IN2012DN00433A - - Google Patents

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Publication number
IN2012DN00433A
IN2012DN00433A IN433DEN2012A IN2012DN00433A IN 2012DN00433 A IN2012DN00433 A IN 2012DN00433A IN 433DEN2012 A IN433DEN2012 A IN 433DEN2012A IN 2012DN00433 A IN2012DN00433 A IN 2012DN00433A
Authority
IN
India
Prior art keywords
joining partner
subject matter
joining
present subject
partner
Prior art date
Application number
Other languages
English (en)
Inventor
Philippe Jaeckle
Stefan Rysy
Michael Krapp
Svetislav Vukovic
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of IN2012DN00433A publication Critical patent/IN2012DN00433A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/26—Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
    • H01R4/2416—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
IN433DEN2012 2009-10-19 2010-10-04 IN2012DN00433A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009045806 2009-10-19
DE102009047043A DE102009047043A1 (de) 2009-10-19 2009-11-24 Lötfreie elektrische Verbindung
PCT/EP2010/064726 WO2011047953A1 (de) 2009-10-19 2010-10-04 Lötfreie elektrische verbindung

Publications (1)

Publication Number Publication Date
IN2012DN00433A true IN2012DN00433A (ko) 2015-05-15

Family

ID=43798723

Family Applications (1)

Application Number Title Priority Date Filing Date
IN433DEN2012 IN2012DN00433A (ko) 2009-10-19 2010-10-04

Country Status (7)

Country Link
US (1) US8932090B2 (ko)
EP (1) EP2491620A1 (ko)
JP (1) JP5599466B2 (ko)
CN (1) CN102668247B (ko)
DE (1) DE102009047043A1 (ko)
IN (1) IN2012DN00433A (ko)
WO (1) WO2011047953A1 (ko)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011077915A1 (de) * 2011-06-21 2012-12-27 Robert Bosch Gmbh Einpresspin für eine elektrische Einpressverbindung zwischen einer elektronischen Komponente und einer Substratplatte
KR20130007124A (ko) * 2011-06-29 2013-01-18 삼성전자주식회사 유기 보호막을 갖는 조인트 구조
US20140165389A1 (en) * 2012-12-14 2014-06-19 Byung Tai Do Integrated circuit packaging system with routable grid array lead frame
DE102013209407B4 (de) 2013-05-22 2023-08-31 Robert Bosch Gmbh Verfahren zur lötfreien elektrischen Einpresskontaktierung von elektrisch leitfähigen Einpress-Stiften in Leiterplatten
US8974245B2 (en) 2013-08-05 2015-03-10 Hubbell Incorporated Grounding electrical connector
FR3011691B1 (fr) * 2013-10-04 2017-05-12 Axon Cable Sa Procede de fabrication de contact electrique, et contact electrique correspondant
KR102143890B1 (ko) 2013-10-15 2020-08-12 온세미컨덕터코리아 주식회사 파워 모듈 패키지 및 이의 제조 방법
DE102014200212A1 (de) 2014-01-09 2015-01-15 Ifm Electronic Gmbh Lötfreie elektrische Verbindung und Messgerät mit einer solchen Verbindung
CN104918417A (zh) * 2015-05-15 2015-09-16 江门崇达电路技术有限公司 一种在线路板表面制作有机保焊膜的方法
DE102015119785B4 (de) 2015-11-04 2020-03-26 ept Holding GmbH & Co. KG Lochkontur für Einpresstechnik in ein Stanzgitter
DE202015008773U1 (de) 2015-12-22 2016-01-28 Continental Automotive Gmbh Steckkontakt mit organischer Beschichtung und Leiterplattenanordnung
JP6711262B2 (ja) * 2016-12-26 2020-06-17 株式会社デンソー 電子装置
JP2018181735A (ja) * 2017-04-19 2018-11-15 株式会社デンソー プレスフィット端子、電子装置、及びコネクタ
US11183779B2 (en) 2017-07-12 2021-11-23 ept Holding GmbH & Co. KG Press-in pin and method for producing same
DE102017116936B4 (de) * 2017-07-26 2024-10-02 Ledvance Gmbh Verbindung eines elektrischen Leitelements mit einer Leiterplatte eines Leuchtmittels
DE102018109059B4 (de) 2018-01-15 2020-07-23 Doduco Solutions Gmbh Elektrischer Einpress-Kontaktstift
EP3544121B1 (en) * 2018-03-19 2022-05-04 Mahle International GmbH Electrical heating device
DE102018220773A1 (de) * 2018-12-03 2020-06-04 Robert Bosch Gmbh Kontaktelement
DE102019116257A1 (de) * 2019-06-14 2020-12-17 Nidec Gpm Gmbh Anschlusselement für eine Wicklung eines Stators an einer Leiterplatte mit wenigstens zwei Schneidklemm-Kontakten
US10756009B1 (en) * 2019-09-18 2020-08-25 International Business Machines Corporation Efficient placement of grid array components
DE102023109377A1 (de) 2023-04-13 2024-10-17 ept Holding GmbH & Co. KG Einpressstift und Verfahren zur Messung der Schichtdicken eines Einpressstiftes

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Also Published As

Publication number Publication date
DE102009047043A1 (de) 2011-04-21
EP2491620A1 (de) 2012-08-29
JP5599466B2 (ja) 2014-10-01
US20120270432A1 (en) 2012-10-25
US8932090B2 (en) 2015-01-13
JP2013508902A (ja) 2013-03-07
CN102668247B (zh) 2015-06-10
CN102668247A (zh) 2012-09-12
WO2011047953A1 (de) 2011-04-28

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