IL91239A - Manufacture of thin-film integrated circuits resistant to damage during flexion - Google Patents

Manufacture of thin-film integrated circuits resistant to damage during flexion

Info

Publication number
IL91239A
IL91239A IL91239A IL9123989A IL91239A IL 91239 A IL91239 A IL 91239A IL 91239 A IL91239 A IL 91239A IL 9123989 A IL9123989 A IL 9123989A IL 91239 A IL91239 A IL 91239A
Authority
IL
Israel
Prior art keywords
manufacture
thin
integrated circuits
damage during
film integrated
Prior art date
Application number
IL91239A
Other languages
English (en)
Other versions
IL91239A0 (en
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22902497&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=IL91239(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of IL91239A0 publication Critical patent/IL91239A0/xx
Publication of IL91239A publication Critical patent/IL91239A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169—Thin semiconductor films on metallic or insulating substrates
    • H10F77/1692—Thin semiconductor films on metallic or insulating substrates the films including only Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H10F19/804—Materials of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169—Thin semiconductor films on metallic or insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/95—Circuit arrangements
    • H10F77/953—Circuit arrangements for devices having potential barriers
    • H10F77/955—Circuit arrangements for devices having potential barriers for photovoltaic devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/938—Lattice strain control or utilization
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
IL91239A 1988-09-01 1989-08-07 Manufacture of thin-film integrated circuits resistant to damage during flexion IL91239A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/239,513 US4888061A (en) 1988-09-01 1988-09-01 Thin-film solar cells resistant to damage during flexion

Publications (2)

Publication Number Publication Date
IL91239A0 IL91239A0 (en) 1990-03-19
IL91239A true IL91239A (en) 1992-11-15

Family

ID=22902497

Family Applications (1)

Application Number Title Priority Date Filing Date
IL91239A IL91239A (en) 1988-09-01 1989-08-07 Manufacture of thin-film integrated circuits resistant to damage during flexion

Country Status (9)

Country Link
US (1) US4888061A (de)
EP (1) EP0366236B1 (de)
JP (1) JPH02113584A (de)
KR (1) KR900005631A (de)
AU (1) AU614166B2 (de)
BR (1) BR8904385A (de)
DE (1) DE68909734T2 (de)
IL (1) IL91239A (de)
MY (1) MY104172A (de)

