NL189937C - Inrichting met geintegreerde schakelingscomponent. - Google Patents
Inrichting met geintegreerde schakelingscomponent.Info
- Publication number
- NL189937C NL189937C NLAANVRAGE8105002,A NL8105002A NL189937C NL 189937 C NL189937 C NL 189937C NL 8105002 A NL8105002 A NL 8105002A NL 189937 C NL189937 C NL 189937C
- Authority
- NL
- Netherlands
- Prior art keywords
- switching component
- integrated switching
- integrated
- component
- switching
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2924/01057—Lanthanum [La]
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- H01L2924/01074—Tungsten [W]
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- H01L2924/01079—Gold [Au]
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- H01L2924/01082—Lead [Pb]
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- H01L2924/013—Alloys
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3043877 | 1980-11-21 | ||
DE3043877 | 1980-11-21 | ||
DE19803046192 DE3046192A1 (de) | 1980-12-08 | 1980-12-08 | Traegerelement fuer ic-bausteine |
DE3046192 | 1980-12-08 |
Publications (3)
Publication Number | Publication Date |
---|---|
NL8105002A NL8105002A (nl) | 1982-06-16 |
NL189937B NL189937B (nl) | 1993-04-01 |
NL189937C true NL189937C (nl) | 1993-09-01 |
Family
ID=25789226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NLAANVRAGE8105002,A NL189937C (nl) | 1980-11-21 | 1981-11-05 | Inrichting met geintegreerde schakelingscomponent. |
Country Status (7)
Country | Link |
---|---|
US (1) | US4549247A (nl) |
CH (1) | CH661816A5 (nl) |
FR (1) | FR2494908B1 (nl) |
GB (1) | GB2088630B (nl) |
IT (1) | IT1139726B (nl) |
NL (1) | NL189937C (nl) |
SE (1) | SE457677B (nl) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3123198C2 (de) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
FR2527036A1 (fr) * | 1982-05-14 | 1983-11-18 | Radiotechnique Compelec | Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative |
DE3248385A1 (de) * | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit integriertem schaltkreis |
FR2565408B1 (fr) * | 1984-05-30 | 1987-04-10 | Thomson Csf | Dispositif comportant une pastille de circuit integre surmontee d'une dalle isolante servant de boitier |
FR2584235B1 (fr) * | 1985-06-26 | 1988-04-22 | Bull Sa | Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques |
US5203078A (en) * | 1985-07-17 | 1993-04-20 | Ibiden Co., Ltd. | Printed wiring board for IC cards |
US4713730A (en) * | 1985-10-07 | 1987-12-15 | Rockwell International Corporation | Microwave plug-in signal amplifying module solderment apparatus |
IL80683A0 (en) * | 1985-12-20 | 1987-02-27 | Hughes Aircraft Co | Chip interface mesa |
US4870476A (en) * | 1986-02-13 | 1989-09-26 | Vtc Incorporated | Integrated circuit packaging process and structure |
FR2617666B1 (fr) * | 1987-07-02 | 1989-10-27 | Bull Cp8 | Carte a microcircuits electroniques et son procede de fabrication |
FR2620586A1 (fr) * | 1987-09-14 | 1989-03-17 | Em Microelectronic Marin Sa | Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits |
FR2625067A1 (fr) * | 1987-12-22 | 1989-06-23 | Sgs Thomson Microelectronics | Procede pour fixer sur un support un composant electronique et ses contacts |
US4937656A (en) * | 1988-04-22 | 1990-06-26 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
EP0339763A3 (en) * | 1988-04-28 | 1990-04-25 | Citizen Watch Co. Ltd. | Ic card |
USRE35385E (en) * | 1988-12-12 | 1996-12-03 | Sgs-Thomson Microelectronics, Sa. | Method for fixing an electronic component and its contacts to a support |
USRE35578E (en) * | 1988-12-12 | 1997-08-12 | Sgs-Thomson Microelectronics, Inc. | Method to install an electronic component and its electrical connections on a support, and product obtained thereby |
FR2645680B1 (fr) * | 1989-04-07 | 1994-04-29 | Thomson Microelectronics Sa Sg | Encapsulation de modules electroniques et procede de fabrication |
US20010030370A1 (en) * | 1990-09-24 | 2001-10-18 | Khandros Igor Y. | Microelectronic assembly having encapsulated wire bonding leads |
US5148265A (en) | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies with fan-in leads |
US7198969B1 (en) | 1990-09-24 | 2007-04-03 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
KR930024126A (ko) * | 1992-05-12 | 1993-12-22 | 아키라 기타하라 | 표면실장소자와 그의 반제품 |
US5255430A (en) * | 1992-10-08 | 1993-10-26 | Atmel Corporation | Method of assembling a module for a smart card |
DE19532755C1 (de) * | 1995-09-05 | 1997-02-20 | Siemens Ag | Chipmodul, insbesondere für den Einbau in Chipkarten, und Verfahren zur Herstellung eines derartigen Chipmoduls |
