ITTO910811A1 - Rete di resistori a base di materiale ceramico, atta ad essere fissata su una superficie, e procedimento per la connessione elettrica di tale rete ad un substrato conduttore. - Google Patents

Rete di resistori a base di materiale ceramico, atta ad essere fissata su una superficie, e procedimento per la connessione elettrica di tale rete ad un substrato conduttore.

Info

Publication number
ITTO910811A1
ITTO910811A1 IT000811A ITTO910811A ITTO910811A1 IT TO910811 A1 ITTO910811 A1 IT TO910811A1 IT 000811 A IT000811 A IT 000811A IT TO910811 A ITTO910811 A IT TO910811A IT TO910811 A1 ITTO910811 A1 IT TO910811A1
Authority
IT
Italy
Prior art keywords
network
procedure
fixing
electrical connection
ceramic material
Prior art date
Application number
IT000811A
Other languages
English (en)
Inventor
Lewis L Seffernick
Neal F Thomas
Original Assignee
Cts Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cts Corp filed Critical Cts Corp
Publication of ITTO910811A0 publication Critical patent/ITTO910811A0/it
Publication of ITTO910811A1 publication Critical patent/ITTO910811A1/it
Application granted granted Critical
Publication of IT1250024B publication Critical patent/IT1250024B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere
    • H01C13/02—Structural combinations of resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10045—Mounted network component having plural terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10454—Vertically mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10696—Single-in-line [SIL] package
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Details Of Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
ITTO910811A 1990-10-25 1991-10-25 Rete di resistori a base di materiale ceramico, atta ad essere fissatasu una superficie, e procedimento per la connessione elettrica di talerete ad un substrato conduttore. IT1250024B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US60391290A 1990-10-25 1990-10-25

Publications (3)

Publication Number Publication Date
ITTO910811A0 ITTO910811A0 (it) 1991-10-25
ITTO910811A1 true ITTO910811A1 (it) 1993-04-25
IT1250024B IT1250024B (it) 1995-03-30

Family

ID=24417423

Family Applications (1)

Application Number Title Priority Date Filing Date
ITTO910811A IT1250024B (it) 1990-10-25 1991-10-25 Rete di resistori a base di materiale ceramico, atta ad essere fissatasu una superficie, e procedimento per la connessione elettrica di talerete ad un substrato conduttore.

Country Status (6)

Country Link
US (1) US5621619A (it)
JP (1) JP3342706B2 (it)
DE (1) DE4135007C2 (it)
FR (1) FR2673063B1 (it)
GB (1) GB2249746B (it)
IT (1) IT1250024B (it)

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DE4135007C2 (de) * 1990-10-25 1994-12-22 Cts Corp SMD-Bauelemente mit Maßnahmen gegen Lötbrückenbildung und Temperaturwechselbeanspruchung
FR2734983B1 (fr) 1995-05-29 1997-07-04 Sgs Thomson Microelectronics Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant
JPH09237962A (ja) * 1995-12-28 1997-09-09 Sanyo Electric Co Ltd 電子回路装置
DE19639947A1 (de) * 1996-09-27 1998-04-16 Siemens Matsushita Components Passives Netzwerk in Chip-Bauform
US6495195B2 (en) * 1997-02-14 2002-12-17 Arcturus Engineering, Inc. Broadband absorbing film for laser capture microdissection
US7075640B2 (en) * 1997-10-01 2006-07-11 Arcturus Bioscience, Inc. Consumable for laser capture microdissection
WO1999051071A1 (de) * 1998-03-31 1999-10-07 Tyco Electronics Logistics Ag Smd-fähige hybridschaltung
US6047463A (en) 1998-06-12 2000-04-11 Intermedics Inc. Embedded trimmable resistors
US6326677B1 (en) 1998-09-04 2001-12-04 Cts Corporation Ball grid array resistor network
US6097277A (en) * 1998-11-05 2000-08-01 Cts Resistor network with solder sphere connector
US6005777A (en) * 1998-11-10 1999-12-21 Cts Corporation Ball grid array capacitor
JP3714088B2 (ja) * 1999-02-18 2005-11-09 株式会社村田製作所 電子部品及びその製造方法
US6246016B1 (en) * 1999-03-11 2001-06-12 Lucent Technologies, Inc. Edge-mountable integrated circuit package and method of attaching the same to a printed wiring board
US6194979B1 (en) 1999-03-18 2001-02-27 Cts Corporation Ball grid array R-C network with high density
JP2001237585A (ja) * 2000-02-22 2001-08-31 Murata Mfg Co Ltd 電子部品及びその製造方法
US6246312B1 (en) 2000-07-20 2001-06-12 Cts Corporation Ball grid array resistor terminator network
DE10145348C1 (de) * 2001-09-14 2003-03-27 Siemens Dematic Ag Zwischenträger für elektronische Bauelemente und Verfahren zur Lötkontaktierung eines derartigen Zwischenträgers
US20040084211A1 (en) * 2002-10-30 2004-05-06 Sensonix, Inc. Z-axis packaging for electronic device and method for making same
US7180186B2 (en) * 2003-07-31 2007-02-20 Cts Corporation Ball grid array package
US6946733B2 (en) * 2003-08-13 2005-09-20 Cts Corporation Ball grid array package having testing capability after mounting
FR2916299A1 (fr) * 2007-05-14 2008-11-21 Eurofarad Composant electronique multicouches avec canal de lavage et gorges
JP2011228644A (ja) * 2010-03-29 2011-11-10 Murata Mfg Co Ltd 電子部品及びその製造方法
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
JP6956552B2 (ja) * 2017-07-19 2021-11-02 株式会社小糸製作所 車載用電子回路実装基板

