IT1139726B - Elemento di supporto per moduli a circuito integrato (ic) a forma compatta della grandezza del modulo - Google Patents

Elemento di supporto per moduli a circuito integrato (ic) a forma compatta della grandezza del modulo

Info

Publication number
IT1139726B
IT1139726B IT25059/81A IT2505981A IT1139726B IT 1139726 B IT1139726 B IT 1139726B IT 25059/81 A IT25059/81 A IT 25059/81A IT 2505981 A IT2505981 A IT 2505981A IT 1139726 B IT1139726 B IT 1139726B
Authority
IT
Italy
Prior art keywords
integrated circuit
support element
circuit modules
compact shape
module size
Prior art date
Application number
IT25059/81A
Other languages
English (en)
Other versions
IT8125059A0 (it
Inventor
Joachim Hoppe
Haghiri-Tehrani Yahya
Original Assignee
Gao Ges Automation Org
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19803046192 external-priority patent/DE3046192A1/de
Application filed by Gao Ges Automation Org filed Critical Gao Ges Automation Org
Publication of IT8125059A0 publication Critical patent/IT8125059A0/it
Application granted granted Critical
Publication of IT1139726B publication Critical patent/IT1139726B/it

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743External electrical contacts
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
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    • H01ELECTRIC ELEMENTS
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/48228Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4824Connecting between the body and an opposite side of the item with respect to the body
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    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
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    • H01L2224/818Bonding techniques
    • H01L2224/81801Soldering or alloying
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    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
IT25059/81A 1980-11-21 1981-11-13 Elemento di supporto per moduli a circuito integrato (ic) a forma compatta della grandezza del modulo IT1139726B (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3043877 1980-11-21
DE19803046192 DE3046192A1 (de) 1980-12-08 1980-12-08 Traegerelement fuer ic-bausteine

Publications (2)

Publication Number Publication Date
IT8125059A0 IT8125059A0 (it) 1981-11-13
IT1139726B true IT1139726B (it) 1986-09-24

Family

ID=25789226

Family Applications (1)

Application Number Title Priority Date Filing Date
IT25059/81A IT1139726B (it) 1980-11-21 1981-11-13 Elemento di supporto per moduli a circuito integrato (ic) a forma compatta della grandezza del modulo

Country Status (7)

Country Link
US (1) US4549247A (it)
CH (1) CH661816A5 (it)
FR (1) FR2494908B1 (it)
GB (1) GB2088630B (it)
IT (1) IT1139726B (it)
NL (1) NL189937C (it)
SE (1) SE457677B (it)

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DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
FR2565408B1 (fr) * 1984-05-30 1987-04-10 Thomson Csf Dispositif comportant une pastille de circuit integre surmontee d'une dalle isolante servant de boitier
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
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US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
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US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
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USD759022S1 (en) 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
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NL189937B (nl) 1993-04-01
SE8106889L (sv) 1982-05-22
CH661816A5 (de) 1987-08-14
GB2088630B (en) 1985-02-13
FR2494908A1 (fr) 1982-05-28
US4549247A (en) 1985-10-22
NL189937C (nl) 1993-09-01
NL8105002A (nl) 1982-06-16
IT8125059A0 (it) 1981-11-13
FR2494908B1 (fr) 1986-12-26
SE457677B (sv) 1989-01-16
GB2088630A (en) 1982-06-09

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