IT1147903B - Perfezionamento nei dispositivi a semiconduttore con involucri o incapsulamenti senza placcatura - Google Patents
Perfezionamento nei dispositivi a semiconduttore con involucri o incapsulamenti senza placcaturaInfo
- Publication number
- IT1147903B IT1147903B IT48005/82A IT4800582A IT1147903B IT 1147903 B IT1147903 B IT 1147903B IT 48005/82 A IT48005/82 A IT 48005/82A IT 4800582 A IT4800582 A IT 4800582A IT 1147903 B IT1147903 B IT 1147903B
- Authority
- IT
- Italy
- Prior art keywords
- die
- package
- electrical contact
- copper alloy
- metallization
- Prior art date
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2924/20759—Diameter ranges larger or equal to 90 microns less than 100 microns
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- H01L2924/207—Diameter ranges
- H01L2924/2076—Diameter ranges equal to or larger than 100 microns
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US24678481A | 1981-03-23 | 1981-03-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8248005A0 IT8248005A0 (it) | 1982-03-16 |
IT1147903B true IT1147903B (it) | 1986-11-26 |
Family
ID=22932185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT48005/82A IT1147903B (it) | 1981-03-23 | 1982-03-16 | Perfezionamento nei dispositivi a semiconduttore con involucri o incapsulamenti senza placcatura |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0074378A4 (fr) |
JP (1) | JPS58500463A (fr) |
KR (1) | KR900001223B1 (fr) |
IT (1) | IT1147903B (fr) |
WO (1) | WO1982003294A1 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3401404A1 (de) * | 1984-01-17 | 1985-07-25 | Robert Bosch Gmbh, 7000 Stuttgart | Halbleiterbauelement |
GB2174063B (en) * | 1985-04-22 | 1988-08-17 | Philips Electronic Associated | Semiconductor device having a laser printable envelope |
JPS63253653A (ja) * | 1987-04-10 | 1988-10-20 | Citizen Watch Co Ltd | 樹脂封止型ピングリツドアレイ及びその製造方法 |
IT1252624B (it) * | 1991-12-05 | 1995-06-19 | Cons Ric Microelettronica | Dispositivo semiconduttore incapsulato in resina e elettricamente isolato di migliorate caratteristiche di isolamento,e relativo processo di fabbricazione |
JPH088446A (ja) * | 1995-05-25 | 1996-01-12 | Rohm Co Ltd | 個別ダイオード装置 |
US6821821B2 (en) * | 1996-04-18 | 2004-11-23 | Tessera, Inc. | Methods for manufacturing resistors using a sacrificial layer |
US6020636A (en) * | 1997-10-24 | 2000-02-01 | Eni Technologies, Inc. | Kilowatt power transistor |
US7696611B2 (en) * | 2004-01-13 | 2010-04-13 | Halliburton Energy Services, Inc. | Conductive material compositions, apparatus, systems, and methods |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2984774A (en) * | 1956-10-01 | 1961-05-16 | Motorola Inc | Transistor heat sink assembly |
US3434018A (en) * | 1966-07-05 | 1969-03-18 | Motorola Inc | Heat conductive mounting base for a semiconductor device |
US3597666A (en) * | 1969-11-26 | 1971-08-03 | Fairchild Camera Instr Co | Lead frame design |
US3763403A (en) * | 1972-03-01 | 1973-10-02 | Gen Electric | Isolated heat-sink semiconductor device |
JPS5120323B2 (fr) * | 1972-08-08 | 1976-06-24 | ||
US3821615A (en) * | 1973-05-16 | 1974-06-28 | Solitron Devices | Long life lead frame means for semiconductor devices |
US3922712A (en) * | 1974-05-01 | 1975-11-25 | Gen Motors Corp | Plastic power semiconductor flip chip package |
JPS5315763A (en) * | 1976-07-28 | 1978-02-14 | Hitachi Ltd | Resin sealed type semiconductor device |
IN148328B (fr) * | 1977-04-18 | 1981-01-17 | Rca Corp | |
IT7821073V0 (it) * | 1978-03-09 | 1978-03-09 | Ates Componenti Elettron | Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore. |
JPS5516425A (en) * | 1978-07-21 | 1980-02-05 | Toshiba Corp | Semiconductor device |
JPS55127027A (en) * | 1979-03-26 | 1980-10-01 | Toshiba Corp | Semiconductor device |
-
1982
- 1982-02-05 JP JP57500908A patent/JPS58500463A/ja active Granted
- 1982-02-05 EP EP19820900878 patent/EP0074378A4/fr not_active Withdrawn
- 1982-02-05 WO PCT/US1982/000154 patent/WO1982003294A1/fr not_active Application Discontinuation
- 1982-03-11 KR KR8201045A patent/KR900001223B1/ko active
- 1982-03-16 IT IT48005/82A patent/IT1147903B/it active
Also Published As
Publication number | Publication date |
---|---|
EP0074378A4 (fr) | 1985-04-25 |
WO1982003294A1 (fr) | 1982-09-30 |
JPH0412028B2 (fr) | 1992-03-03 |
JPS58500463A (ja) | 1983-03-24 |
KR830009650A (ko) | 1983-12-22 |
EP0074378A1 (fr) | 1983-03-23 |
KR900001223B1 (ko) | 1990-03-05 |
IT8248005A0 (it) | 1982-03-16 |
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