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US3280378A (en) * 1964-07-01 1966-10-18 Cts Corp Means for anchoring and connecting lead wires in an electrical component
US3346774A (en) * 1965-07-30 1967-10-10 Cts Corp Electrical component substrate with cavities for anchoring lead wires therein
US3444436A (en) * 1967-04-26 1969-05-13 Erie Technological Prod Inc Mounted capacitor with spaced terminal feet
US3492536A (en) * 1968-01-18 1970-01-27 Cts Corp Means for anchoring and connecting lead wires to an electrical component
US3483308A (en) * 1968-10-24 1969-12-09 Texas Instruments Inc Modular packages for semiconductor devices
US3621112A (en) * 1970-10-28 1971-11-16 Gen Electric Housing for electrical components
FR2137167B1 (it) * 1971-05-14 1973-05-11 Socapex
US3873890A (en) * 1973-08-20 1975-03-25 Allen Bradley Co Terminal construction for electrical circuit device
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US3902189A (en) * 1974-04-10 1975-08-26 Hunt Electronics Prefabricated article and methods of maintaining the orientation of parts being bonded thereto
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US4465898A (en) * 1981-07-27 1984-08-14 Texas Instruments Incorporated Carrier for integrated circuit
US4419714A (en) * 1982-04-02 1983-12-06 International Business Machines Corporation Low inductance ceramic capacitor and method for its making
JPS5921047A (ja) * 1982-07-27 1984-02-02 Fuji Xerox Co Ltd リ−ドレスチツプキヤリア
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US4641222A (en) * 1984-05-29 1987-02-03 Motorola, Inc. Mounting system for stress relief in surface mounted components
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JPH0230169A (ja) * 1988-07-19 1990-01-31 Fujitsu Ltd 半導体装置
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US5142268A (en) * 1990-02-07 1992-08-25 Cts Corporation Elimination of discrete capacitors in R/C networks
DE4135007C2 (de) * 1990-10-25 1994-12-22 Cts Corp SMD-Bauelemente mit Maßnahmen gegen Lötbrückenbildung und Temperaturwechselbeanspruchung
JPH05243020A (ja) * 1992-03-02 1993-09-21 Rohm Co Ltd チップネットワーク型抵抗器
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Also Published As

Publication number Publication date
IT1250024B (it) 1995-03-30
GB9122659D0 (en) 1991-12-11
ITTO910811A0 (it) 1991-10-25
GB2249746B (en) 1994-04-13
FR2673063A1 (fr) 1992-08-21
JP3342706B2 (ja) 2002-11-11
DE4135007C2 (de) 1994-12-22
JPH04264701A (ja) 1992-09-21
US5621619A (en) 1997-04-15
DE4135007A1 (de) 1992-05-14
GB2249746A (en) 1992-05-20
FR2673063B1 (fr) 1994-11-04

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19971029