IT1118308B - Procedimento e dispositivo per il posizionamento e mantenimento in condizione spianata di un wafer semiconduttore nel corso di fabbricazione - Google Patents

Procedimento e dispositivo per il posizionamento e mantenimento in condizione spianata di un wafer semiconduttore nel corso di fabbricazione

Info

Publication number
IT1118308B
IT1118308B IT67112/79A IT6711279A IT1118308B IT 1118308 B IT1118308 B IT 1118308B IT 67112/79 A IT67112/79 A IT 67112/79A IT 6711279 A IT6711279 A IT 6711279A IT 1118308 B IT1118308 B IT 1118308B
Authority
IT
Italy
Prior art keywords
maintenance
positioning
procedure
semiconductive wafer
manufacturing course
Prior art date
Application number
IT67112/79A
Other languages
English (en)
Italian (it)
Other versions
IT7967112A0 (it
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/965,304 external-priority patent/US4213698A/en
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of IT7967112A0 publication Critical patent/IT7967112A0/it
Application granted granted Critical
Publication of IT1118308B publication Critical patent/IT1118308B/it

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
IT67112/79A 1978-01-23 1979-01-18 Procedimento e dispositivo per il posizionamento e mantenimento in condizione spianata di un wafer semiconduttore nel corso di fabbricazione IT1118308B (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87147778A 1978-01-23 1978-01-23
US05/965,304 US4213698A (en) 1978-12-01 1978-12-01 Apparatus and method for holding and planarizing thin workpieces

Publications (2)

Publication Number Publication Date
IT7967112A0 IT7967112A0 (it) 1979-01-18
IT1118308B true IT1118308B (it) 1986-02-24

Family

ID=27128208

Family Applications (1)

Application Number Title Priority Date Filing Date
IT67112/79A IT1118308B (it) 1978-01-23 1979-01-18 Procedimento e dispositivo per il posizionamento e mantenimento in condizione spianata di un wafer semiconduttore nel corso di fabbricazione

Country Status (7)

Country Link
JP (1) JPS6015147B2 (de)
DE (1) DE2901968A1 (de)
FR (1) FR2415368A1 (de)
GB (1) GB2016166B (de)
IT (1) IT1118308B (de)
NL (1) NL7900497A (de)
SE (1) SE444526B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754341A (ja) * 1980-09-19 1982-03-31 Hitachi Ltd Usuitahojisochi
US4433835A (en) * 1981-11-30 1984-02-28 Tencor Instruments Wafer chuck with wafer cleaning feature
JPS58153344A (ja) * 1982-03-05 1983-09-12 Hitachi Ltd リテ−ナ式ウエハチヤツク
JPS59106118A (ja) * 1982-12-10 1984-06-19 Hitachi Ltd 薄板変形装置
JPS6099538A (ja) * 1983-11-01 1985-06-03 横河・ヒュ−レット・パッカ−ド株式会社 ピンチヤツク
US4656791A (en) * 1984-09-27 1987-04-14 Libbey-Owens-Ford Company Abrasive fluid jet cutting support
DE3706735A1 (de) * 1986-03-03 1987-09-10 Canon Kk Vorrichtung zum einstellen des optischen systems einer kamera
US4903681A (en) * 1987-02-24 1990-02-27 Tokyo Seimitus Co., Ltd. Method and apparatus for cutting a cylindrical material
NL8701603A (nl) * 1987-07-08 1989-02-01 Philips & Du Pont Optical Vacuuminrichting voor het vastzuigen van werkstukken.
US6228438B1 (en) * 1999-08-10 2001-05-08 Unakis Balzers Aktiengesellschaft Plasma reactor for the treatment of large size substrates
JP2003142566A (ja) * 2001-11-07 2003-05-16 New Creation Co Ltd 真空吸着器及びその製造方法
DE20206490U1 (de) * 2002-04-24 2002-07-18 Schmalz J Gmbh Blocksauger
JP5810517B2 (ja) * 2010-12-02 2015-11-11 富士電機株式会社 吸着装置および吸着方法
DE102011001879A1 (de) 2011-04-07 2012-10-11 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zum Spannen verformter Wafer
JP6178683B2 (ja) * 2013-09-25 2017-08-09 芝浦メカトロニクス株式会社 吸着ステージ、貼合装置、および貼合方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB280154A (en) * 1926-11-02 1928-03-28 Wesel Mfg Company F Improvements in photo-engravers' printing frame
FR1517154A (fr) * 1967-03-02 1968-03-15 Elektromat Veb Procédé et dispositif pour le prélèvement de petits corps à surfaces adhérentes
DE1646147A1 (de) * 1967-05-13 1971-01-07 Telefunken Patent Vorrichtung zur Halterung einer Halbleiterscheibe bei der UEbertragung eines Musters durch Kontaktkopie oder durch Projektionsmaskierung
US3627338A (en) * 1969-10-09 1971-12-14 Sheldon Thompson Vacuum chuck
US3747282A (en) * 1971-11-29 1973-07-24 E Katzke Apparatus for polishing wafers

Also Published As

Publication number Publication date
NL7900497A (nl) 1979-07-25
SE444526B (sv) 1986-04-21
JPS54120585A (en) 1979-09-19
FR2415368B1 (de) 1984-05-04
JPS6015147B2 (ja) 1985-04-17
SE7900230L (sv) 1979-07-24
DE2901968C2 (de) 1988-08-11
GB2016166A (en) 1979-09-19
FR2415368A1 (fr) 1979-08-17
IT7967112A0 (it) 1979-01-18
DE2901968A1 (de) 1979-07-26
GB2016166B (en) 1982-06-09

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19960125