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DE69024304T2 (de) * 1989-09-06 1996-07-18 Sanyo Electric Co Herstellungsverfahren für eine biegsame photovoltaische Vorrichtung
US5273608A (en) * 1990-11-29 1993-12-28 United Solar Systems Corporation Method of encapsulating a photovoltaic device
US5400986A (en) * 1993-02-08 1995-03-28 Martin Marietta Corporation Optical solar reflector and mounting method
JP3099604B2 (ja) * 1993-09-28 2000-10-16 富士電機株式会社 可撓性光電変換モジュール、その接続方法およびその製造装置
US5498297A (en) * 1994-09-15 1996-03-12 Entech, Inc. Photovoltaic receiver
US5674325A (en) * 1995-06-07 1997-10-07 Photon Energy, Inc. Thin film photovoltaic device and process of manufacture
JP3679478B2 (ja) * 1995-11-29 2005-08-03 三洋電機株式会社 折曲できるフィルム状の太陽電池素子
US5782993A (en) * 1996-06-28 1998-07-21 Ponewash; Jackie Photovoltaic cells having micro-embossed optical enhancing structures
US6114046A (en) * 1997-07-24 2000-09-05 Evergreen Solar, Inc. Encapsulant material for solar cell module and laminated glass applications
US6187448B1 (en) 1997-07-24 2001-02-13 Evergreen Solar, Inc. Encapsulant material for solar cell module and laminated glass applications
US6255599B1 (en) * 1997-08-18 2001-07-03 Ibm Relocating the neutral plane in a PBGA substrate to eliminate chip crack and interfacial delamination
US6353182B1 (en) * 1997-08-18 2002-03-05 International Business Machines Corporation Proper choice of the encapsulant volumetric CTE for different PGBA substrates
US6224016B1 (en) * 1997-12-19 2001-05-01 Sky Station International, Inc. Integrated flexible solar cell material and method of production
US8664030B2 (en) 1999-03-30 2014-03-04 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US6818291B2 (en) * 2002-08-17 2004-11-16 3M Innovative Properties Company Durable transparent EMI shielding film
DE10259472B4 (de) * 2002-12-19 2006-04-20 Solarion Gmbh Flexible Dünnschichtsolarzelle mit flexibler Schutzschicht
DE10305938A1 (de) * 2003-02-12 2004-09-02 Solarion Gmbh Flexible Dünnschichtsolarzelle
JP2005284663A (ja) * 2004-03-29 2005-10-13 Advanced Telecommunication Research Institute International 演算要素タイル、演算装置及び演算装置の製造方法
WO2007117698A2 (en) 2006-04-07 2007-10-18 Qd Vision, Inc. Composition including material, methods of depositing material, articles including same and systems for depositing material
US8729385B2 (en) 2006-04-13 2014-05-20 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US8884155B2 (en) 2006-04-13 2014-11-11 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US9006563B2 (en) 2006-04-13 2015-04-14 Solannex, Inc. Collector grid and interconnect structures for photovoltaic arrays and modules
US8822810B2 (en) 2006-04-13 2014-09-02 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US9236512B2 (en) 2006-04-13 2016-01-12 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US9865758B2 (en) 2006-04-13 2018-01-09 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
CN102208469B (zh) * 2007-04-24 2015-04-29 三菱电机株式会社 太阳能电池模块
WO2008136095A1 (ja) * 2007-04-24 2008-11-13 Mitsubishi Electric Corporation 太陽電池モジュール
US9434642B2 (en) 2007-05-21 2016-09-06 Corning Incorporated Mechanically flexible and durable substrates
DE102007036715B4 (de) 2007-08-05 2011-02-24 Solarion Ag Verfahren und Vorrichtung zur Herstellung flexibler Dünnschichtsolarzellen
WO2009099425A2 (en) * 2008-02-07 2009-08-13 Qd Vision, Inc. Flexible devices including semiconductor nanocrystals, arrays, and methods
EP2253022B1 (de) * 2008-03-03 2012-12-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Solarmodul mit erhöhter Biegesteifigkeit
GB0902491D0 (en) * 2009-02-14 2009-04-01 London Bicycle Company Ltd Bicycle security device and related system
EP2494124A4 (de) * 2009-10-30 2014-05-21 Building Materials Invest Corp Flexible sonarwärmetafel mit einem mehrschichtigen film
US8759664B2 (en) 2009-12-28 2014-06-24 Hanergy Hi-Tech Power (Hk) Limited Thin film solar cell strings
US8394650B2 (en) * 2010-06-08 2013-03-12 Amerasia International Technology, Inc. Solar cell interconnection, module and panel method
US20130000689A1 (en) * 2011-07-01 2013-01-03 Miasolé Photovoltaic module support assembly with standoff clamps
WO2013086406A1 (en) * 2011-12-09 2013-06-13 Brady Patrick K System and method for converting electromagnetic radiation to electrical energy
WO2013158796A1 (en) 2012-04-17 2013-10-24 Global Solar Energy, Inc. Integrated thin film solar cell interconnection
WO2014099822A2 (en) 2012-12-17 2014-06-26 Brady Patrick K System and method for identifying materials using a thz spectral fingerprint in a media with high water content
EP2994939A4 (de) 2013-02-22 2017-02-15 Patrick K. Brady Strukturen, system und verfahren zur umwandlung elektromagnetischer strahlung in elektrische energie
KR20170031148A (ko) 2014-06-20 2017-03-20 패트릭 케이. 브래디 메타물질을 사용하여 전자기 방사선을 전기적 에너지로 변환하기 위한 시스템
JP2018125505A (ja) * 2017-02-03 2018-08-09 国立研究開発法人理化学研究所 半導体デバイス
JP6904795B2 (ja) * 2017-06-09 2021-07-21 トヨタ自動車株式会社 太陽電池モジュール及びその製造方法
JP6959130B2 (ja) * 2017-12-20 2021-11-02 トヨタ自動車株式会社 太陽電池モジュール

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Also Published As

Publication number Publication date
BR8904385A (pt) 1990-04-17
MY104172A (en) 1994-02-28
AU614166B2 (en) 1991-08-22
DE68909734D1 (de) 1993-11-11
IL91239A0 (en) 1990-03-19
KR900005631A (ko) 1990-04-14
JPH02113584A (ja) 1990-04-25
EP0366236A3 (en) 1990-11-07
EP0366236B1 (de) 1993-10-06
DE68909734T2 (de) 1994-04-28
US4888061A (en) 1989-12-19
AU3915689A (en) 1990-03-08
EP0366236A2 (de) 1990-05-02

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