DE19535775C2 (de) * | 1995-09-26 | 2000-06-21 | Siemens Ag | Verfahren zum elektrischen Verbinden eines Kontaktfeldes eines Halbleiterchips mit zumindest einer Kontaktfläche sowie danach hergestellte Chipkarte |
WO1997044823A1 (de) * | 1996-05-17 | 1997-11-27 | Siemens Aktiengesellschaft | Trägerelement für einen halbleiterchip |
DE19635732A1 (de) * | 1996-09-03 | 1998-03-05 | Siemens Ag | Trägerelement für einen Halbleiterchip |
DE19840248A1 (de) * | 1998-09-03 | 2000-03-16 | Fraunhofer Ges Forschung | Schaltungschip mit spezifischer Anschlußflächenanordnung |
DE102005044001B3 (de) * | 2005-09-14 | 2007-04-12 | W.C. Heraeus Gmbh | Laminiertes Substrat für die Montage von elektronischen Bauteilen |
DE102009023405A1 (de) * | 2009-05-29 | 2010-12-02 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung tragbarer Datenträger |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD701864S1 (en) | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
US9647997B2 (en) | 2013-03-13 | 2017-05-09 | Nagrastar, Llc | USB interface for performing transport I/O |
USD758372S1 (en) * | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
USD759022S1 (en) | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
USD729808S1 (en) | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
US9888283B2 (en) | 2013-03-13 | 2018-02-06 | Nagrastar Llc | Systems and methods for performing transport I/O |
USD780763S1 (en) | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1534329A (fr) * | 1966-08-16 | 1968-07-26 | Signetics Corp | Procédé de montage de circuits intégrés |
US3649950A (en) * | 1970-01-27 | 1972-03-14 | Amp Inc | Post connector and assembly |
US3702464A (en) * | 1971-05-04 | 1972-11-07 | Ibm | Information card |
US3781596A (en) * | 1972-07-07 | 1973-12-25 | R Galli | Semiconductor chip carriers and strips thereof |
US3868724A (en) * | 1973-11-21 | 1975-02-25 | Fairchild Camera Instr Co | Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier |
DE2414297C3 (de) * | 1974-03-25 | 1980-01-17 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur teilautomatischen Herstellung von Zwischenträgern für Halbleiterbauelemente |
US4177519A (en) * | 1975-07-28 | 1979-12-04 | Sharp Kabushiki Kaisha | Electronic control assembly mounted on a flexible carrier and manufacture thereof |
FR2337381A1 (fr) * | 1975-12-31 | 1977-07-29 | Honeywell Bull Soc Ind | Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte |
US4064552A (en) * | 1976-02-03 | 1977-12-20 | Angelucci Thomas L | Multilayer flexible printed circuit tape |
JPS52124865A (en) * | 1976-04-13 | 1977-10-20 | Sharp Corp | Semiconductor device |
US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
JPS5376372A (en) * | 1976-12-17 | 1978-07-06 | Matsushita Electric Ind Co Ltd | Device for attaching chip circuit parts |
FR2382101A1 (fr) * | 1977-02-28 | 1978-09-22 | Labo Electronique Physique | Dispositif a semi-conducteur, comportant des pattes metalliques isolees |
US4246595A (en) * | 1977-03-08 | 1981-01-20 | Matsushita Electric Industrial Co., Ltd. | Electronics circuit device and method of making the same |
FR2439478A1 (fr) * | 1978-10-19 | 1980-05-16 | Cii Honeywell Bull | Boitier plat pour dispositifs a circuits integres |
DE3051195C2 (de) * | 1980-08-05 | 1997-08-28 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
DE3123198C2 (de) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
-
1981
- 1981-11-03 US US06/317,873 patent/US4549247A/en not_active Expired - Lifetime
- 1981-11-05 NL NLAANVRAGE8105002,A patent/NL189937C/nl not_active IP Right Cessation
- 1981-11-13 IT IT25059/81A patent/IT1139726B/it active
- 1981-11-16 CH CH7364/81A patent/CH661816A5/de not_active IP Right Cessation
- 1981-11-19 SE SE8106889A patent/SE457677B/sv not_active IP Right Cessation
- 1981-11-20 FR FR8121783A patent/FR2494908B1/fr not_active Expired
- 1981-11-23 GB GB8135224A patent/GB2088630B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
SE457677B (sv) | 1989-01-16 |
IT8125059A0 (it) | 1981-11-13 |
SE8106889L (sv) | 1982-05-22 |
FR2494908B1 (fr) | 1986-12-26 |
US4549247A (en) | 1985-10-22 |
CH661816A5 (de) | 1987-08-14 |
IT1139726B (it) | 1986-09-24 |
GB2088630A (en) | 1982-06-09 |
GB2088630B (en) | 1985-02-13 |
NL189937B (nl) | 1993-04-01 |
NL8105002A (nl) | 1982-06-16 |
FR2494908A1 (fr) | 1982-05-28 |
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Legal Events
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A85 | Still pending on 85-01-01 | ||
BA | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
V1 | Lapsed because of non-payment of the annual fee |
Effective date: 20000601 |