * | 1982-09-08 | 1984-03-15 | 矢沢フエロマイト株式会社 | 遮音材 |
US4641222A (en) * | 1984-05-29 | 1987-02-03 | Motorola, Inc. | Mounting system for stress relief in surface mounted components |
JPS61145838A (ja) * | 1984-12-20 | 1986-07-03 | Fujitsu Ltd | 半導体素子の接続方法 |
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US4878611A (en) * | 1986-05-30 | 1989-11-07 | American Telephone And Telegraph Company, At&T Bell Laboratories | Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate |
DE3722725A1 (de) * | 1987-07-09 | 1989-01-19 | Productech Gmbh | Geheizter stempel |
US4975763A (en) * | 1988-03-14 | 1990-12-04 | Texas Instruments Incorporated | Edge-mounted, surface-mount package for semiconductor integrated circuit devices |
JPH0230169A (ja) * | 1988-07-19 | 1990-01-31 | Fujitsu Ltd | 半導体装置 |
US5025306A (en) * | 1988-08-09 | 1991-06-18 | Texas Instruments Incorporated | Assembly of semiconductor chips |
JPH02177464A (ja) * | 1988-12-28 | 1990-07-10 | Nec Corp | 半導体装置 |
US5200362A (en) * | 1989-09-06 | 1993-04-06 | Motorola, Inc. | Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film |
US5142268A (en) * | 1990-02-07 | 1992-08-25 | Cts Corporation | Elimination of discrete capacitors in R/C networks |
DE4135007C2 (de) * | 1990-10-25 | 1994-12-22 | Cts Corp | SMD-Bauelemente mit Maßnahmen gegen Lötbrückenbildung und Temperaturwechselbeanspruchung |
JPH05243020A (ja) * | 1992-03-02 | 1993-09-21 | Rohm Co Ltd | チップネットワーク型抵抗器 |
US5592022A (en) * | 1992-05-27 | 1997-01-07 | Chipscale, Inc. | Fabricating a semiconductor with an insulative coating |
JPH1152637A (ja) * | 1997-08-04 | 1999-02-26 | Canon Inc | 画像形成装置 |
-
1991
- 1991-10-23 DE DE4135007A patent/DE4135007C2/de not_active Expired - Fee Related
- 1991-10-25 JP JP27998091A patent/JP3342706B2/ja not_active Expired - Fee Related
- 1991-10-25 IT ITTO910811A patent/IT1250024B/it active IP Right Grant
- 1991-10-25 FR FR9113187A patent/FR2673063B1/fr not_active Expired - Fee Related
- 1991-10-25 GB GB9122659A patent/GB2249746B/en not_active Expired - Fee Related
-
1995
- 1995-05-19 US US08/445,237 patent/US5621619A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2673063A1 (fr) | 1992-08-21 |
DE4135007C2 (de) | 1994-12-22 |
FR2673063B1 (fr) | 1994-11-04 |
JP3342706B2 (ja) | 2002-11-11 |
GB2249746A (en) | 1992-05-20 |
ITTO910811A1 (it) | 1993-04-25 |
JPH04264701A (ja) | 1992-09-21 |
US5621619A (en) | 1997-04-15 |
GB2249746B (en) | 1994-04-13 |
DE4135007A1 (de) | 1992-05-14 |
ITTO910811A0 (it) | 1991-10-25 |
GB9122659D0 (en) | 1991-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted | ||
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19971029 |