GB8726401D0 - Fabrication of electrical circuits - Google Patents

Fabrication of electrical circuits

Info

Publication number
GB8726401D0
GB8726401D0 GB878726401A GB8726401A GB8726401D0 GB 8726401 D0 GB8726401 D0 GB 8726401D0 GB 878726401 A GB878726401 A GB 878726401A GB 8726401 A GB8726401 A GB 8726401A GB 8726401 D0 GB8726401 D0 GB 8726401D0
Authority
GB
United Kingdom
Prior art keywords
fabrication
electrical circuits
circuits
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB878726401A
Other versions
GB2212332A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co PLC
Original Assignee
General Electric Co PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co PLC filed Critical General Electric Co PLC
Priority to GB8726401A priority Critical patent/GB2212332A/en
Publication of GB8726401D0 publication Critical patent/GB8726401D0/en
Publication of GB2212332A publication Critical patent/GB2212332A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
GB8726401A 1987-11-11 1987-11-11 Fabrication of electrical circuits Withdrawn GB2212332A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8726401A GB2212332A (en) 1987-11-11 1987-11-11 Fabrication of electrical circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8726401A GB2212332A (en) 1987-11-11 1987-11-11 Fabrication of electrical circuits

Publications (2)

Publication Number Publication Date
GB8726401D0 true GB8726401D0 (en) 1987-12-16
GB2212332A GB2212332A (en) 1989-07-19

Family

ID=10626776

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8726401A Withdrawn GB2212332A (en) 1987-11-11 1987-11-11 Fabrication of electrical circuits

Country Status (1)

Country Link
GB (1) GB2212332A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5410806A (en) * 1993-09-15 1995-05-02 Lsi Logic Corporation Method for fabricating conductive epoxy grid array semiconductors packages
US5434107A (en) * 1994-01-28 1995-07-18 Texas Instruments Incorporated Method for planarization
DE19955538B4 (en) * 1999-11-18 2014-06-05 Morpho Cards Gmbh Printed conductor carrier layer for lamination into a chip card, method for producing a conductor carrier layer Injection molding tool for carrying out the method for producing a conductor carrier layer
DE10000090A1 (en) * 2000-01-04 2001-08-30 Elfo Ag Sachseln Sachseln Electrical connecting element production method has embossed substrate provided with selectively etched conductive galvanic coating
FR2820548A1 (en) * 2001-02-02 2002-08-09 Schlumberger Systems & Service PORTABLE CHIP AND ANTENNA OBJECT, MODULE FOR FORMING PORTABLE CHIP AND ANTENNA OBJECT AND METHODS OF MAKING SAME
DE10148525B4 (en) * 2001-10-01 2017-06-01 Morpho Cards Gmbh Chip card and a method for producing such a chip card
US7371975B2 (en) 2002-12-18 2008-05-13 Intel Corporation Electronic packages and components thereof formed by substrate-imprinting
US7637008B2 (en) 2002-12-18 2009-12-29 Intel Corporation Methods for manufacturing imprinted substrates

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2249878A1 (en) * 1972-10-11 1974-04-18 Siemens Ag METHOD FOR MANUFACTURING FINE CONDUCTOR TRACK STRUCTURES ON A CERAMIC SUBSTRATE
GB2033667A (en) * 1978-11-06 1980-05-21 Powers C D Improvements in circuit boards
DE3014041C2 (en) * 1980-04-11 1982-04-08 Braun Ag, 6000 Frankfurt Method for applying electrically conductive tracks to a carrier made of insulating material
EP0051378A2 (en) * 1980-11-03 1982-05-12 AMP INCORPORATED (a New Jersey corporation) Circuit board having cast circuitry and method of manufacture
GB2109640B (en) * 1981-10-02 1985-06-19 Marconi Co Ltd Waveguide construction
GB2124037B (en) * 1982-07-19 1986-02-26 Gen Electric Co Plc Methods of forming patterns on substrates
US4546065A (en) * 1983-08-08 1985-10-08 International Business Machines Corporation Process for forming a pattern of metallurgy on the top of a ceramic substrate
WO1985001231A1 (en) * 1983-09-21 1985-03-28 Allied Corporation Method of making a printed circuit board
US4581098A (en) * 1984-10-19 1986-04-08 International Business Machines Corporation MLC green sheet process

Also Published As

Publication number Publication date
GB2212332A (en) 1989-07-19

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)